SCHEMBL445697

SCHEMBL445697

CCCOCC(C)OC(=O)CC

nearest known ligand 0.50

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 1/20 0.50
HSD17B10 Q99714 1/20 0.48
NAAA Q02083 1/20 0.35
FAAH O00519 4/20 0.33
LMNA P02545 2/20 0.33
CNR1 P21554 1/20 0.33
CNR2 P34972 1/20 0.33
ALDH1A1 P00352 1/20 0.33
CYP2C19 P33261 2/20 0.33
MEN1 O00255 1/20 0.33
RECQL P46063 1/20 0.33
KMT2A Q03164 1/20 0.33
USP2 O75604 1/20 0.32
CYP1A2 P05177 1/20 0.32
CYP3A4 P08684 1/20 0.32
HTT P42858 1/20 0.32
LPAR5 Q9H1C0 1/20 0.31
MAPT P10636 1/20 0.31
PLA2G2C Q5R387 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11290293 0.93 TDP1 (0.58) TDP1HSD17B10NAAAFAAHLMNA
SCHEMBL443948 0.89 NAAA (0.41) TDP1HSD17B10NAAAFAAHLMNA
SCHEMBL27628089 0.86 TDP1 (0.53) TDP1HSD17B10FAAHLMNACNR1
SCHEMBL12927825 0.86 TDP1 (0.48) TDP1HSD17B10FAAHLMNACNR1
SCHEMBL27646125 0.86 ALDH1A1 (0.41) TDP1HSD17B10NAAAALDH1A1CYP2C19
SCHEMBL7205921 0.85 NAAA (0.52) NAAAFAAHLMNACNR1CNR2
SCHEMBL13397846 0.85 NAAA (0.41) TDP1HSD17B10NAAAALDH1A1CYP2C19
SCHEMBL104602 0.83 MEN1 (0.34) TDP1FAAHLMNACNR1CNR2
SCHEMBL22442289 0.83 TDP1 (0.53) TDP1HSD17B10LMNACYP2C19USP2
SCHEMBL27646138 0.83 TDP1 (0.38) TDP1HSD17B10LMNAALDH1A1CYP2C19

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 342 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113260922-B Positive photosensitive resin composition 株式会社东进世美肯 2025-02-25 CN claimed
US-12216403-B2 Positive photosensitive resin composition and display device using the same DONJIN SEMICHEM CO., LTD. (KR) 2025-02-04 US claimed
CN-110967927-B Photosensitive resin composition and display device including the same 三星显示有限公司 2025-01-28 CN claimed
US-20240118616-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION AND DISPLAY DEVICE USING THE SAME DONGJIN SEMICHEM CO., LTD. (KR) 2024-04-11 US claimed
CN-108572516-B Positive photosensitive resin composition, display device and pattern forming method thereof 株式会社东进世美肯 2023-10-17 CN claimed
CN-116648671-A Negative photosensitive resin composition capable of realizing low-temperature curing and low refractive index 株式会社东进世美肯 2023-08-25 CN claimed
US-20230212387-A1 LOW-REFRACTIVE-INDEX THERMOSETTING COMPOSITION, OPTICAL MEMBER FORMED THEREFROM, AND DISPLAY DEVICE DONGJIN SEMICHEM CO., LTD. (KR) 2023-07-06 US claimed
CN-116057089-A Low refractive thermosetting composition, optical member and display device using the same 株式会社东进世美肯 2023-05-02 CN claimed
WO-2022145795-A1 NEGATIVE PHOTO-SENSITIVE RESIN COMPOSITION WITH LOW-TEMPERATURE CURABILITY AND LOW REFRACTIVE INDEX 주식회사 동진쎄미켐 2022-07-07 WO claimed
CN-114556216-A Positive photosensitive resin composition and display element using the same 株式会社东进世美肯 2022-05-27 CN claimed
EP-3040370-B1 POSITIVE PHOTOSENSITIVE SILOXANE RESIN COMPOSITION AND DISPLAY DEVICE FORMED USING THE SAME SAMSUNG DISPLAY CO LTD (KR) 2019-02-06 EP claimed
US-9857682-B2 Positive photosensitive siloxane resin composition and display device formed using the same SAMSUNG DISPLAY CO., LTD. (KR) 2018-01-02 US claimed
US-20160195810-A1 POSITIVE PHOTOSENSITIVE SILOXANE RESIN COMPOSITION AND DISPLAY DEVICE FORMED USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2016-07-07 US claimed
EP-3040370-A1 POSITIVE PHOTOSENSITIVE SILOXANE RESIN COMPOSITION AND DISPLAY DEVICE FORMED USING THE SAME Samsung Display Co., Ltd. (KR) 2016-07-06 EP claimed
US-8492459-B2 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2013-07-23 US claimed
US-8278021-B2 Method of fabricating a thin film transistor substrate and a photosensitive composition used in the thin film transistor substrate SAMSUNG ELECTRONICS CO., LTD. (KR) 2012-10-02 US claimed
US-20090176936-A1 Ink composition and method of forming a pattern using the same LG DISPLAY CO., LTD. (KR) 2009-07-09 US claimed
US-20090030103-A1 METHOD OF FABRICATING A THIN FILM TRANSISTOR SUBSTRATE AND A PHOTOSENSITIVE COMPOSITION USED IN THE THIN FILM TRANSISTOR SUBSTRATE SAMSUNG ELECTRONICS CO., LTD. (KR) 2009-01-29 US claimed
US-6794108-B1 COMPOUND CAPABLE OF GENERATING ACID BY ACTINIC RADIATION; POLYMER AND COMPOUND THAT DECOMPOSE TO A SULFONIC ACID; STORAGE STABILITY FUJI PHOTO FILM CO., LTD. (JP) 2004-09-21 US claimed
US-6379860-B1 RESIN OBTAINED BY REACTION OF ALKALI-SOLUBLE RESIN HAVING PHENOLIC HYDROXYL GROUPS WITH ENOL ETHER DECOMPOSES IN ACID TO INCREASE SOLUBILITY; HEAT RESISTANCE, SENSITIVIY, RESOLUTION; GENERATES ACID UPON ACTINIC RADIATION EXPOSURE FUJI PHOTO FILM CO., LTD. (JP) 2002-04-30 US claimed