SCHEMBL4348772

SCHEMBL4348772

CCCCC(CC)CC(CCCC)(OOC(C)(C)C)C(=O)O

nearest known ligand 0.38

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 4/20 0.38
TSHR P16473 2/20 0.38
TDP1 Q9NUW8 2/20 0.38
ATM Q13315 1/20 0.38
CA2 P00918 8/20 0.38
MAPK1 P28482 1/20 0.38
ALDH1A1 P00352 4/20 0.36
CA1 P00915 3/20 0.35
CTSK P43235 2/20 0.35
L3MBTL1 Q9Y468 1/20 0.34
LMNA P02545 1/20 0.33
HSD17B10 Q99714 1/20 0.33
CTSS P25774 1/20 0.33
RECQL P46063 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6432620 0.87 CYP3A4 (0.35) CYP3A4TSHRTDP1ATMCA2
SCHEMBL15544045 0.81 CTSK (0.33) TSHRTDP1CA2MAPK1ALDH1A1
2-Ethylhexanoic Acid SCHEMBL29570436 0.79 CA2 (0.56) TDP1CA2MAPK1ALDH1A1CA1
SCHEMBL10604303 0.78 CTSK (0.32) TDP1CA2MAPK1CTSKL3MBTL1
SCHEMBL7704713 0.78 CTSK (0.32) TDP1CA2MAPK1ALDH1A1CTSK
SCHEMBL49150 0.78 CTSK (0.32) TDP1CA2MAPK1CTSKL3MBTL1
Ethane SCHEMBL29127622 0.77 CTSK (0.31) ALDH1A1CTSKL3MBTL1CTSS
SCHEMBL8572596 0.77 CES2 (0.38) TSHRTDP1ALDH1A1HSD17B10
SCHEMBL27643322 0.77 CTSK (0.31) CTSKCTSS
SCHEMBL28048771 0.75 CA2 (0.44) CYP3A4TSHRTDP1ATMCA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2024038771-A1 WATER REPELLENT COMPOSITION AND FIBER TREATMENT AGENT 信越化学工業株式会社 2024-02-22 WO disclosed
US-20090278284-A1 PROCESS FOR MAKING A DIP-FORMING COMPOSITION AND A DIP-FORMED ARTICLE KODAMA KAZUMI 2009-11-12 US disclosed
US-20080051498-A1 Dip-Forming Composition and Dip-Formed Article ZEON CORPORATION (JP) 2008-02-28 US disclosed
EP-1826236-A1 COMPOSITION FOR DIP FORMING AND DIP-FORMED MOLDING ZEON CORPORATION (JP) 2007-08-29 EP disclosed
EP-0488019-B1 Expansible styrene polymers with high expansibility BASF AG (DE) 1996-03-13 EP disclosed
US-5155190-A Suspension polymerization, excellent heat resistance, weatherproofing and transparency HITACHI CHEMICAL COMPANY (JP) 1992-10-13 US disclosed
EP-0489305-A2 Oil resistant expandable styrene polymerisates BASF Aktiengesellschaft (DE) 1992-06-10 EP disclosed
EP-0488019-A2 Expansible styrene polymers with high expansibility BASF Aktiengesellschaft (DE) 1992-06-03 EP disclosed