SCHEMBL4359151

SCHEMBL4359151

Cc1c(CC(=O)O)cnn1C

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
SMN1; SMN2 Q16637 5/20 0.40
ALDH1A1 P00352 4/20 0.40
KDM4E B2RXH2 4/20 0.40
NPC1 O15118 3/20 0.40
HPGD P15428 3/20 0.40
RAB9A P51151 3/20 0.40
PTGDR2 Q9Y5Y4 3/20 0.39
ALOX15 P16050 1/20 0.38
MAPT P10636 4/20 0.36
MEN1 O00255 1/20 0.36
HTT P42858 1/20 0.36
KMT2A Q03164 1/20 0.36
TP53 P04637 4/20 0.36
MAPK1 P28482 1/20 0.36
RXFP1 Q9HBX9 2/20 0.36
HDAC3 O15379 1/20 0.36
HDAC1 Q13547 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
POLB P06746 1/20 0.35
GAA P10253 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4007505 0.83 HTT (0.39) SMN1; SMN2ALDH1A1KDM4ENPC1HPGD
SCHEMBL4352669 0.81 AKR1B1 (0.39) ALDH1A1KDM4EHPGDPTGDR2MAPT
SCHEMBL4362725 0.81 PTGDR2 (0.38) ALDH1A1KDM4EHPGDPTGDR2MAPT
SCHEMBL22083516 0.80 NPC1 (0.37) SMN1; SMN2ALDH1A1KDM4ENPC1HPGD
SCHEMBL4364026 0.79 GABRA5 (0.37) SMN1; SMN2ALDH1A1KDM4EHPGDPTGDR2
SCHEMBL1774409 0.79 P2RX7 (0.36) SMN1; SMN2KDM4EPTGDR2AKR1B1
SCHEMBL13736669 0.78 MAPT (0.47) SMN1; SMN2ALDH1A1KDM4EHPGDMAPT
SCHEMBL8342654 0.77
SCHEMBL4356034 0.77 POLB (0.40) ALDH1A1KDM4EPTGDR2ALOX15MAPT
SCHEMBL5261460 0.75

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7614145-B2 Method for manufacturing multilayer circuit board and resin base material ZEON CORPORATION (JP) 2009-11-10 US disclosed
CN-100496195-C Mulitilayer circuit board, resin base material, and its production method ZEON CORP (JP) 2009-06-03 CN disclosed
CN-100383278-C Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2008-04-23 CN disclosed
US-20050153059-A1 Partial plating method, partially-plated resin base, method for manufacturing multilayered circuit board ZEON CORPORATION (JP) 2005-07-14 US disclosed
CN-1639384-A Partial plating method, partially-plated resin base, method for manufacturing multilayer circuit board ZEON CORP (JP) 2005-07-13 CN disclosed
US-20040237295-A1 Multilayer circuit board and resin base material, and its production method ZEON CORPORATION (JP) 2004-12-02 US disclosed
CN-1552174-A Mulitilayer circuit board, resin base material, and its production method �ձ�������ʽ���� 2004-12-01 CN disclosed