SCHEMBL4353413

SCHEMBL4353413

O=C(O)Cc1cnn(Cc2ccccc2)c1CC(=O)O

nearest known ligand 0.52

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
PTGDR2 Q9Y5Y4 4/20 0.52
ALDH1A1 P00352 1/20 0.47
RECQL P46063 1/20 0.45
AKR1B1 P15121 2/20 0.44
TSHR P16473 1/20 0.43
KDM4E B2RXH2 1/20 0.42
AADAT Q8N5Z0 1/20 0.41
PTGS1 P23219 1/20 0.41
HPGD P15428 1/20 0.40
POLB P06746 1/20 0.40
NAPRT Q6XQN6 1/20 0.40
MAPT P10636 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31584408 0.90 PTGDR2 (0.63) PTGDR2ALDH1A1RECQLTSHRKDM4E
SCHEMBL4351352 0.84 ALDH1A1 (0.47) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL4360401 0.84 ALDH1A1 (0.47) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL4359373 0.84 ALDH1A1 (0.47) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL12233274 0.83 ALDH1A1 (0.46) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL4349404 0.83 ALDH1A1 (0.59) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL4353321 0.83 PTGDR2 (0.61) PTGDR2ALDH1A1RECQLTSHRKDM4E
SCHEMBL5393595 0.82 ALDH1A1 (0.45) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL4348519 0.80 HSD17B10 (0.46) PTGDR2ALDH1A1RECQLAKR1B1TSHR
SCHEMBL17869405 0.72 ALDH1A1 (0.54) ALDH1A1RECQLTSHRPTGS1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed