SCHEMBL443948

SCHEMBL443948

CCCCOCC(C)OC(=O)CC

nearest known ligand 0.44

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.41
LMNA P02545 2/20 0.39
TDP1 Q9NUW8 1/20 0.39
FAAH O00519 4/20 0.38
CNR1 P21554 1/20 0.38
CNR2 P34972 1/20 0.38
PLA2G2C Q5R387 1/20 0.38
USP2 O75604 1/20 0.38
SPHK1 Q9NYA1 1/20 0.38
TSHR P16473 1/20 0.38
HTT P42858 1/20 0.37
ALDH1A1 P00352 1/20 0.36
HSD17B10 Q99714 1/20 0.36
CYP1A2 P05177 1/20 0.36
CYP3A4 P08684 1/20 0.36
CYP2C19 P33261 1/20 0.36
CES2 O00748 1/20 0.36
MAPT P10636 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7205921 0.93 NAAA (0.52) NAAALMNAFAAHCNR1CNR2
SCHEMBL445697 0.89 TDP1 (0.50) NAAALMNATDP1FAAHCNR1
SCHEMBL27625739 0.88 TDP1 (0.40) NAAALMNATDP1FAAHCNR1
SCHEMBL7037545 0.87 LMNA (0.46) LMNATDP1FAAHCNR1CNR2
SCHEMBL27628046 0.87 TDP1 (0.42) LMNATDP1FAAHCNR1CNR2
SCHEMBL2230726 0.87 LMNA (0.50) LMNATDP1TSHRALDH1A1CYP1A2
SCHEMBL18157282 0.87 NAAA (0.46) NAAALMNATDP1FAAHCNR1
SCHEMBL1091854 0.86 LMNA (0.58) LMNAALDH1A1MAPT
SCHEMBL1091356 0.86 LMNA (0.58) LMNAALDH1A1MAPT
SCHEMBL1470241 0.85 PLA2G2C (0.44) LMNATDP1PLA2G2CUSP2SPHK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 245 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed
US-20250180989-A1 COMPOSITION FOR PRETREATMENT NISSAN CHEMICAL CORPORATION (JP) 2025-06-05 US disclosed
WO-2025071108-A1 RESIN COMPOSITION FOR ANTI-REFLECTIVE FILM, ANTI-REFLECTIVE FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2025-04-03 WO disclosed
CN-118830065-A Pretreatment composition 日产化学株式会社 2024-10-22 CN disclosed
WO-2024158178-A1 THERMOSETTING RESIN COMPOSITION, CURED FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-08-02 WO disclosed
CN-118344798-A Aqueous 2K coating composition 巴斯夫涂料有限公司 2024-07-16 CN disclosed
WO-2024147537-A1 RESIN COMPOSITION FOR ANTI-REFLECTION FILM, ANTI-REFLECTION FILM, AND SOLID-STATE IMAGING DEVICE 동우 화인켐 주식회사 2024-07-11 WO disclosed
CN-109976097-B Method of forming micropattern and substrate processing apparatus 三星电子株式会社 2024-06-18 CN disclosed
CN-110007563-B Negative photosensitive resin composition, spacer, protective film, and liquid crystal display element 奇美实业股份有限公司 2024-04-02 CN disclosed
CN-111324013-B Chemically amplified positive photosensitive resin composition and application thereof 奇美实业股份有限公司 2023-12-01 CN disclosed
US-20030064303-A1 Composition having refractive index sensitively changeable by radiation and method for forming refractive index pattern JSR CORPORATION (JP) 2003-04-03 US disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-1235104-A1 COMPOSITION HAVING REFRACTIVE INDEX SENSITIVELY CHANGEABLE BY RADIATION AND METHOD FOR FORMING REFRACTIVE INDEX PATTERN JSR Corporation (JP) 2002-08-28 EP disclosed
US-6399267-B1 COPOLYMER CONTAINING UNSATURATED CARBOXY ACID OR ANHYDRIDE AND MONOMER OF EPOXY CONTAINING ACRYLIC ESTER JSR CORPORATION (JP) 2002-06-04 US disclosed
US-20020055059-A1 Radiation sensitive resin composition, cathode separator and el display device JSR CORPORATION (JP) 2002-05-09 US disclosed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US disclosed
EP-1193557-A1 Use of a radiation sensitive resin composition for the formation of cathode separator, cathode separator and electroluminescent display device JSR Corporation (JP) 2002-04-03 EP disclosed
US-20010044075-A1 Radiation sensitive resin composition for forming barrier ribs for an EL display element, barrier rib and EL display element JSR CORPORATION (JP) 2001-11-22 US disclosed
EP-1150165-A1 Radiation sensitive resin composition for forming barrier ribs for an el display element, barrier ribs and el display element JSR Corporation (JP) 2001-10-31 EP disclosed
EP-1057859-A2 Radiation sensitive resin composition and use of the same in an interlaminar insulating film JSR Corporation (JP) 2000-12-06 EP disclosed