SCHEMBL43275

SCHEMBL43275

CCC(N)(N)C(N)CN

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL464798 0.79
SCHEMBL28218295 0.78 FDPS (0.36)
SCHEMBL8077479 0.77 ALDH1A1 (0.35)
SCHEMBL841737 0.74 DNM1 (0.31)
SCHEMBL28057895 0.72 ALDH1A1 (0.41)
SCHEMBL29173695 0.72 ALDH1A1 (0.32)
SCHEMBL28218307 0.71
SCHEMBL4275939 0.71
SCHEMBL4279359 0.70 ALDH1A1 (0.30)
SCHEMBL7637739 0.69

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 318 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3848417-B1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2025-01-08 EP claimed
EP-3848417-A1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2021-07-14 EP claimed
EP-2504396-B1 COMPOSITION FOR COPPER ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2021-02-24 EP claimed
EP-2714807-B1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2019-01-02 EP claimed
US-9631292-B2 Composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias and interconnect features BASF SE (DE) 2017-04-25 US claimed
US-9598540-B2 Composition for metal electroplating comprising leveling agent BASF SE (DE) 2017-03-21 US claimed
US-20140097092-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2014-04-10 US claimed
WO-2012164509-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING AN ADDITIVE FOR BOTTOM-UP FILLING OF THOUGH SILICON VIAS AND INTERCONNECT FEATURES BASF SE (DE) 2012-12-06 WO claimed
EP-2530102-A1 Additive and composition for metal electroplating comprising an additive for bottom-up filling of though silicon vias BASF SE (DE) 2012-12-05 EP claimed
US-20120292193-A1 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2012-11-22 US claimed
EP-2504396-A2 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2012-10-03 EP claimed
WO-2011064154-A2 COMPOSITION FOR METAL ELECTROPLATING COMPRISING LEVELING AGENT BASF SE (DE) 2011-06-03 WO claimed
US-20100291301-A1 JOINTING COMPOSITION AND METHOD EXCEL POLYMERS LLC (US) 2010-11-18 US claimed
US-5641855-A Water-soluble condensation products of amino-containing compounds and crosslinkers, preparation thereof and use thereof BASF AKTIENGESELLSCHAFT (DE) 1997-06-24 US claimed
US-4473700-A DISPERSANT FOR LUBRICANTS TEXACO INC. (US) 1984-09-25 US claimed
JP-6228483-A None JP disclosed
US-20260109858-A1 FLAME-RETARDANT POLYAMIDE MOLDING COMPOUNDS EMS-CHEMIE AG (CH) 2026-04-23 US disclosed
US-4383834-A IN THE PRESENCE OF A WATER SOLUBLE CATIONIC POLYELECTROLYTE BASF AKTIENGESELLSCHAFT (DE) 1983-05-17 US disclosed
US-4371674-A CHLORINE TERMINATED POLYETHERS BASF AKTIENGESELLSCHAFT (DE) 1983-02-01 US disclosed
US-4184019-A CATIONIC POLYMERS ROHM AND HAAS COMPANY (US) 1980-01-15 US disclosed