SCHEMBL43273

SCHEMBL43273

NCC(N)CCC(N)N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL653873 0.89 ALDH1A1 (0.40)
SCHEMBL22144394 0.81
SCHEMBL28394915 0.80 ENPEP (0.33)
SCHEMBL11426345 0.76
SCHEMBL3400691 0.76
SCHEMBL9111058 0.74 ENPEP (0.38)
SCHEMBL11810443 0.74 ENPEP (0.38)
SCHEMBL181418 0.74
SCHEMBL20758116 0.73
SCHEMBL20833191 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 468 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3848417-B1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2025-01-08 EP claimed
EP-3848417-A1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2021-07-14 EP claimed
EP-2504396-B1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2021-02-24 EP claimed
EP-2714807-B1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2019-01-02 EP claimed
US-9631292-B2 Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features BASF SE (DE) 2017-04-25 US claimed
US-9598540-B2 Composition for metal electroplating comprising leveling agent BASF SE (DE) 2017-03-21 US claimed
US-20140097092-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2014-04-10 US claimed
WO-2012164509-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2012-12-06 WO claimed
EP-2530102-A1 Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias BASF SE (DE) 2012-12-05 EP claimed
US-20120292193-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2012-11-22 US claimed
EP-2504396-A2 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2012-10-03 EP claimed
WO-2011064154-A2 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2011-06-03 WO claimed
US-20100291301-A1 JOINTING COMPOSITION AND METHOD EXCEL POLYMERS LLC (US) 2010-11-18 US claimed
US-5641855-A Water-soluble condensation products of amino-containing compounds and crosslinkers, preparation thereof and use thereof BASF AKTIENGESELLSCHAFT (DE) 1997-06-24 US claimed
JP-6228483-A None JP disclosed
EP-4733351-A1 FLAME-RETARDANT POLYAMIDE MOULDING COMPOSITIONS EMS-CHEMIE AG (CH) 2026-04-29 EP disclosed
EP-3670577-B1 POLYAMIDE MOULDING MATERIAL FOR GLASS COMPOSITIONS EMS CHEMIE AG (CH) 2026-04-15 EP disclosed
EP-0061169-A1 Method for the elimination of anionic substances from water BASF Aktiengesellschaft (DE) 1982-09-29 EP disclosed
EP-0061173-A1 Process for dyeing paper BASF Aktiengesellschaft (DE) 1982-09-29 EP disclosed
US-4184019-A CATIONIC POLYMERS ROHM AND HAAS COMPANY (US) 1980-01-15 US disclosed