Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APEX1 | P27695 | 1/20 | 0.38 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.34 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.33 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.33 |
| ▸ | HPGD | P15428 | 1/20 | 0.33 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.31 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5585810 | 0.77 | APEX1 (0.31) | APEX1 | |
| SCHEMBL125274 | 0.76 | APEX1 (0.33) | APEX1 | |
| SCHEMBL28483288 | 0.72 | APEX1 (0.31) | APEX1ALDH1A1HPGD | |
| SCHEMBL4184455 | 0.71 | APEX1 (0.47) | APEX1KDM4EALDH1A1HPGD | |
| SCHEMBL28772116 | 0.71 | KDM4E (0.32) | KDM4EALDH1A1HPGD | |
| Methacrylic Acid SCHEMBL904578 | 0.71 | APEX1 (0.33) | APEX1 | |
| Methacrylic Acid SCHEMBL1008210 | 0.71 | APEX1 (0.33) | APEX1 | |
| SCHEMBL4188327 | 0.68 | APEX1 (0.70) | APEX1KDM4EALDH1A1HPGDMAPK1 | |
| SCHEMBL28512835 | 0.68 | APEX1 (0.39) | APEX1KDM4EALDH1A1MAPK1HSD17B10 | |
| SCHEMBL4388580 | 0.67 | LMNA (0.31) | ALDH1A1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11296357-B2 | Non-aqueous electrolytic solution and non-aqueous electrolyte secondary battery using the same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2022-04-05 | — | — | US | disclosed |
| EP-3185347-B1 | NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY | MITSUBISHI CHEM CORP (JP) | 2020-05-13 | — | — | EP | disclosed |
| US-10615455-B2 | Non-aqueous electrolytic solution and non-aqueous electrolyte secondary battery using the same | MITSUBISHI CHEMICAL CORPORATION (JP) | 2020-04-07 | — | — | US | disclosed |
| US-20200036041-A1 | NON-AQUEOUS ELECTROLYTIC SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY USING THE SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2020-01-30 | — | — | US | disclosed |
| EP-3528330-A1 | NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY | Mitsubishi Chemical Corporation (JP) | 2019-08-21 | — | — | EP | disclosed |
| EP-3185347-A1 | NONAQUEOUS ELECTROLYTE SOLUTION AND NONAQUEOUS ELECTROLYTE SECONDARY BATTERY USING SAME | Mitsubishi Chemical Corporation (JP) | 2017-06-28 | — | — | EP | disclosed |
| US-20170162906-A1 | NON-AQUEOUS ELECTROLYTIC SOLUTION AND NON-AQUEOUS ELECTROLYTE SECONDARY BATTERY USING THE SAME | MITSUBISHI CHEMICAL CORPORATION (JP) | 2017-06-08 | — | — | US | disclosed |
| US-20140039417-A1 | COMPOSITE MATERIAL AND INDUSTRIAL ENDOSCOPE | OLYMPUS CORPORATION (JP) | 2014-02-06 | — | — | US | disclosed |
| US-7560372-B2 | Process for making a semiconductor device having a roughened surface | NEC ELECTRONICS CORPORATION (JP) | 2009-07-14 | — | — | US | disclosed |
| US-7268087-B2 | Manufacturing method of semiconductor device | NEC ELECTRONICS CORPORATION (JP) | 2007-09-11 | — | — | US | disclosed |
| US-20030111731-A1 | Semiconductor device and method for producing the same | NEC ELECTRONICS CORPORATION (JP) | 2003-06-19 | — | — | US | disclosed |
| US-20020155702-A1 | Manufacturing method of semiconductor device | NEC CORPORATION | 2002-10-24 | — | — | US | disclosed |
| US-6071226-A | BALANCE BETWEEN POT LIFE AND REACTIVITY IN CURING, ANTICORROSIVE PROPERTIES AND NONYELLOWING | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 2000-06-06 | — | — | US | disclosed |
| EP-0845486-A1 | EPOXIDIZED POLYENE, EPOXY RESIN COMPOSITION AND PRODUCT OF CURING THEREOF, AND POWDER COATING MATERIAL | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1998-06-03 | — | — | EP | disclosed |
| US-5756777-A | THERMOSETTING RESINS; PHOTOPOLYMERIZABLE; CURABLE | DAICEL CHEMICAL INDUSTRIES, LTD. (JP) | 1998-05-26 | — | — | US | disclosed |
| EP-0056112-B1 | METHOD OF PREPARING RESIN COATED FOUNDRY SAND USING UNSATURATED POLYESTER | NISSAN MOTOR CO., LTD. (JP) | 1985-02-20 | — | — | EP | disclosed |
| US-4396735-A | N-HETEROCYCLIC COMPOUND AND A HETEROCYCLIC ACID HYDRAZIDE | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1983-08-02 | — | — | US | disclosed |
| US-4396571-A | SELF-BRIDGING | NISSAN MOTOR COMPANY, LTD. (JP) | 1983-08-02 | — | — | US | disclosed |
| US-4362831-A | A HINDERED AND HETEROCYCLIC AMINE WITH A THIOALKANOIC ACID AMIDE | ADEKA ARGUS CHEMICAL CO., LTD. (JP) | 1982-12-07 | — | — | US | disclosed |
| EP-0056112-A1 | Method of preparing resin coated foundry sand using unsaturated polyester | NISSAN MOTOR CO., LTD. (JP) | 1982-07-21 | — | — | EP | disclosed |