SCHEMBL440569

SCHEMBL440569

CC(=CCCc1ccccc1Cl)C(=O)O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CTBP2 P56545 1/20 0.44
HIF1A Q16665 1/20 0.42
TAAR1 Q96RJ0 3/20 0.42
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
AKR1C3 P42330 1/20 0.41
PLAAT3 P53816 2/20 0.40
PLAAT5 Q96KN8 2/20 0.40
PLAAT2 Q9NWW9 2/20 0.40
PLAAT4 Q9UL19 2/20 0.40
SLC6A2 P23975 2/20 0.40
SLC6A4 P31645 2/20 0.40
SLC6A3 Q01959 1/20 0.40
MAOA P21397 1/20 0.40
MAOB P27338 1/20 0.40
AOC3 Q16853 1/20 0.40
SMN1; SMN2 Q16637 1/20 0.40
HTR3E A5X5Y0 1/20 0.39
HTR3B O95264 1/20 0.39
HTR3A P46098 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1920921 1.00 CTBP2 (0.44) CTBP2HIF1ATAAR1NPC1RAB9A
SCHEMBL3628109 0.83 CTBP2 (0.46) CTBP2NPC1RAB9AAKR1C3MAOA
SCHEMBL8618050 0.83 CTBP2 (0.46) CTBP2NPC1RAB9AAKR1C3MAOA
SCHEMBL1137147 0.82 AKR1B1 (0.47) TAAR1AKR1C3
SCHEMBL19656187 0.82 GPR52 (0.55) TAAR1RAB9AAKR1C3
SCHEMBL12003261 0.82 CTBP2 (0.45) CTBP2TAAR1AKR1C3MAOB
SCHEMBL1060627 0.82 AKR1B1 (0.47) TAAR1AKR1C3
SCHEMBL678767 0.82 CTBP2 (0.45) CTBP2TAAR1AKR1C3MAOB
SCHEMBL1624072 0.78 MTNR1A (0.54) TAAR1SMN1; SMN2CHRM2CHRM1CHRM3
SCHEMBL3681656 0.78 TDP1 (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 61 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2341102-B1 Thermoplastic resin composition revealing improved impact strength and melt flow property CHEIL IND INC (KR) 2015-12-02 EP claimed
US-8907013-B2 Polycarbonate resin composition and molded product using the same CHEIL INDUSTRIES INC. (KR) 2014-12-09 US claimed
US-8835558-B2 Polylactic acid/polycarbonate resin composition and molded product made using the same CHEIL INDUSTRIES INC. (KR) 2014-09-16 US claimed
EP-2199342-B1 Polylactic acid/polycarbonate resin composition and molded product made using the same CHEIL IND INC (KR) 2014-07-30 EP claimed
US-8735490-B2 Thermoplastic resin composition having improved impact strength and melt flow properties CHEIL INDUSTRIES INC. (KR) 2014-05-27 US claimed
US-20110281995-A1 Polycarbonate Resin Composition and Molded Product Using the Same CHEIL INDUSTRIES INC. (KR) 2011-11-17 US claimed
EP-2341102-A1 Thermoplastic resin composition revealing improved impact strength and melt flow property Cheil Industries Inc. (KR) 2011-07-06 EP claimed
US-20110160377-A1 Thermoplastic Resin Composition Having Improved Impact Strength and Melt Flow Properties CHEIL INDUSTRIES INC. (KR) 2011-06-30 US claimed
US-20100160559-A1 Polylactic Acid/Polycarbonate Resin Composition and Molded Product Made Using the Same CHEIL INDUSTRIES INC. (KR) 2010-06-24 US claimed
EP-2199342-A2 Polylactic acid/polycarbonate resin composition and molded product made using the same Cheil Industries Inc. (KR) 2010-06-23 EP claimed
US-11859034-B2 Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material SAMSUNG DISPLAY CO., LTD. (KR) 2024-01-02 US disclosed
WO-2023249389-A1 ENCAPSULATION COMPOSITION FOR ORGANIC LIGHT-EMITTING ELEMENTS, AND ORGANIC LIGHT-EMITTING ELEMENT DISPLAY DEVICE COMPRISING ORGANIC LAYER FORMED THEREFROM 삼성에스디아이 주식회사 2023-12-28 WO disclosed
WO-2023203845-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-10-26 WO disclosed
WO-2023203837-A1 COMPOSITION AND PHOTOSENSITIVE COMPOSITION 東京応化工業株式会社 2023-10-26 WO disclosed
US-11649401-B2 Quantum dot-containing material, method of preparing the same, and optical member and apparatus including the quantum dot-containing material SAMSUNG DISPLAY CO., LTD. (KR) 2023-05-16 US disclosed
US-20110160377-A1 Thermoplastic Resin Composition Having Improved Impact Strength and Melt Flow Properties CHEIL INDUSTRIES INC. (KR) 2011-06-30 US disclosed
US-20100160559-A1 Polylactic Acid/Polycarbonate Resin Composition and Molded Product Made Using the Same CHEIL INDUSTRIES INC. (KR) 2010-06-24 US disclosed
EP-2199342-A2 Polylactic acid/polycarbonate resin composition and molded product made using the same Cheil Industries Inc. (KR) 2010-06-23 EP disclosed
EP-2184321-A2 Thermoplastic resin composition and molded product made using the same Cheil Industries Inc. (KR) 2010-05-12 EP disclosed
US-20100113697-A1 Thermoplastic Resin Composition and Molded Product Made Using the Same CHEIL INDUSTRIES INC. 2010-05-06 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11859034-B2 Curable composition, method of preparing curable composition, cured material of curable composition, method of preparing cured material, and electronic device including cured material SEM1, ASH2L, CBLC CTBP2 1271/4885HIF1A 2667/4885TAAR1 1794/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.