SCHEMBL4329985

SCHEMBL4329985

Cc1cc(N)ccc1Oc1ccc(N)cc1C

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 9/20 0.56
PDE10A Q9Y233 1/20 0.50
KDM4E B2RXH2 6/20 0.48
MAPT P10636 6/20 0.48
LMNA P02545 3/20 0.48
MEN1 O00255 3/20 0.48
KMT2A Q03164 3/20 0.48
THRB P10828 2/20 0.48
ALOX15 P16050 1/20 0.48
CASP1 P29466 4/20 0.48
CYP3A4 P08684 1/20 0.44
TSHR P16473 1/20 0.44
SMN1; SMN2 Q16637 2/20 0.43
L3MBTL1 Q9Y468 1/20 0.43
NR4A1 P22736 2/20 0.42
USP2 O75604 2/20 0.41
GAA P10253 4/20 0.39
PTK2B Q14289 1/20 0.39
TP53 P04637 1/20 0.39
POLB P06746 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30473086 1.00 ALDH1A1 (0.56) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL29549546 0.91 ALDH1A1 (0.48) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL25968197 0.91 ALDH1A1 (0.48) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL5552568 0.89 SMN1; SMN2 (0.47) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL2992329 0.89 ALDH1A1 (0.52) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL29764012 0.89 ALDH1A1 (0.50) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL23850 0.89 ALDH1A1 (0.50) ALDH1A1PDE10AKDM4EMAPTLMNA
SCHEMBL31457276 0.87 ALDH1A1 (0.55) ALDH1A1PDE10AMAPTMEN1KMT2A
SCHEMBL1155719 0.87 ALDH1A1 (0.55) ALDH1A1PDE10AMAPTMEN1KMT2A
SCHEMBL3003478 0.87 ALDH1A1 (0.55) ALDH1A1PDE10AKDM4EMAPTLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7605222-B2 Gel permeation chromatography; isomeric bis(phthalimide) and bisphenol-a structural units SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-10-20 US claimed
US-20070043203-A1 Gel permeation chromatography; isomeric bis(phthalimide) and bisphenol-a structural units GENERAL ELECTRIC COMPANY (US) 2007-02-22 US claimed
US-20230229080-A1 PHOTOSENSITIVE COMPOSITION AND FILM PREPARED FROM THE SAME INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (TW) 2023-07-20 US disclosed
US-11111345-B2 Prepreg and carbon fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2021-09-07 US disclosed
US-20170327657-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2017-11-16 US disclosed
US-9765194-B2 Prepreg and carbon fiber-reinforced composite material TORAY INDUSTRIES, INC. (JP) 2017-09-19 US disclosed
EP-2878617-B1 PREPREG AND CARBON-FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES (JP) 2017-03-01 EP disclosed
US-20150210813-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY INDUSTRIES, INC. (JP) 2015-07-30 US disclosed
EP-2878617-A1 PREPREG AND CARBON-FIBER-REINFORCED COMPOSITE MATERIAL Toray Industries, Inc. (JP) 2015-06-03 EP disclosed
US-7605222-B2 Gel permeation chromatography; isomeric bis(phthalimide) and bisphenol-a structural units SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2009-10-20 US disclosed
WO-2009045537-A1 POLY(ARYLETHERIMIDES) FOR NEGATIVE BIREFRINGENT FILMS FOR LCDS AKRON POLYMER SYSTEMS (US) 2009-04-09 WO disclosed
US-6051722-A PRECURSOR FOR POLYIMIDE COPOLYMER; USABLE IN OPTICAL LONG-DISTANCE COMMUNICATION, SIGNAL PROCESSING, PHOTOELECTRIC HYBRID CIRCUITS AND OPTICAL COMPUTERS HITACHI CHEMICAL COMPANY, LTD. (JP) 2000-04-18 US disclosed
EP-0902014-A1 PROCESS FOR PRODUCING ARYL CARBAMATES UBE INDUSTRIES LIMITED (JP) 1999-03-17 EP disclosed
EP-0618269-B1 Thermosetting resin compositions and their use for making resin articles and thin film wiring boards HITACHI LTD (JP) 1998-11-11 EP disclosed
US-5686191-A POLYIMIDE ADHESIVE, ELASTICITY HITACHI, LTD. (JP) 1997-11-11 US disclosed
EP-0755979-A2 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1997-01-29 EP disclosed
EP-0618269-A1 Thermosetting resin compositions and their use for thin film wiring boards HITACHI, LTD. (JP) 1994-10-05 EP disclosed
US-5112942-A Copolymers, aromatic diamine with alkyl substituents and phenoxy substituted aromatic diamine, resistance to stess cracking ETHYL CORPORATION (US) 1992-05-12 US disclosed
US-4663484-A Diaminoalkyldiphenyl ethers, a process for their preparation and their use BAYER AKTIENGESELLSCHAFT (DE) 1987-05-05 US disclosed
EP-0184751-A2 Diaminoalkyldiphenyl ethers, process for their preparation and their use BAYER AG (DE) 1986-06-18 EP disclosed