SCHEMBL443829

SCHEMBL443829

ON1C(c2ccccc2)CCCC1c1ccccc1

nearest known ligand 0.55

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 1/20 0.55
GAA P10253 1/20 0.55
CHRNB2 P17787 1/20 0.53
CHRNB4 P30926 1/20 0.53
CHRNA3 P32297 1/20 0.53
CHRNA7 P36544 1/20 0.53
CHRNA4 P43681 1/20 0.53
RIPK1 Q13546 4/20 0.46
SLC18A3 Q16572 1/20 0.42
MEN1 O00255 1/20 0.41
POLB P06746 1/20 0.41
KMT2A Q03164 1/20 0.41
RECQL P46063 1/20 0.40
HSP90AA1 P07900 1/20 0.40
HSP90AB1 P08238 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL442162 0.91 ALDH1A1 (0.54) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL3237316 0.78 CHRNB2 (0.60) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL443828 0.77 CHRNB2 (0.53) ALDH1A1CHRNB2CHRNB4CHRNA3CHRNA7
SCHEMBL8553883 0.77 CHRNA7 (0.45) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL352232 0.77 CHRNB2 (0.53) ALDH1A1GAACHRNB2CHRNB4CHRNA3
Ethylene SCHEMBL8556936 0.75 GAA (0.42) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL28167716 0.73 RIPK1 (0.49) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL4868104 0.72 CHRNB2 (0.48) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL14065401 0.72 CHRNB2 (0.48) ALDH1A1GAACHRNB2CHRNB4CHRNA3
SCHEMBL4868111 0.72 CHRNB2 (0.48) ALDH1A1GAACHRNB2CHRNB4CHRNA3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8309658-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-11-13 US disclosed
US-8138268-B2 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-20 US disclosed
US-20120063109-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2012-03-15 US disclosed
US-20110176288-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE HITACHI CHEMICAL COMPANY LTD. (JP) 2011-07-21 US disclosed
EP-2246400-A1 Circuit connecting material Hitachi Chemical Co., Ltd. (JP) 2010-11-03 EP disclosed
EP-1754762-A1 ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE Hitachi Chemical Co., Ltd. (JP) 2007-02-21 EP disclosed