SCHEMBL4331948

SCHEMBL4331948

COCC1(COC)C=CC(c2ccccc2)=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9220724 0.83
SCHEMBL9007112 0.81 KDM1A (0.33)
SCHEMBL3684573 0.80 LMNA (0.34)
SCHEMBL31549868 0.79 MMP2 (0.34)
SCHEMBL31424582 0.78 SLC6A2 (0.38)
SCHEMBL20337296 0.78
SCHEMBL2783528 0.78
SCHEMBL28305153 0.78
SCHEMBL21043747 0.78 PSEN1 (0.33)
SCHEMBL18423613 0.76 MEN1 (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260005022-A1 SPIN ON CARBON HARDMASK COMPOSITIONS WITH LOW EVAPORATION LOSS AND PATTERNING METHOD BY USING THE SAME YCCHEM CO LTD (KR) 2026-01-01 US disclosed
EP-4343435-A1 SPIN-ON CARBON HARD MASK COMPOSITION HAVING LOW EVAPORATION LOSS, AND PATTERNING METHOD USING SAME Ycchem Co., Ltd. (KR) 2024-03-27 EP disclosed
CN-117321503-A Spin-on carbon hardmask composition with low evaporation loss and patterning method using the same YC化学制品株式会社 2023-12-29 CN disclosed
CN-115398339-A Photosensitive resin composition, method for producing patterned cured film, and semiconductor device 昭和电工材料株式会社 2022-11-25 CN disclosed
WO-2022245014-A1 SPIN-ON CARBON HARD MASK COMPOSITION HAVING LOW EVAPORATION LOSS, AND PATTERNING METHOD USING SAME 영창케미칼 주식회사 2022-11-24 WO disclosed
US-20090012203-A1 Epoxy Resin and Epoxy Resin Composition NIPPON KAYAKU KABUSHIKI KAISHA (JP) 2009-01-08 US disclosed