SCHEMBL4354444

SCHEMBL4354444

Cc1nn(C)c(O)c1C#N

nearest known ligand 0.39

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
PIK3CG P48736 1/20 0.37
POLB P06746 2/20 0.36
KDM4E B2RXH2 10/20 0.35
MEN1 O00255 4/20 0.34
KMT2A Q03164 4/20 0.34
ALDH1A1 P00352 7/20 0.33
TSHR P16473 1/20 0.33
MAPT P10636 4/20 0.33
HSD17B10 Q99714 2/20 0.33
HPGD P15428 2/20 0.33
MAPK1 P28482 1/20 0.33
NTRK1 P04629 3/20 0.32
PIM1 P11309 3/20 0.32
ACVR1 Q04771 2/20 0.32
LMNA P02545 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4354498 0.77 ALDH1A1 (0.41) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL29196315 0.74 PIK3CG (0.37) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL1821874 0.74 TSHR (0.47) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL23284547 0.74 PIK3CG (0.37) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL16402575 0.74 KMT2A (0.37) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL4625127 0.72 LMNA (0.54) POLBKDM4EKMT2AALDH1A1MAPT
SCHEMBL14043919 0.72 KDM4E (0.38) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL9888773 0.71 POLB (0.47) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL13141437 0.71 PIK3CG (0.35) PIK3CGPOLBKDM4EMEN1KMT2A
SCHEMBL13683109 0.69 POLB (0.46) PIK3CGPOLBKDM4EKMT2AALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed