SCHEMBL4410180

SCHEMBL4410180

CCC(Br)(CBr)P(=O)(O)O

nearest known ligand 0.37

Predicted protein targets (top 6)

geneUniProtsupporting neighboursconfidence
FDPS P14324 15/20 0.37
GGPS1 O95749 8/20 0.33
LMNA P02545 1/20 0.33
LPAR1 Q92633 1/20 0.31
LPAR3 Q9UBY5 1/20 0.31
SMPD1 P17405 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4828705 0.89 FDPS (0.40) FDPSGGPS1LMNALPAR1LPAR3
SCHEMBL3357002 0.80 FDPS (0.50) FDPSGGPS1LPAR1LPAR3SMPD1
SCHEMBL2342024 0.74 FDPS (0.37) FDPSGGPS1LMNALPAR1LPAR3
SCHEMBL4410220 0.70
Phosphoric Acid SCHEMBL4309093 0.67 LMNA (0.38) FDPSGGPS1LMNA
SCHEMBL2942969 0.67 ALDH1A1 (0.32)
SCHEMBL6296955 0.65 FDPS (0.43) FDPSGGPS1LMNALPAR1LPAR3
SCHEMBL8718782 0.65 GGPS1 (0.50) FDPSGGPS1LMNALPAR1LPAR3
SCHEMBL246809 0.65 FDPS (0.43) FDPSGGPS1LMNALPAR1LPAR3
SCHEMBL1768259 0.65 FDPS (0.43) FDPSGGPS1LMNALPAR1LPAR3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250133947-A1 Thermal Evaporation-Growth of Halide Perovskites Through Phosphonic Acid Addition GEORGIA TECH RES INST (US) 2025-04-24 US disclosed
US-7635748-B2 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2009-12-22 US disclosed
EP-1270646-B1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES (JP) 2008-11-26 EP disclosed
US-7442757-B2 Resin, resin composition, method for manufacturing the same, and molded material including the same TORAY INDUSTRIES, INC. (JP) 2008-10-28 US disclosed
US-20080139778-A1 Resin and article molded therefrom TAKANISHI KEIJIRO 2008-06-12 US disclosed
US-20060287464-A1 Resin and article molded therefrom TORAY INDUSTRIES, INC. (JP) 2006-12-21 US disclosed
EP-1640405-A1 RESIN AND ARTICLE MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2006-03-29 EP disclosed
US-20060047104-A1 Resin, resin composition, process for production thereof, and moldings made by using the same TORAY INDUSTRIES, INC. (JP) 2006-03-02 US disclosed
EP-1518884-A1 RESIN, RESIN COMPOSITIONS, PROCESS FOR PRODUCTION THEREOF, AND MOLDINGS MADE BY USING THE SAME TORAY INDUSTRIES, INC. (JP) 2005-03-30 EP disclosed
US-6750313-B2 HIGH REFRACTIVE INDEX AND LOW DISPERSION CHARACTERISTICS; OPTICAL LENSES, FILMS, DISCS; POLYCARBONATE RESIN CONTAINING A PHOSPHONIC ACID GROUP TORAY INDUSTRIES, INC. (JP) 2004-06-15 US disclosed
US-20030013836-A1 Resin composition and articles molded therefrom TORAY INDUSTRIES, INC., A CORPORATION OF JAPAN (JP) 2003-01-16 US disclosed
EP-1270646-A1 RESIN COMPOSITION AND ARTICLES MOLDED THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-01-02 EP disclosed