SCHEMBL4430872

SCHEMBL4430872

CC1=C([Zr](Cl)(Cl)Cl)CC=C1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL796734 0.85
SCHEMBL1135065 0.77
SCHEMBL1135088 0.77
Hydrochloric Acid SCHEMBL17698538 0.71
SCHEMBL872234 0.71
SCHEMBL10921505 0.71
SCHEMBL4124215 0.71
SCHEMBL4376086 0.71
SCHEMBL27737190 0.71
SCHEMBL3815750 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 62 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3893054-B1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORP (JP) 2026-05-06 EP disclosed
US-12393116-B2 Pattern forming method, photosensitive resin composition, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2025-08-19 US disclosed
EP-3893053-B1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM CORP (JP) 2025-01-22 EP disclosed
US-12078929-B2 Photosensitive resin composition, pattern forming method, cured film, laminate, and device FUJIFILM CORPORATION (JP) 2024-09-03 US disclosed
CN-113168093-B Pattern forming method, photosensitive resin composition, cured film, laminate, and device 富士胶片株式会社 2024-04-30 CN disclosed
CN-113383273-B Photosensitive resin composition, pattern forming method, cured film, laminate, and device 富士胶片株式会社 2023-11-14 CN disclosed
CN-114402256-A Organic film, method for producing same, composition, laminate, and semiconductor device 富士胶片株式会社 2022-04-26 CN disclosed
EP-3893053-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, MULTILAYER BODY AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
EP-3893054-A1 PATTERN FORMING METHOD, PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, LAMINATE, AND DEVICE FUJIFILM Corporation (JP) 2021-10-13 EP disclosed
US-20210302835-A1 PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD, CURED FILM, LAMINATE, AND DEVICE FUJIFILM CORPORATION (JP) 2021-09-30 US disclosed
US-5418276-A Styrene copolymer, syndiotactic, heat resistance, chemical resistance IDEMITSU KOSAN CO., LTD. (JP) 1995-05-23 US disclosed
US-5418290-A Compatability with other resins, adhesion IDEMITSU KOSAN CO., LTD. (JP) 1995-05-23 US disclosed
US-5391626-A Syndiotactic, high performance, compatibility and adhesiveness; molding materials IDEMITSU KOSAN CO., LTD. (JP) 1995-02-21 US disclosed
US-5369196-A Production process of olefin based polymers IDEMITSU KOSAN CO., LTD. (JP) 1994-11-29 US disclosed
US-5362814-A Styrene polymers with olefin monomers and diolefin monomers for impact strength in molding materials IDEMITSU KOSAN CO., LTD. (JP) 1994-11-08 US disclosed
EP-0570931-A2 Styrenic polymer, process for producing same and multi-layer material comprising same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-11-24 EP disclosed
EP-0570932-A2 Styrenic block copolymer and process for producing same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-11-24 EP disclosed
EP-0559108-A1 Graft copolymer, process for production thereof and resin composition containing same IDEMITSU KOSAN COMPANY LIMITED (JP) 1993-09-08 EP disclosed
EP-0513380-A1 PROCESS FOR PRODUCING OLEFINIC POLYMER IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-11-19 EP disclosed
EP-0504418-A1 PROCESS FOR PRODUCING CYCLOOLEFIN POLYMER, CYCLOOLEFIN COPOLYMER, AND COMPOSITION AND MOLDING PREPARED THEREFROM IDEMITSU KOSAN COMPANY LIMITED (JP) 1992-09-23 EP disclosed