SCHEMBL4410158

SCHEMBL4410158

CCC(N1CCCC1)P(=O)(O)O

nearest known ligand 0.50

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
FDPS P14324 8/20 0.50
ANPEP P15144 1/20 0.38
ERAP2 Q6P179 1/20 0.38
LAP3 P28838 1/20 0.38
MAPT P10636 1/20 0.35
SLC6A3 Q01959 3/20 0.32
SLC6A2 P23975 2/20 0.32
SLC6A4 P31645 2/20 0.32
MMP1 P03956 1/20 0.31
MMP2 P08253 1/20 0.31
MMP3 P08254 1/20 0.31
MMP9 P14780 1/20 0.31
S1PR1 P21453 1/20 0.30
S1PR3 Q99500 1/20 0.30
S1PR5 Q9H228 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4407985 0.83 FDPS (0.47) FDPSANPEPERAP2SLC6A3SLC6A2
SCHEMBL7444956 0.82 LAP3 (0.39) FDPSANPEPERAP2LAP3
SCHEMBL3225195 0.77 FDPS (0.48) FDPSANPEPERAP2MAPTMMP1
Ammonia Solution, Strong SCHEMBL11336508 0.71 FDPS (0.42) FDPSANPEPERAP2S1PR1S1PR3
Ammonia Solution, Strong SCHEMBL8010381 0.71 FDPS (0.47) FDPSANPEPERAP2MAPTS1PR1
SCHEMBL4413973 0.70 FDPS (0.56) FDPSANPEPERAP2LAP3MAPT
SCHEMBL8928291 0.70 FDPS (0.39) FDPSANPEPERAP2MAPTMMP2
SCHEMBL7456869 0.67 FDPS (0.41) FDPSANPEPERAP2LAP3
SCHEMBL2472093 0.67 FDPS (1.00) FDPSANPEPERAP2MAPTMMP1
N-(Hexamethyleneimino)Methylenebisphosphonic Acid SCHEMBL12309768 0.67 FDPS (1.00) FDPSANPEPERAP2MAPTMMP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed