Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.42 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 2/20 | 0.39 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL14165344 | 0.81 | ALDH1A1 (0.43) | ALDH1A1CYP3A4 | |
| SCHEMBL441905 | 0.81 | ALDH1A1 (0.43) | ALDH1A1CYP3A4 | |
| SCHEMBL444363 | 0.79 | APLNR (0.41) | GAAL3MBTL1 | |
| SCHEMBL6558021 | 0.76 | GAA (0.45) | ALDH1A1CYP3A4GAAL3MBTL1 | |
| SCHEMBL13164372 | 0.76 | GAA (0.43) | ALDH1A1GAAL3MBTL1KDM4EALOX15 | |
| SCHEMBL13822175 | 0.73 | ALDH1A1 (0.33) | ALDH1A1CYP3A4 | |
| SCHEMBL12019112 | 0.71 | ALDH1A1 (0.65) | ALDH1A1CYP3A4 | |
| SCHEMBL3197954 | 0.71 | ALDH1A1 (0.59) | ALDH1A1CYP3A4 | |
| SCHEMBL24849809 | 0.70 | GAA (0.41) | GAAL3MBTL1 | |
| SCHEMBL2049404 | 0.70 | ALDH1A1 (0.44) | ALDH1A1CYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 23 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115108969-A | Efficient and migration-resistant antioxidant as well as preparation method and application thereof | 华南理工大学 | 2022-09-27 | — | — | CN | claimed |
| US-8138268-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-20 | — | — | US | claimed |
| WO-2011103111-A1 | METHOD OF TREATING DISEASE INVOLVING MYELIN AND/OR AXONAL LOSS | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2011-08-25 | — | — | WO | claimed |
| CN-120082184-A | Weather-resistant unsaturated polyester resin, preparation method thereof and application thereof in photovoltaics | 成都大金立合成材料有限责任公司 | 2025-06-03 | — | — | CN | disclosed |
| CN-115108969-A | Efficient and migration-resistant antioxidant as well as preparation method and application thereof | 华南理工大学 | 2022-09-27 | — | — | CN | disclosed |
| US-8310813-B2 | Sealing material for electrolytic capacitor and electrolytic capacitor employing the sealing material | NIPPON CHEMI-CON CORPORATION (JP) | 2012-11-13 | — | — | US | disclosed |
| US-8310813-B2 | Sealing material for electrolytic capacitor and electrolytic capacitor employing the sealing material | NIPPON CHEMI-CON CORPORATION (JP) | 2012-11-13 | — | — | US | disclosed |
| US-8309658-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-11-13 | — | — | US | disclosed |
| US-8138268-B2 | Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-20 | — | — | US | disclosed |
| US-20120063109-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | RESONAC CORPORATION (JP) | 2012-03-15 | — | — | US | disclosed |
| WO-2011103111-A1 | METHOD OF TREATING DISEASE INVOLVING MYELIN AND/OR AXONAL LOSS | THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY, DEPARTMENT OF HEALTH AND HUMAN SERVICES (US) | 2011-08-25 | — | — | WO | disclosed |
| US-7772325-B2 | Thermoplastic elastomer composition | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2010-08-10 | — | — | US | disclosed |
| EP-2146360-A1 | SEALING MATERIAL FOR ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR EMPLOYING THE SEALING MATERIAL | NIPPON CHEMI-CON CORPORATION (JP) | 2010-01-20 | — | — | EP | disclosed |
| US-20090292044-A1 | MODIFIED DIENE-BASED RUBBER AND RUBBER COMPOSITION CONTAINING THE SAME | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2009-11-26 | — | — | US | disclosed |
| EP-1983027-A1 | Modified butyl rubber composition | The Yokohama Rubber Co., Ltd. (JP) | 2008-10-22 | — | — | EP | disclosed |
| US-20080146737-A1 | THERMOPLASTIC ELASTOMER COMPOSITION | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2008-06-19 | — | — | US | disclosed |
| EP-1837350-A1 | PROCESS FOR PRODUCTION OF MODIFIED POLYMERS AND MODIFIED POLYMERS PRODUCED THEREBY | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2007-09-26 | — | — | EP | disclosed |
| US-7196144-B2 | Process for modification of polymer | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2007-03-27 | — | — | US | disclosed |
| US-7196144-B2 | Process for modification of polymer | THE YOKOHAMA RUBBER CO., LTD. (JP) | 2007-03-27 | — | — | US | disclosed |
| EP-1754762-A1 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE | Hitachi Chemical Co., Ltd. (JP) | 2007-02-21 | — | — | EP | disclosed |