SCHEMBL4413973

SCHEMBL4413973

CC(N1CCCC1)P(=O)(O)O

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FDPS P14324 3/20 0.56
ANPEP P15144 4/20 0.38
ERAP2 Q6P179 1/20 0.38
MMP2 P08253 4/20 0.34
MMP1 P03956 2/20 0.34
MMP9 P14780 2/20 0.34
MMP3 P08254 1/20 0.34
MAPT P10636 1/20 0.34
LAP3 P28838 3/20 0.33
KDM4E B2RXH2 1/20 0.32
ALDH1A1 P00352 1/20 0.32
GAA P10253 1/20 0.32
CA12 O43570 3/20 0.31
CA1 P00915 3/20 0.31
CA2 P00918 3/20 0.31
CA9 Q16790 3/20 0.31
MMP8 P22894 1/20 0.31
ATM Q13315 1/20 0.30
ERAP1 Q9NZ08 1/20 0.30
MAOB P27338 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6438981 0.83 FDPS (0.38) FDPSMMP2MMP1MMP9LAP3
SCHEMBL7450835 0.79 FDPS (0.35) FDPSANPEPERAP2LAP3ERAP1
SCHEMBL11331122 0.78 ANPEP (0.43) FDPSANPEPMMP1MMP3MAPT
SCHEMBL4881726 0.76 MMP8 (0.36) FDPSMMP2MMP1LAP3CA12
SCHEMBL18537934 0.76 KDM4E (0.41) FDPSANPEPERAP2MAPTKDM4E
SCHEMBL5134371 0.72 SLC6A9 (0.43) KDM4EALDH1A1
SCHEMBL2472093 0.72 FDPS (1.00) FDPSANPEPERAP2MMP2MMP1
N-(Hexamethyleneimino)Methylenebisphosphonic Acid SCHEMBL12309768 0.72 FDPS (1.00) FDPSANPEPERAP2MMP2MMP1
SCHEMBL16136174 0.72 FDPS (0.33) FDPSANPEPERAP2
SCHEMBL4410158 0.70 FDPS (0.50) FDPSANPEPERAP2MMP2MMP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed