SCHEMBL4355544

SCHEMBL4355544

Cc1n[nH]c(CC(=O)O)c1C#N

nearest known ligand 0.35

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.35
MAPK1 P28482 3/20 0.35
HCAR2 Q8TDS4 2/20 0.35
POLB P06746 3/20 0.35
L3MBTL1 Q9Y468 2/20 0.35
APEX1 P27695 1/20 0.35
TDP1 Q9NUW8 1/20 0.35
KDM4E B2RXH2 5/20 0.34
HSD17B10 Q99714 3/20 0.34
HPGD P15428 3/20 0.34
STAT3 P40763 1/20 0.32
CYP2C19 P33261 2/20 0.32
PDE4D Q08499 1/20 0.32
GABRR1 P24046 1/20 0.32
SMN1; SMN2 Q16637 2/20 0.31
CYP1A2 P05177 1/20 0.31
FPR1 P21462 1/20 0.31
KDM5A P29375 1/20 0.31
LMNA P02545 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4350884 0.74 LMNA (0.39) ALDH1A1HCAR2POLBL3MBTL1KDM4E
SCHEMBL4349433 0.73 HCAR2 (0.40) ALDH1A1HCAR2POLBL3MBTL1KDM4E
SCHEMBL4772293 0.70 KCNH2 (0.53) MAPK1CYP2C19SMN1; SMN2
SCHEMBL21222643 0.70 ALDH1A1 (0.36) ALDH1A1POLBL3MBTL1TDP1KDM4E
SCHEMBL13184399 0.69 ALDH1A1 (0.33) ALDH1A1POLBKDM4EHSD17B10HPGD
SCHEMBL4358069 0.67
SCHEMBL4361606 0.66
SCHEMBL171417 0.66 KDM4C (0.46) ALDH1A1MAPK1KDM4EHSD17B10HPGD
SCHEMBL15556607 0.65
SCHEMBL2830618 0.64 MEN1 (0.51) MAPK1KDM4EPDE4DLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed