SCHEMBL4349404

SCHEMBL4349404

Nc1c(CC(=O)O)cnn1Cc1ccccc1

nearest known ligand 0.59

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.59
TSHR P16473 2/20 0.56
HPGD P15428 1/20 0.49
AKR1B1 P15121 1/20 0.47
PTGDR2 Q9Y5Y4 2/20 0.45
RECQL P46063 1/20 0.44
CYP1A2 P05177 1/20 0.44
SMN1; SMN2 Q16637 1/20 0.44
AADAT Q8N5Z0 1/20 0.43
NAPRT Q6XQN6 1/20 0.42
NPC1 O15118 1/20 0.42
LMNA P02545 1/20 0.42
MAPK1 P28482 1/20 0.42
MAPT P10636 1/20 0.42
CYP2C19 P33261 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4360401 0.83 ALDH1A1 (0.47) ALDH1A1TSHRHPGDAKR1B1PTGDR2
SCHEMBL4351352 0.83 ALDH1A1 (0.47) ALDH1A1TSHRHPGDAKR1B1PTGDR2
SCHEMBL4353413 0.83 PTGDR2 (0.52) ALDH1A1TSHRHPGDAKR1B1PTGDR2
SCHEMBL4353321 0.82 PTGDR2 (0.61) ALDH1A1TSHRPTGDR2RECQLSMN1; SMN2
SCHEMBL12233274 0.82 ALDH1A1 (0.46) ALDH1A1TSHRHPGDAKR1B1PTGDR2
SCHEMBL5393595 0.81 ALDH1A1 (0.45) ALDH1A1TSHRAKR1B1PTGDR2RECQL
SCHEMBL31584408 0.79 PTGDR2 (0.63) ALDH1A1TSHRPTGDR2RECQL
SCHEMBL27533039 0.78 ALDH1A1 (0.76) ALDH1A1TSHRHPGDRECQLCYP1A2
SCHEMBL174541 0.77 TSHR (0.76) ALDH1A1TSHRHPGDRECQLCYP1A2
SCHEMBL144813 0.75 TSHR (0.69) ALDH1A1TSHRHPGDRECQLSMN1; SMN2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed