SCHEMBL4351352

SCHEMBL4351352

O=C(O)Cc1cnn(Cc2ccccc2)c1O

nearest known ligand 0.47

Predicted protein targets (top 12)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.47
PTGDR2 Q9Y5Y4 4/20 0.46
RECQL P46063 1/20 0.45
AKR1B1 P15121 2/20 0.44
TSHR P16473 1/20 0.43
KDM4E B2RXH2 1/20 0.42
AADAT Q8N5Z0 1/20 0.41
PTGS1 P23219 1/20 0.41
HPGD P15428 1/20 0.40
POLB P06746 1/20 0.40
NAPRT Q6XQN6 1/20 0.40
MAPT P10636 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4353413 0.84 PTGDR2 (0.52) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL4360401 0.84 ALDH1A1 (0.47) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL4353321 0.83 PTGDR2 (0.61) ALDH1A1PTGDR2RECQLTSHRKDM4E
SCHEMBL4349404 0.83 ALDH1A1 (0.59) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL12233274 0.83 ALDH1A1 (0.46) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL5393595 0.82 ALDH1A1 (0.45) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL31584408 0.81 PTGDR2 (0.63) ALDH1A1PTGDR2RECQLTSHRKDM4E
SCHEMBL6036235 0.77 MAPT (0.39) ALDH1A1PTGDR2AKR1B1KDM4EHPGD
SCHEMBL4359373 0.75 ALDH1A1 (0.47) ALDH1A1PTGDR2RECQLAKR1B1TSHR
SCHEMBL4352717 0.75 RECQL (0.51) ALDH1A1RECQLTSHRHPGDPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed