Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.50 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.50 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.50 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.36 |
| ▸ | GAA | P10253 | 3/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.36 |
| ▸ | PKM | P14618 | 1/20 | 0.35 |
| ▸ | SLC18A3 | Q16572 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL444231 | 0.98 | KDM4E (0.48) | KDM4EALDH1A1HSD17B10L3MBTL1GAA | |
| SCHEMBL25524450 | 0.88 | KDM4E (0.45) | KDM4EALDH1A1HSD17B10L3MBTL1GAA | |
| SCHEMBL440457 | 0.75 | ALDH1A1 (0.35) | KDM4EALDH1A1HSD17B10L3MBTL1SLC18A3 | |
| SCHEMBL28388510 | 0.73 | ALDH1A1 (0.34) | KDM4EALDH1A1HSD17B10L3MBTL1 | |
| SCHEMBL444230 | 0.73 | ALDH1A1 (0.34) | KDM4EALDH1A1HSD17B10L3MBTL1GAA | |
| SCHEMBL2047769 | 0.72 | KDM4E (0.38) | KDM4EALDH1A1HSD17B10 | |
| SCHEMBL20961019 | 0.71 | KDM4E (0.39) | KDM4EALDH1A1HSD17B10GAATDP1 | |
| SCHEMBL19222727 | 0.71 | KDM4E (0.39) | KDM4EALDH1A1HSD17B10GAATDP1 | |
| SCHEMBL28389206 | 0.69 | ALDH1A1 (0.34) | KDM4EALDH1A1HSD17B10L3MBTL1 | |
| SCHEMBL439205 | 0.68 | CHRNB2 (0.47) | ALDH1A1GAASLC18A3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8309658-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-11-13 | — | — | US | disclosed |
| US-8138268-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-20 | — | — | US | disclosed |
| US-20120063109-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2012-03-15 | — | — | US | disclosed |
| US-20110176288-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | HITACHI CHEMICAL COMPANY LTD. (JP) | 2011-07-21 | — | — | US | disclosed |
| EP-2246400-A1 | Circuit connecting material | Hitachi Chemical Co., Ltd. (JP) | 2010-11-03 | — | — | EP | disclosed |
| EP-1754762-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2007-02-21 | — | — | EP | disclosed |