Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CES2 | O00748 | 3/20 | 0.41 |
| ▸ | CES1 | P23141 | 3/20 | 0.41 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.41 |
| ▸ | HDAC3 | O15379 | 4/20 | 0.39 |
| ▸ | HDAC1 | Q13547 | 4/20 | 0.39 |
| ▸ | HDAC2 | Q92769 | 4/20 | 0.39 |
| ▸ | HDAC8 | Q9BY41 | 4/20 | 0.39 |
| ▸ | FFAR3 | O14843 | 3/20 | 0.39 |
| ▸ | CTSD | P07339 | 1/20 | 0.39 |
| ▸ | TSHR | P16473 | 1/20 | 0.38 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | HDAC6 | Q9UBN7 | 1/20 | 0.35 |
| ▸ | FAAH | O00519 | 3/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | OR51E2 | Q9H255 | 1/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL422556 | 0.97 | — | — | |
| Hydrochloric Acid SCHEMBL6461485 | 0.95 | — | — | |
| SCHEMBL28204586 | 0.95 | — | — | |
| Ammonia Solution, Strong SCHEMBL8445489 | 0.95 | — | — | |
| Water SCHEMBL28252944 | 0.95 | — | — | |
| Hydrochloric Acid SCHEMBL28109007 | 0.92 | CES2 (0.39) | CES2CES1TDP1HDAC3HDAC1 | |
| Ethylamine SCHEMBL4365157 | 0.92 | CES2 (0.39) | CES2CES1TDP1HDAC3HDAC1 | |
| Hydrochloric Acid SCHEMBL1040510 | 0.92 | CES2 (0.39) | CES2CES1TDP1HDAC3HDAC1 | |
| Chloromethane SCHEMBL9166183 | 0.92 | TSHR (0.42) | CES2CES1TDP1HDAC3HDAC1 | |
| Dimethylamine SCHEMBL609755 | 0.90 | CTSD (0.41) | CES2CES1TDP1HDAC3HDAC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8524111-B2 | CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-09-03 | — | — | US | claimed |
| CN-117986426-A | Preparation method of emulsifier for waterproof emulsion | 南通腾龙化工科技有限公司 | 2024-05-07 | — | — | CN | disclosed |
| US-9463262-B2 | Cell adhesive material for biological tissue | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2016-10-11 | — | — | US | disclosed |
| US-20130289254-A1 | CELL ADHESIVE MATERIAL FOR BIOLOGICAL TISSUE | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2013-10-31 | — | — | US | disclosed |
| EP-2636415-A1 | CELL ADHESIVE MATERIAL FOR BIOLOGICAL TISSUE | Sanyo Chemical Industries, Ltd. (JP) | 2013-09-11 | — | — | EP | disclosed |
| US-8524111-B2 | CMP abrasive slurry for polishing insulation film, polishing method, and semiconductor electronic part polished by the polishing method | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-09-03 | — | — | US | disclosed |
| US-20090047786-A1 | CMP Abrasive Slurry for Polishing Insulation Film, Polishing Method, and Semiconductor Electronic Part Polished by the Polishing Method | RESONAC CORPORATION (JP) | 2009-02-19 | — | — | US | disclosed |
| US-4842936-A | CROSSLINKED | NIPPON PAINT CO., LTD. (JP) | 1989-06-27 | — | — | US | disclosed |
| US-4647606-A | Blend of rapid set asphaltic emulsion with slow set asphalt emulsion | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1987-03-03 | — | — | US | disclosed |
| US-4547225-A | Additives for hot mix asphalt | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1985-10-15 | — | — | US | disclosed |
| EP-0082056-B1 | CATIONIC ACRYLAMIDE AND RUBBER MODIFIED ASPHALTS | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1985-05-22 | — | — | EP | disclosed |
| US-4456633-A | Chip seal technique employing blends of asphaltic emulsions | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1984-06-26 | — | — | US | disclosed |
| US-4436864-A | Aqueous emulsions of acrylamide and rubber modified asphalts | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1984-03-13 | — | — | US | disclosed |
| US-4436767-A | Slurry seal method using acrylamide and rubber modified asphaltic emulsion | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1984-03-13 | — | — | US | disclosed |
| US-4419489-A | Easily emulsifiable acrylamide and rubber modified asphalts | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1983-12-06 | — | — | US | disclosed |
| US-4394481-A | Cationic arcylamide and rubber modified asphalts | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1983-07-19 | — | — | US | disclosed |
| WO-1983002115-A1 | CATIONIC ACRYLAMIDE AND RUBBER MODIFIED ASPHALTS | OWENS CORNING FIBERGLASS CORP (US) | 1983-06-23 | — | — | WO | disclosed |
| EP-0082056-A1 | Cationic acrylamide and rubber modified asphalts | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1983-06-22 | — | — | EP | disclosed |
| US-4383081-A | Cationic acrylamide chemically modified asphalts | OWENS-CORNING FIBERGLAS CORPORATION (US) | 1983-05-10 | — | — | US | disclosed |