Sulfuric Acid

Sulfuric Acid

SCHEMBL439606

CC(C)NN.O=S(=O)(O)O

nearest known ligand 0.40

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Known targets — ChEMBL curated mechanism

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

The experimentally established mechanism targets of Sulfuric Acid. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA5A P35218 2/20 0.40
CA5B Q9Y2D0 2/20 0.40
TP53 P04637 1/20 0.37
CA2 P00918 4/20 0.35
CA1 P00915 3/20 0.35
CA9 Q16790 3/20 0.35
TSHR P16473 1/20 0.35
NT5E P21589 1/20 0.35
CA4 P22748 1/20 0.35
CA6 P23280 1/20 0.35
CA7 P43166 1/20 0.35
BLM P54132 3/20 0.35
KDM4E B2RXH2 3/20 0.35
NPSR1 Q6W5P4 2/20 0.35
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35
HPGD P15428 2/20 0.32
LMNA P02545 2/20 0.32
KMT2A Q03164 2/20 0.32
MEN1 O00255 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL56411 0.78
Sulfuric Acid SCHEMBL16470726 0.78 TP53 (0.30) TP53KDM4ELMNAALDH1A1MAPT
Isopropylhydroxylamine SCHEMBL9190289 0.76 CA5A (0.43) CA5ACA5BTP53CA2CA1
Sulfuric Acid SCHEMBL10528253 0.76 TDP1 (0.57) CA5ACA5BTP53CA2TSHR
Bicarbonate SCHEMBL31492009 0.76
SCHEMBL8742729 0.75
Sulfuric Acid SCHEMBL11362741 0.75 TP53 (0.40) CA5ACA5BTP53CA2CA1
Sulfuric Acid SCHEMBL6900701 0.74 CA5A (0.50) CA5ACA5BTP53CA2CA1
Sulfuric Acid SCHEMBL833021 0.74
Sulfuric Acid SCHEMBL8776106 0.74

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122029305-A Plating film for metal sintering bonding, method for producing the same, and semiconductor mounting substrate 奥野制药工业株式会社 2026-05-12 CN disclosed
WO-2025079303-A1 PLATING FILM FOR METAL SINTERING BONDING, METHOD FOR MANUFACTURING SAME, AND SEMICONDUCTOR MOUNTING SUBSTRATE 奥野製薬工業株式会社 2025-04-17 WO disclosed
WO-2022253252-A1 HETEROCYCLIC COMPOUNDS USEFUL AS HPK1 INHIBITORS SILEXON BIOTECH CO., LTD. (CN) 2022-12-08 WO disclosed
US-9758666-B2 Oxygen-absorbing resin composition and oxygen-absorbing multilayer body using the same MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2017-09-12 US disclosed
EP-2894194-B1 OXYGEN-ABSORBING RESIN COMPOSITION AND OXYGEN-ABSORBING MULTILAYER BODY USING SAME MITSUBISHI GAS CHEMICAL CO (JP) 2017-01-11 EP disclosed
US-20150203678-A1 OXYGEN-ABSORBING RESIN COMPOSITION AND OXYGEN-ABSORBING MULTILAYER BODY USING THE SAME MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2015-07-23 US disclosed
EP-2894194-A1 OXYGEN-ABSORBING RESIN COMPOSITION AND OXYGEN-ABSORBING MULTILAYER BODY USING SAME Mitsubishi Gas Chemical Company, Inc. (JP) 2015-07-15 EP disclosed
EP-2319686-B1 DEOXIDIZING LAMINATE MITSUBISHI GAS CHEMICAL CO (JP) 2015-01-21 EP disclosed
US-8889238-B2 Deoxidizing multilayered body MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2014-11-18 US disclosed
CN-102149543-B Deoxygenating laminate MITSUBISHI GAS CHEMICAL CO 2014-09-03 CN disclosed
US-20040211291-A1 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition TAMURA KAKEN CORPORATION (JP) 2004-10-28 US disclosed
US-20030177865-A1 Process of producing metal powders TAMURA KAKEN CORPORATION (JP) 2003-09-25 US disclosed
US-20030047034-A1 Method of manufacturing fine metal particles, substance containing fine metal particles, and paste solder composition TAMURA KAKEN CORPORATION (JP) 2003-03-13 US disclosed
EP-1245315-A1 Method of manufacturing fine metal particles, substance containing fine metal particles and paste solder composition Tamura Kaken Corporation (JP) 2002-10-02 EP disclosed
EP-0005240-B1 N,N-DIMETHYL-O-PYRAZOLYL ESTERS OF CARBAMIC ACID, PROCESS FOR THEIR PREPARATION AND THEIR USE AS INSECTICIDES BAYER AG (DE) 1981-04-29 EP disclosed
EP-0000388-B1 PYRIDAZINON(THIONO)-PHOSPHORIC ACID ESTERS, PROCESS FOR THEIR PREPARATION AND THEIR USE AS INSECTICIDES AND ACARICIDES BAYER AG (DE) 1980-11-26 EP disclosed
US-4219546-A INSECTICIDES, MITICIDES BAYER AKTIENGESELLSCHAFT (DE) 1980-08-26 US disclosed
US-4215132-A Combating arthropods with N,N-dimethyl-O-(3-substituted-pyrazol-5-yl)-carbamic acid esters BAYER AKTIENGESELLSCHAFT (DE) 1980-07-29 US disclosed
EP-0005240-A2 N,N-dimethyl-O-pyrazolyl esters of carbamic acid, process for their preparation and their use as insecticides BAYER AG (DE) 1979-11-14 EP disclosed
EP-0000388-A1 Pyridazinon(thiono)-phosphoric acid esters, process for their preparation and their use as insecticides and acaricides BAYER AG (DE) 1979-01-24 EP disclosed