SCHEMBL4366168

SCHEMBL4366168

C=CSCCCCO

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4369007 0.92
SCHEMBL3389327 0.79
1,4-Butanediol SCHEMBL7850531 0.73 SMN1; SMN2 (0.35)
SCHEMBL8014278 0.72
1,6-Hexanediol SCHEMBL4407381 0.71 LMNA (0.38)
SCHEMBL7767109 0.70 TSHR (0.46)
SCHEMBL1574113 0.70 TSHR (0.46)
SCHEMBL22326383 0.70 DNM1 (0.42)
SCHEMBL11330539 0.70 TSHR (0.46)
SCHEMBL6141050 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7575150-B2 Flux composition for solder, solder paste, and method of soldering NOF CORPORATION (JP) 2009-08-18 US disclosed
US-20080073414-A1 FLUX COMPOSITION FOR SOLDER, SOLDER PASTE, AND METHOD OF SOLDERING NOF CORPORATION (JP) 2008-03-27 US disclosed
EP-1439025-B1 FLUX COMPOSITION FOR SOLDER, SOLDER PASTE AND METHOD OF SOLDERING NOF CORP (JP) 2006-11-02 EP disclosed
US-20040250919-A1 Flux composition for solder, solder paste, and method of soldering NOF CORPORATION (JP) 2004-12-16 US disclosed
EP-1439025-A1 FLUX COMPOSITION FOR SOLDER&amp;comma; SOLDER PASTE&amp;comma; AND METHOD OF SOLDERING NOF CORPORATION (JP) 2004-07-21 EP disclosed