SCHEMBL4408750

SCHEMBL4408750

NNC(=O)COCC(=O)NN

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 7/20 0.43
CTSD P07339 1/20 0.43
KDM5C P41229 1/20 0.43
PHF8 Q9UPP1 1/20 0.43
KDM2A Q9Y2K7 1/20 0.43
ALDH1A1 P00352 7/20 0.40
LMNA P02545 3/20 0.40
GAA P10253 1/20 0.40
OGG1 O15527 2/20 0.39
CYP1A2 P05177 1/20 0.37
TSHR P16473 1/20 0.37
NFKB1 P19838 1/20 0.37
MAOA P21397 1/20 0.37
MAOB P27338 1/20 0.37
THPO P40225 1/20 0.37
KDM6B O15054 1/20 0.35
KDM4A O75164 1/20 0.35
KDM5A P29375 1/20 0.35
MAPT P10636 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20852142 0.89 CTSD (0.42) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL16193202 0.88 KDM4E (0.40) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL15144321 0.88 GAA (0.42) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL21658868 0.86 GAA (0.45) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL18045691 0.86 GAA (0.45) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL2828605 0.84
SCHEMBL15144320 0.84 GAA (0.48) KDM4ECTSDKDM5CPHF8KDM2A
Hydroquinone SCHEMBL3677695 0.83 GFER (0.54) KDM4EALDH1A1LMNAGAAOGG1
SCHEMBL14392989 0.83 CTSD (0.43) KDM4ECTSDKDM5CPHF8KDM2A
SCHEMBL2607922 0.82

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 50 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12600909-B2 Etching solution composition RASA INDUSTRIES, LTD. (JP) 2026-04-14 US disclosed
US-12344743-B2 Curing composition SUNSTAR ENGINEERING INC. (JP) 2025-07-01 US disclosed
CN-120077080-A One-pack curable composition 盛势达技研株式会社 2025-05-30 CN disclosed
CN-119899530-A Polyimide composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board 日铁化学材料株式会社 2025-04-29 CN disclosed
CN-119899529-A Resin composition, resin film, laminate, cover film, resin-coated copper foil, metal-coated laminate, and circuit board 日铁化学材料株式会社 2025-04-29 CN disclosed
CN-119875270-A Resin composition, resin film, metal-clad laminate, and printed wiring board 日铁化学材料株式会社 2025-04-25 CN disclosed
CN-119875271-A Resin composition, resin film, metal-clad laminate, and printed wiring board 日铁化学材料株式会社 2025-04-25 CN disclosed
US-20250101218-A1 CURABLE RESIN COMPOSITION, ADHESIVE, MOLDING MATERIAL, CURED ARTICLE KURARAY CO., LTD. (JP) 2025-03-27 US disclosed
CN-113801416-B Printed wiring board 日铁化学材料株式会社 2025-03-14 CN disclosed
CN-113462300-B Resin film, metal-clad laminate, and circuit board 日铁化学材料株式会社 2025-03-04 CN disclosed
US-11441015-B2 Coated particle AJINOMOTO CO., INC. (JP) 2022-09-13 US disclosed
US-20220089871-A1 CURING COMPOSITION SUNSTAR ENGINEERING INC. (JP) 2022-03-24 US disclosed
US-7638565-B2 Polyacetal resin composition POLYPLASTICS CO., LTD. (JP) 2009-12-29 US disclosed
US-20070054998-A1 Polyacetal resin composition POLYPLASTICS CO., LTD. (JP) 2007-03-08 US disclosed
EP-1686156-A1 POLYACETAL RESIN COMPOSITION Polyplastics Co., Ltd. (JP) 2006-08-02 EP disclosed
US-6914098-B2 Acrylic elastomer and its composition NIPPON MEKIRON, LIMITED (JP) 2005-07-05 US disclosed
US-20040087729-A1 Acrylic elastomer and its composition MORIYAMA IWAO (JP) 2004-05-06 US disclosed
US-20040019154-A1 Acrylic elastomer and its composition MORIYAMA IWAO (JP) 2004-01-29 US disclosed
US-20010005742-A1 Acrylic elastomer and its composition NIPPON MEKTRON, LIMITED 2001-06-28 US disclosed
EP-1110980-A1 Acrylic elastomer and its composition Nippon Mektron, Limited (JP) 2001-06-27 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12600909-B2 Etching solution composition ASIC3, GRIN2D, ASIC1 KDM4E 279/4885CTSD 531/4885KDM5C 244/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.