SCHEMBL4356034

SCHEMBL4356034

Cc1c(CC(=O)O)cnn1C(C)C

nearest known ligand 0.40

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
POLB P06746 1/20 0.40
PTGDR2 Q9Y5Y4 3/20 0.37
KDM4E B2RXH2 2/20 0.36
ALDH1A1 P00352 2/20 0.36
MAPT P10636 1/20 0.36
GABRR1 P24046 1/20 0.35
ALOX15 P16050 1/20 0.35
HTT P42858 1/20 0.35
KMO O15229 1/20 0.35
KMT2A Q03164 1/20 0.33
ACHE P22303 1/20 0.33
SRC P12931 1/20 0.33
AGBL2 Q5U5Z8 1/20 0.33
L3MBTL1 Q9Y468 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4360062 0.83 POLB (0.40) POLBPTGDR2KDM4EALDH1A1MAPT
SCHEMBL4362715 0.83 POLB (0.40) POLBKDM4EALDH1A1MAPTGABRR1
SCHEMBL4362745 0.81 POLB (0.39) POLBKDM4EGABRR1KMOKMT2A
SCHEMBL12526130 0.80 CYP1A2 (0.32) KDM4EACHE
SCHEMBL12985583 0.78 NTRK1 (0.44) POLBKDM4EALDH1A1MAPTACHE
SCHEMBL4359151 0.77 SMN1; SMN2 (0.40) POLBPTGDR2KDM4EALDH1A1MAPT
SCHEMBL574416 0.73 KDM4E (0.49) POLBKDM4EALDH1A1KMT2AL3MBTL1
SCHEMBL4356815 0.71 KMO (0.40) POLBKDM4EALDH1A1HTTKMO
SCHEMBL1195016 0.70 MAPK1 (0.58) KDM4EALDH1A1MAPTHTTKMT2A
SCHEMBL22875312 0.69 CYP1A2 (0.32) ALDH1A1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed