SCHEMBL8714650

SCHEMBL8714650

CCOC(=O)C(=CC1CCCC1)C1CCCC1

nearest known ligand 0.44

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 3/20 0.42
MAPT P10636 1/20 0.39
GAA P10253 1/20 0.37
MEN1 O00255 1/20 0.37
KMT2A Q03164 1/20 0.37
RAB9A P51151 3/20 0.36
NPSR1 Q6W5P4 1/20 0.36
GLO1 Q04760 1/20 0.36
CHRM1 P11229 3/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
NPC1 O15118 1/20 0.35
POLB P06746 2/20 0.35
THRB P10828 1/20 0.35
ATM Q13315 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
HTT P42858 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20878786 0.98 ALDH1A1 (0.45) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL29108764 0.98 ALDH1A1 (0.45) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL28059258 0.86 ALDH1A1 (0.34) ALDH1A1MEN1KMT2ARAB9ASMN1; SMN2
SCHEMBL29117803 0.84 ALDH1A1 (0.47) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL29117717 0.82 ALDH1A1 (0.42) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL15913663 0.81 NPSR1 (0.47) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL17268281 0.81 ALDH1A1 (0.43) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL5611998 0.81 NPSR1 (0.52) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL5611993 0.81 NPSR1 (0.52) ALDH1A1MAPTGAAMEN1KMT2A
SCHEMBL4354987 0.81 TSHR (0.33)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115491162-B UV solvent-free ink-jet printing optical pressure-sensitive adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2024-01-30 CN claimed
CN-115491162-A UV solvent-free type ink-jet printing optical pressure-sensitive adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2022-12-20 CN claimed
CN-113025240-A UV solvent-free optical adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2021-06-25 CN claimed
US-4305854-A Radiation curable pressure sensitive adhesive POLYCHROME CORPORATION (US) 1981-12-15 US claimed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-116068853-A Photosensitive resin composition and display device 三星显示有限公司 2023-05-05 CN disclosed
CN-113025240-B UV solvent-free optical adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2023-01-03 CN disclosed
CN-115491162-A UV solvent-free type ink-jet printing optical pressure-sensitive adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2022-12-20 CN disclosed
CN-113025240-A UV solvent-free optical adhesive and preparation method thereof 广州市嵩达新材料科技有限公司 2021-06-25 CN disclosed
CN-107936906-B OLED (organic light emitting diode) protective adhesive and preparation method thereof 东莞市贝特利新材料有限公司 2021-02-19 CN disclosed
CN-104698752-B Photosensitive resin composition, color filter and manufacturing method thereof, and liquid crystal display device 奇美实业股份有限公司 2020-05-15 CN disclosed
US-9897729-B2 Photosensitive resin composition for color filter and application thereof CHI MEI CORPORATION (TW) 2018-02-20 US disclosed
US-20140287167-A1 POLYMERIZABLE COMPOSITION, POLYMER, IMAGE-DISPLAY DEVICE, AND MANUFACTURING METHOD THEREFOR SHOWA DENKO K.K. (JP) 2014-09-25 US disclosed
EP-2757121-A2 Curable composition Showa Denko K.K. (JP) 2014-07-23 EP disclosed
EP-2757122-A2 Photocurable moisture-proof insulating coating material for mounting circuit boards Showa Denko K.K. (JP) 2014-07-23 EP disclosed
US-20140124716-A1 PHOTOSENSITIVE RESIN COMPOSITION AND APPLICATION OF THE SAME CHI MEI CORPORATION (TW) 2014-05-08 US disclosed
EP-2514781-A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION CONTAINING SAME Showa Denko K.K. (JP) 2012-10-24 EP disclosed
US-20120232183-A1 POLYMERIZABLE COMPOUND AND CURABLE COMPOSITION COMPRISING SAME SHOWA DENKO K.K. (JP) 2012-09-13 US disclosed
US-5807519-A Plastic molds and methods of producing same TAKEMOTO YUSHI KBUSHIKI KAISHA (JP) 1998-09-15 US disclosed
US-4305854-A Radiation curable pressure sensitive adhesive POLYCHROME CORPORATION (US) 1981-12-15 US disclosed