SCHEMBL4354987

SCHEMBL4354987

O=C(OCCO)C(=CC1CCCC1)C1CCCC1

nearest known ligand 0.40

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
TSHR P16473 1/20 0.33
GRIK1 P39086 2/20 0.32
GRIK2 Q13002 1/20 0.32
CES2 O00748 1/20 0.30
CES1 P23141 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9436874 0.98 GRIK1 (0.33) TSHRGRIK1GRIK2CES2CES1
SCHEMBL28059258 0.85 ALDH1A1 (0.34) GRIK1GRIK2
SCHEMBL8714650 0.81 ALDH1A1 (0.42)
SCHEMBL29108764 0.79 ALDH1A1 (0.45)
SCHEMBL20878786 0.79 ALDH1A1 (0.45)
SCHEMBL4863395 0.79 GRIK1 (0.32) GRIK1GRIK2CES2CES1
SCHEMBL27720510 0.78 GRIK1 (0.33) TSHRGRIK1GRIK2
SCHEMBL9436873 0.78 GRIK1 (0.33) GRIK1GRIK2CES2CES1
SCHEMBL21722132 0.74 SMN1; SMN2 (0.36) TSHRGRIK1GRIK2CES2CES1
SCHEMBL9245846 0.74 EPHX1 (0.38) TSHRGRIK1CES2CES1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 58 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7371499-B2 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-05-13 US claimed
US-20070128540-A1 PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-06-07 US claimed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US claimed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US claimed
EP-3436210-B1 FUNCTIONALIZED LAMINATED OPTICAL ELEMENT WITH IMPROVED EDGING RESISTANCE ESSILOR INT (FR) 2024-06-12 EP disclosed
US-11982941-B2 Flexographic printing plate precursor SUMITOMO RIKO COMPANY LIMITED (JP) 2024-05-14 US disclosed
CN-115491132-B Ultraviolet light curing composition 台湾永光化学工业股份有限公司 2024-02-23 CN disclosed
US-11772343-B2 Functionalized laminated optical element with improved edging resistance ESSILOR INTERNATIONAL (FR) 2023-10-03 US disclosed
EP-3650239-B1 FLEXOGRAPHIC PRINTING PLATE PRECURSOR SUMITOMO RIKO CO LTD (JP) 2023-04-19 EP disclosed
CN-109070232-B Functionalized laminated optical element with improved edging resistance 依视路国际公司 2021-11-16 CN disclosed
US-20200241416-A1 FLEXOGRAPHIC PRINTING PLATE PRECURSOR SUMITOMO RIKO COMPANY LIMITED (JP) 2020-07-30 US disclosed
EP-3650239-A1 FLEXOGRAPHIC PRINTING PLATE PRECURSOR Sumitomo Riko Company Limited (JP) 2020-05-13 EP disclosed
US-7371499-B2 Photoresist resin composition, method of forming a photoresist pattern, and method of manufacturing a display substrate using the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-05-13 US disclosed
US-20070128540-A1 PHOTORESIST RESIN COMPOSITION, METHOD OF FORMING A PHOTORESIST PATTERN, AND METHOD OF MANUFACTURING A DISPLAY SUBSTRATE USING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2007-06-07 US disclosed
US-20060280878-A1 Column spacer, liquid crystal display element and curable resin composition for column spacer SEKISUI CHEMICAL CO., LTD. (JP) 2006-12-14 US disclosed
CN-1877449-A Negative light-sensitive resin composition DONGJIN SEMICHEM CO LTD (KR) 2006-12-13 CN disclosed
EP-1715373-A1 COLUMN SPACER, LIQUID CRYSTAL DISPLAY ELEMENT AND CURABLE RESIN COMPOSITION FOR COLUMN SPACER SEKISUI CHEMICAL CO., LTD. (JP) 2006-10-25 EP disclosed
CN-1828416-A Photosensitive resin composition DONGJIN SEMICHEM CO LTD (KR) 2006-09-06 CN disclosed
US-6686120-B2 THERMAL ACID GENERATOR AND A METHOD OF FORMING A PATTERN USING THE SAME. THE PHOTORESIST COMPOSITION INCLUDES ABOUT 100 PARTS BY WEIGHT OF AN ALKALI-SOLUBLE ACRYL COPOLYMER, ABOUT 5-100 PARTS BY WEIGHT OF 1,2-QUINONEDIAZIDE COMPOUND, ABOUT SAMSUNG ELECTRONICS CO., LTD. (KR) 2004-02-03 US disclosed
US-20030134222-A1 Photoresist composition and method of forming pattern using the same SAMSUNG ELECTRONICS CO., LTD. 2003-07-17 US disclosed