SCHEMBL4356815

SCHEMBL4356815

CC(C)n1ncc(Cl)c1CC(=O)O

nearest known ligand 0.40

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KMO O15229 1/20 0.40
POLB P06746 1/20 0.39
KDM4E B2RXH2 2/20 0.35
AKR1B1 P15121 1/20 0.34
P2RX7 Q99572 3/20 0.34
KMT2A Q03164 1/20 0.33
ENPP2 Q13822 1/20 0.33
THRA P10827 1/20 0.32
THRB P10828 1/20 0.32
BPTF Q12830 1/20 0.32
NPC1 O15118 1/20 0.32
MITF O75030 1/20 0.32
ALDH1A1 P00352 1/20 0.32
HTT P42858 1/20 0.32
SMN1; SMN2 Q16637 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4360062 0.81 POLB (0.40) KMOPOLBKDM4EAKR1B1KMT2A
SCHEMBL24484529 0.79 BPTF (0.32) KMOBPTF
SCHEMBL4361450 0.77 P2RX7 (0.51) AKR1B1P2RX7KMT2AALDH1A1HTT
SCHEMBL4353034 0.76 POLB (0.37) KMOPOLBKDM4EKMT2AALDH1A1
SCHEMBL1431085 0.74 KDM4E (0.41) KMOPOLBKDM4EKMT2ANPC1
SCHEMBL4362715 0.71 POLB (0.40) KMOPOLBKDM4EAKR1B1KMT2A
SCHEMBL4356034 0.71 POLB (0.40) KMOPOLBKDM4EKMT2AALDH1A1
SCHEMBL15768020 0.71 KDM4E (0.36) KMOKDM4EKMT2ANPC1ALDH1A1
SCHEMBL4362745 0.70 POLB (0.39) KMOPOLBKDM4EAKR1B1KMT2A
SCHEMBL24484530 0.70 ACLY (0.31) BPTFNPC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
US-20080217617-A1 Thin Film Transistor, Wiring Board and Methods of Manufacturing the Same ZEON CORPORATION (JP) 2008-09-11 US disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed