SCHEMBL4395920

SCHEMBL4395920

O=C1C2C=CCCC2C(=O)N1c1cccc(N2C(=O)C3C=CCCC3C2=O)c1

nearest known ligand 0.46

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
▸ L3MBTL1 Q9Y468 3/20 0.44
▸ ATM Q13315 2/20 0.42
▸ MAPK1 P28482 1/20 0.42
▸ GAA P10253 1/20 0.41
▸ KMT2A Q03164 3/20 0.40
▸ LMNA P02545 2/20 0.40
▸ MEN1 O00255 2/20 0.40
▸ ALDH1A1 P00352 3/20 0.40
▸ TSHR P16473 2/20 0.40
▸ ALOX15 P16050 1/20 0.40
▸ KDM4E B2RXH2 1/20 0.38
▸ HPGD P15428 1/20 0.38
▸ HTT P42858 1/20 0.38
▸ SMN1; SMN2 Q16637 1/20 0.38
▸ POLB P06746 2/20 0.38
▸ FAAH O00519 1/20 0.38
▸ MGLL Q99685 1/20 0.38
▸ BLM P54132 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10544676 0.90 L3MBTL1 (0.41) L3MBTL1ATMMAPK1GAAKMT2A
SCHEMBL5712943 0.89 MEN1 (0.53) L3MBTL1ATMGAAKMT2ALMNA
SCHEMBL9376403 0.88 L3MBTL1 (0.39) L3MBTL1ATMMAPK1GAAKMT2A
SCHEMBL11326569 0.86 L3MBTL1 (0.51) L3MBTL1ATMMAPK1GAAKMT2A
SCHEMBL10542824 0.81 L3MBTL1 (0.41) L3MBTL1ATMMAPK1GAAKMT2A
SCHEMBL9568054 0.80 CA9 (0.41) L3MBTL1MAPK1GAAKMT2ALMNA
SCHEMBL9377423 0.80 ATM (0.35) L3MBTL1ATMMAPK1GAAKMT2A
SCHEMBL11524855 0.79 ALDH1A1 (0.40) L3MBTL1GAAKMT2ALMNAMEN1
SCHEMBL11015042 0.76 PPOX (0.41) MAPK1GAAKMT2ALMNAMEN1
SCHEMBL11010737 0.76 ALDH1A1 (0.43) L3MBTL1GAAKMT2ALMNAMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-4035345-A Thermosetting bis-imide compositions RHONE-POULENC S.A. (FR) 1977-07-12 — — US claimed
US-20240043636-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2024-02-08 — — US disclosed
US-20240010805-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2024-01-11 — — US disclosed
EP-4255967-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL Toray Composite Materials America, Inc. (US) 2023-10-11 — — EP disclosed
EP-4255968-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG Toray Composite Materials America, Inc. (US) 2023-10-11 — — EP disclosed
WO-2022120053-A1 PREPREG AND CARBON FIBER-REINFORCED COMPOSITE MATERIAL TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2022-06-09 — — WO disclosed
WO-2022120049-A1 BMI RESIN FORMULATION FOR CARBON FIBER REINFORCED COMPOSITE MATERIAL, METHOD FOR MAKING IT AND BMI PREPREG TORAY COMPOSITE MATERIALS AMERICA, INC. (US) 2022-06-09 — — WO disclosed
US-9824797-B2 Resistive grid elements having a thermosetting polymer GENERAL ELECTRIC COMPANY (US) 2017-11-21 — — US disclosed
US-20160180990-A1 RESISTIVE GRID ELEMENTS HAVING A THERMOSETTING POLYMER GE GLOBAL SOURCING LLC 2016-06-23 — — US disclosed
US-7592072-B2 Bismaleimide prepreg systems HEXCEL CORPORATION (US) 2009-09-22 — — US disclosed
US-20070134480-A1 Bismaleimide prepreg systems HEXCEL CORPORATION (US) 2007-06-14 — — US disclosed
US-5095074-A (Poly)bismaleimide and ther derivative of alkenylphenol HERCULES INCORPORATED (US) 1992-03-10 — — US disclosed
US-4962161-A BISMALEIMIDE OR POLYMALEIMIDE AND ETHER DERIVATIVE OF ALKENYLPHENOL HERCULES INCORPORATED (US) 1990-10-09 — — US disclosed
US-4874828-A AEROSPACE HERCULES INCORPORATED (US) 1989-10-17 — — US disclosed
EP-0313863-A2 Heat resistant thermosetting phosphazene-imide copolymers HERCULES INCORPORATED (US) 1989-05-03 — — EP disclosed
EP-0304009-A1 Thermosettable resin compositions HERCULES INCORPORATED (US) 1989-02-22 — — EP disclosed
US-4346206-A Imide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixture HITACHI CHEMICAL COMPANY, LTD. (JP) 1982-08-24 — — US disclosed
US-4038450-A STORAGE STABILITY RHONE-POULENC S.A. (FR) 1977-07-26 — — US disclosed
US-4035345-A Thermosetting bis-imide compositions RHONE-POULENC S.A. (FR) 1977-07-12 — — US disclosed
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