SCHEMBL437116

SCHEMBL437116

Nc1ccc2ccc(C(=O)O)cc2c1

nearest known ligand 0.48

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 6/20 0.48
SMYD3 Q9H7B4 1/20 0.47
ALDH1A1 P00352 6/20 0.46
HSD17B10 Q99714 4/20 0.46
CYP3A4 P08684 4/20 0.46
MAPT P10636 5/20 0.45
TDP1 Q9NUW8 4/20 0.45
HPGD P15428 3/20 0.45
RECQL P46063 3/20 0.45
POLB P06746 3/20 0.45
GAA P10253 3/20 0.45
NPC1 O15118 1/20 0.45
MITF O75030 1/20 0.45
NFKB1 P19838 1/20 0.45
RAB9A P51151 1/20 0.45
GFER P55789 1/20 0.45
NFKB2 Q00653 1/20 0.45
RELA Q04206 1/20 0.45
PAX8 Q06710 1/20 0.45
KLF5 Q13887 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6865178 0.94 ALDH1A1 (0.54) KDM4ESMYD3ALDH1A1HSD17B10CYP3A4
SCHEMBL9121653 0.94 ALDH1A1 (0.54) KDM4ESMYD3ALDH1A1HSD17B10CYP3A4
SCHEMBL29398350 0.94 KDM4E (0.55) KDM4ESMYD3ALDH1A1HSD17B10CYP3A4
SCHEMBL100233 0.94 KDM4E (0.55) KDM4ESMYD3ALDH1A1HSD17B10CYP3A4
SCHEMBL9119115 0.88 PTPN1 (0.53) KDM4ESMYD3ALDH1A1HSD17B10CYP3A4
SCHEMBL28624473 0.87 KDM4E (0.57) KDM4ESMYD3ALDH1A1HSD17B10MAPT
SCHEMBL28025 0.87 KDM4E (0.59) KDM4EALDH1A1HSD17B10MAPTTDP1
SCHEMBL29406959 0.87 KDM4E (0.59) KDM4EALDH1A1HSD17B10MAPTTDP1
Hydrochloric Acid SCHEMBL9088279 0.84 KDM4E (0.57) KDM4EALDH1A1HSD17B10MAPTTDP1
SCHEMBL8736492 0.84 KDM4E (0.63) KDM4EALDH1A1HSD17B10MAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 796 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1630605-B1 PHOTOSENSITIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2017-10-11 EP claimed
WO-2014004146-A1 SILICONE RUBBER EMPIRE TECHNOLOGY DEVELOPMENT LLC (US) 2014-01-03 WO claimed
WO-2026100508-A1 RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, AND RESIN 富士フイルム株式会社 2026-05-15 WO disclosed
CN-122029489-A Photosensitive resin composition, cured product, display device, and electronic component 东丽株式会社 2026-05-12 CN disclosed
EP-4738010-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION COATING FILM, NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION FILM, CURED FILM, AND ELECTRONIC COMPONENT COMPRISING SAME Toray Industries, Inc. (JP) 2026-05-06 EP disclosed
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-04-16 US disclosed
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component SHIN-ETSU CHEMICAL CO., LTD. (JP) 2026-03-24 US disclosed
EP-4692937-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT AND METHOD FOR PRODUCING SAME, HOLLOW STRUCTURE, ELECTRONIC COMPONENT, AND ELASTIC WAVE FILTER Toray Industries, Inc. (JP) 2026-02-11 EP disclosed
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORP (JP) 2026-01-01 US disclosed
US-20260003281-A1 RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2026-01-01 US disclosed
US-5594062-A Polycarbonate/polyolefin based resin compositions and their production processes and uses KAWASAKI STEEL CORPORATION (JP) 1997-01-14 US disclosed
US-5491188-A ADDING DIAMIDE COMPOUNDS AS NUCLEATING AGENT TO PROPYLENE HOMO-, CO- AND TERPOLYMERS; FILTRATION MEMBRANES, PRINTING SHEETS NEW JAPAN CHEMICAL CO., LTD. (JP) 1996-02-13 US disclosed
EP-0673949-A1 Compatibilized polycarbonate/polyolefin resin compositions KAWASAKI STEEL CORPORATION (JP) 1995-09-27 EP disclosed
US-5391699-A Containing an aromatic amine carboxylate, heat resistance BRIDGESTONE CORPORATION (JP) 1995-02-21 US disclosed
CN-1098725-A Based on porous stretched article of acrylic resin and preparation method thereof NEW JAPAN CHEM CO LTD (JP) 1995-02-15 CN disclosed
EP-0632095-A2 Porous stretched article of polypropylene-based resin and process for its preparation NEW JAPAN CHEMICAL CO.,LTD. (JP) 1995-01-04 EP disclosed
EP-0571095-A2 Polyester copolymer and process for the production of the same BRIDGESTONE CORPORATION (JP) 1993-11-24 EP disclosed
EP-0557721-A2 Crystalline polypropylene resin composition and amide compounds NEW JAPAN CHEMICAL CO.,LTD. (JP) 1993-09-01 EP disclosed
US-3996201-A MOLDING CIBA-GEIGY CORPORATION (US) 1976-12-07 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20260104641-A1 NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, PATTERNING PROCESS METHOD FOR FORMING CURED FILM, INTERLAYER INSULATING FILM, SURFACE PROTECTIVE FILM, AND ELECTRONIC COMPONENT ARCN1, PRDM9, LBR KDM4E 88/4885SMYD3 2964/4885ALDH1A1 3706/4885
US-20260003281-A1 RESIN COMPOSITION, DIAMINE COMPOUND, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEM1, SAT1, ASIC1 KDM4E 49/4885SMYD3 2156/4885ALDH1A1 50/4885
US-20260003274-A1 PHOTOSENSITIVE RESIN COMPOSITION, CURED SUBSTANCE, LAMINATE, MANUFACTURING METHOD FOR CURED SUBSTANCE, MANUFACTURING METHOD FOR LAMINATE, MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE SEM1, ASIC1, SMARCB1 KDM4E 549/4885SMYD3 1031/4885ALDH1A1 1444/4885
US-12583973-B2 Polyimide-based polymer, positive photosensitive resin composition, negative photosensitive resin composition, patterning method, method for forming cured film, interlayer insulating film, surface protective film, and electronic component PRDM9, ARCN1, PUF60 KDM4E 184/4885SMYD3 2393/4885ALDH1A1 3281/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.