SCHEMBL4373000

SCHEMBL4373000

Cc1cc(C(C)(C)C)c(OP(O)Oc2c(C(C)(C)C)cc(C)cc2C(C)(C)C)c(C(C)(C)C)c1

nearest known ligand 0.50

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ SMN1; SMN2 Q16637 3/20 0.50
▸ ALDH1A1 P00352 3/20 0.50
▸ CA2 P00918 1/20 0.50
▸ POLB P06746 1/20 0.50
▸ TYR P14679 1/20 0.50
▸ HSPA5 P11021 1/20 0.41
▸ CYP2C9 P11712 3/20 0.40
▸ CYP2C19 P33261 3/20 0.40
▸ HIF1A Q16665 2/20 0.40
▸ CYP2D6 P10635 2/20 0.36
▸ CYP1A2 P05177 2/20 0.36
▸ CYP3A4 P08684 1/20 0.36
▸ HSD17B10 Q99714 1/20 0.36
▸ KDM4E B2RXH2 1/20 0.34
▸ MAPT P10636 1/20 0.34
▸ ALOX15 P16050 1/20 0.34
▸ ATP2A2 P16615 1/20 0.34
▸ ATP2A3 Q93084 1/20 0.34
▸ TSHR P16473 1/20 0.34
▸ TDP1 Q9NUW8 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11270167 0.90 SMN1; SMN2 (0.45) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL3671836 0.89 SMN1; SMN2 (0.41) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1664850 0.88 SMN1; SMN2 (0.50) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL7638739 0.87 SMN1; SMN2 (0.39) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL11421838 0.83 GABRA1 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL31366151 0.83 ALDH1A1 (0.42) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL2231433 0.83 ALDH1A1 (0.43) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL1159937 0.83 SMN1; SMN2 (0.48) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL30241097 0.82 SMN1; SMN2 (0.45) SMN1; SMN2ALDH1A1CA2POLBTYR
SCHEMBL28958825 0.82 SMN1; SMN2 (0.38) SMN1; SMN2ALDH1A1CA2POLBTYR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 77 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3559087-B1 METHOD FOR LOWERING THE CRYSTALLIZATION TEMPERATURE OF SEMICRYSTALLINE POLYAMIDES, POLYAMIDE MOLDING COMPOUND PRODUCED THEREBY, AND USE OF ORGANIC PHOSPHORUS COMPOUNDS TO LOWER THE CRYSTALLIZATION TEMPERATURE FRAUNHOFER GES FORSCHUNG (DE) 2026-03-18 — — EP claimed
EP-3559087-A1 METHOD FOR LOWERING THE CRYSTALLIZATION TEMPERATURE OF SEMICRYSTALLINE POLYAMIDES, POLYAMIDE MOLDING COMPOUND PRODUCED THEREBY, AND USE OF ORGANIC PHOSPHORUS COMPOUNDS TO LOWER THE CRYSTALLIZATION TEMPERATURE Fraunhofer Gesellschaft zur Förderung der Angewand (DE) 2019-10-30 — — EP claimed
EP-0764729-B9 POLYHEXAMETHYLENEADIPAMIDE FIBER AND PROCESS FOR PRODUCING THE FIBER ASAHI CHEMICAL IND (JP) 2003-10-01 — — EP claimed
EP-0764729-B1 POLYHEXAMETHYLENEADIPAMIDE FIBER AND PROCESS FOR PRODUCING THE FIBER ASAHI CHEMICAL IND (JP) 2003-03-12 — — EP claimed
US-5929148-A CONSISTS OF AN 2,4-BIS(ALKYLTHIO)-6-(3,5-DIALKYL-4-HYDROXYANILINO)-1,3,5-TRIA ZINE ANTIOXIDANT AND PHOSPHORUS ACID, HYPOPHOSPHORUS ACID AND THEIR DERIVATIVES; EXCELLENT THERMAL YELLOWING RESISTANCE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1999-07-27 — — US claimed
EP-0764729-A1 POLYHEXAMETHYLENEADIPAMIDE FIBER AND PROCESS FOR PRODUCING THE FIBER Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1997-03-26 — — EP claimed
EP-3559087-B1 METHOD FOR LOWERING THE CRYSTALLIZATION TEMPERATURE OF SEMICRYSTALLINE POLYAMIDES, POLYAMIDE MOLDING COMPOUND PRODUCED THEREBY, AND USE OF ORGANIC PHOSPHORUS COMPOUNDS TO LOWER THE CRYSTALLIZATION TEMPERATURE FRAUNHOFER GES FORSCHUNG (DE) 2026-03-18 — — EP disclosed
EP-4079812-B1 FIBER-REINFORCED RESIN MOLDING MATERIAL, FIBER-REINFORCED RESIN MOLDED ARTICLE, AND METHOD FOR MANUFACTURING FIBER-REINFORCED RESIN MOLDED ARTICLE TORAY INDUSTRIES (JP) 2024-08-21 — — EP disclosed
CN-114206459-B Adhesive and adhesive sheet 爱天思株式会社 2024-07-12 — — CN disclosed
US-20240228843-A1 PRESSURE SENSITIVE ADHESIVE COMPOSITION AND PRESSURE SENSITIVE ADHESIVE SHEET ARTIENCE CO., LTD. (JP) 2024-07-11 — — US disclosed
CN-113646052-B Reversible thermochromic composition, reversible thermochromic microcapsule pigment, and writing instrument 百乐墨水株式会社 2024-05-17 — — CN disclosed
CN-118043298-A (Hetero) aryl-substituted bisphenol compound and thermoplastic resin 罗伊特化学仪器制造公司 2024-05-14 — — CN disclosed
CN-117954516-A Novel solar cell backboard, preparation method and application 中国石油化工股份有限公司 2024-04-30 — — CN disclosed
US-6288153-B1 CONTAINING SPECIFIED AMINO AND CARBOXYL END GROUP CONCENTRATIONS; MIXED WITH ALKALI METAL COMPOUND ASAHI KASEI KABUSHIKI KAISHA (JP) 2001-09-11 — — US disclosed
WO-2000063282-A1 RESIN COMPOSITION FOR BIODEGRADABLE AGRICULTURAL FILMS WITH ENHANCED WEATHERABILITY C.I. KASEI CO. LTD. (JP) 2000-10-26 — — WO disclosed
US-6004733-A Packaged roll-shaped silver halide photosensitive material FUJI PHOTO FILM CO., LTD. (JP) 1999-12-21 — — US disclosed
US-5929148-A CONSISTS OF AN 2,4-BIS(ALKYLTHIO)-6-(3,5-DIALKYL-4-HYDROXYANILINO)-1,3,5-TRIA ZINE ANTIOXIDANT AND PHOSPHORUS ACID, HYPOPHOSPHORUS ACID AND THEIR DERIVATIVES; EXCELLENT THERMAL YELLOWING RESISTANCE ASAHI KASEI KOGYO KABUSHIKI KAISHA (JP) 1999-07-27 — — US disclosed
US-5833878-A DISPLAY COMPRISING POLYNORBORNANE RESIN FILMS; SHARPNESS JSR CORPORATION (JP) 1998-11-10 — — US disclosed
EP-0764729-A1 POLYHEXAMETHYLENEADIPAMIDE FIBER AND PROCESS FOR PRODUCING THE FIBER Asahi Kasei Kogyo Kabushiki Kaisha (JP) 1997-03-26 — — EP disclosed
US-4233208-A OXIDATION RESISTANCE, RADIATION RESISTANCE CIBA-GEIGY CORPORATION (US) 1980-11-11 — — US disclosed
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