SCHEMBL433052

SCHEMBL433052

Nc1cccc(Sc2ccccc2)c1N

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
DHFR P00374 1/20 0.46
SIRT1 Q96EB6 1/20 0.46
MAPT P10636 4/20 0.44
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
NPSR1 Q6W5P4 1/20 0.44
APOBEC3G Q9HC16 1/20 0.44
KDM4E B2RXH2 2/20 0.44
NSD2 O96028 1/20 0.44
MAPK1 P28482 1/20 0.44
HPGD P15428 2/20 0.42
CYP2C9 P11712 2/20 0.42
CYP2C19 P33261 2/20 0.42
ADORA2A P29274 1/20 0.42
POLB P06746 1/20 0.41
ALDH1A1 P00352 1/20 0.41
TYMS P04818 2/20 0.40
EGFR P00533 1/20 0.40
PDGFRB P09619 1/20 0.40
KDR P35968 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3790383 0.84 ALDH1A1 (0.48) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL29613097 0.84 MAPT (0.56) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL11546 0.84 MAPT (0.56) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL2426196 0.84 MEN1 (0.48) MAPTMEN1KMT2ANPSR1APOBEC3G
SCHEMBL11347069 0.82 MEN1 (0.54) MAPTMEN1KMT2ANPSR1APOBEC3G
Hydrochloric Acid SCHEMBL5211034 0.82 MAPT (0.54) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL34535 0.81 MAPT (0.54) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL3791972 0.79 DHFR (0.44) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL17847477 0.79 MAPT (0.46) DHFRSIRT1MAPTMEN1KMT2A
SCHEMBL3793221 0.78 MAPT (0.49) DHFRSIRT1MAPTKDM4ENSD2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 2301 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024120097-A1 POLYIMIDE ELECTROPHORETIC COATING, PREPARATION METHOD THEREFOR, AND APPLICATION THEREOF 合肥汉之和新材料科技有限公司 2024-06-13 WO claimed
CN-118146713-A Polyimide electrophoretic paint, preparation method and application thereof 合肥汉之和新材料科技有限公司 2024-06-07 CN claimed
CN-117186403-B Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2024-04-02 CN claimed
CN-117757072-A Modified maleimide prepolymer, resin composition and application thereof 苏州生益科技有限公司 2024-03-26 CN claimed
CN-117736579-A Preparation method and application of resin composition 常熟生益科技有限公司 2024-03-22 CN claimed
CN-117332617-B Method for inhibiting movement of metal particles in bus air chamber of gas insulated switchgear 国网天津市电力公司电力科学研究院 2024-03-19 CN claimed
CN-114524938-B Polymer, photosensitive resin composition, cured film prepared from polymer and photosensitive resin composition, and electronic element 江苏三月科技股份有限公司 2024-02-09 CN claimed
CN-117332617-A Method for inhibiting movement of metal particles in bus air chamber of gas insulated switchgear 国网天津市电力公司电力科学研究院 2024-01-02 CN claimed
CN-117186403-A Negative photosensitive resin, resin composition, and preparation method and application thereof 明士(北京)新材料开发有限公司 2023-12-08 CN claimed
CN-116970169-A Amine compound modified maleimide prepolymer, resin composition and application thereof 苏州生益科技有限公司 2023-10-31 CN claimed
EP-0105666-A1 Method of hydrophilizing or hydrophobizing polymers MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1984-04-18 EP claimed
EP-0007632-B1 AROMATIC POLYAMIDE COMPOSITION TEIJIN LIMITED (JP) 1983-03-16 EP claimed
EP-0010406-B1 POLYIMIDE FIBERS AND A METHOD FOR THEIR PREPARATION I M L CORPORATION (US) 1983-03-02 EP claimed
EP-0007631-B1 WHOLLY AROMATIC POLYAMIDE COMPOSITION AND FILAMENTS OR FIBRES THEREOF TEIJIN LIMITED (JP) 1983-03-02 EP claimed
US-4278779-A BLEND OF POLYPHENYLENE ISOPHTHALAMIDE AND ANOTHER POLYAMIDE BASED ON A XYLYLENEDIAMINE NAKAGAWA YASUO 1981-07-14 US claimed
US-4245066-A HEAT RESISTANT FIBERS TEIJIN LIMITED (JP) 1981-01-13 US claimed
EP-0007631-A1 Wholly aromatic polyamide composition and filaments or fibres thereof TEIJIN LIMITED (JP) 1980-02-06 EP claimed
EP-0007632-A1 Aromatic polyamide composition TEIJIN LIMITED (JP) 1980-02-06 EP claimed
US-4170684-A ENAMEL LACQUERS FOR WIRES DR. BECK & CO. A.G. (DE) 1979-10-09 US claimed
US-4145334-A POLYESTER IMIDE RESINS DR. BECK & CO., A.G. (DE) 1979-03-20 US claimed