SCHEMBL444098

SCHEMBL444098

CC(C)c1nc(C(C)C#N)c[nH]1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9063964 0.80
SCHEMBL786437 0.79 NOS3 (0.31)
SCHEMBL153673 0.78
Ammonia Solution, Strong SCHEMBL28135320 0.77 NOS3 (0.30)
Hydrochloric Acid SCHEMBL28150542 0.77 NOS3 (0.30)
SCHEMBL28079964 0.77 NOS3 (0.30)
SCHEMBL31256609 0.77
SCHEMBL3420919 0.74
SCHEMBL10363731 0.74
SCHEMBL22167638 0.72 CAMKK2 (0.32)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 310 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180148600-A1 ABRASION RESISTANT COATING COMPOSITION WITH INORGANIC METAL OXIDES MOMENTIVE PERFORMANCE MATERIALS INC. 2018-05-31 US claimed
US-9969878-B2 Polyalkylene carbonate resin composition having high thermal stability SK INNOVATION CO., LTD. (KR) 2018-05-15 US claimed
CN-105566878-A Polyalkylene Carbonate Resin Composition Having High Thermal Stability SK INNOVATION CO LTD 2016-05-11 CN claimed
US-20160122535-A1 Polyalkylene Carbonate Resin Composition Having High Thermal Stability SK INNOVATION CO, LTD. (KR) 2016-05-05 US claimed
US-9309381-B2 Epoxy resin compositions using solvated solids AIR PRODUCTS AND CHEMICALS, INC. (US) 2016-04-12 US claimed
EP-2746328-A1 Epoxy resin compositions using solvated solids AIR PRODUCTS AND CHEMICALS, INC. (US) 2014-06-25 EP claimed
US-20140171551-A1 Epoxy Resin Compositions Using Solvated Solids AIR PRODUCTS AND CHEMICALS INC. (US) 2014-06-19 US claimed
CN-103865035-A Epoxy resin compositions using solvated solids AIR PROD & CHEM 2014-06-18 CN claimed
EP-2723793-A1 EPOXY RESIN COMPOSITIONS Air Products and Chemicals, Inc. (US) 2014-04-30 EP claimed
CN-103619899-A Epoxy resin composition AIR PROD & CHEM 2014-03-05 CN claimed
WO-2012174989-A1 EPOXY RESIN COMPOSITIONS AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-27 WO claimed
US-20120328811-A1 Epoxy Resin Compositions AIR PRODUCTS AND CHEMICALS, INC. (US) 2012-12-27 US claimed
EP-0867480-A2 Cationically electrodepositable coating composition KANSAI PAINT CO., LTD. (JP) 1998-09-30 EP claimed
EP-0554817-B1 Epoxy resin composition and cured product thereof MITSUBISHI CHEM CORP (JP) 1998-08-19 EP claimed
US-5322864-A Low viscosity epoxy resin, liquid curing agent, metal powder MITSUBISHI PETROCHEMICAL CO., LTD. (JP) 1994-06-21 US claimed
EP-0554817-A1 Epoxy resin composition and cured product thereof MITSUBISHI CHEMICAL CORPORATION (JP) 1993-08-11 EP claimed
US-20260060129-A1 METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE AND APPARATUS FOR MANUFACTURING THE SAME SAMSUNG ELECTRONICS CO., LTD. (KR) 2026-02-26 US disclosed
US-20250361425-A1 BRITTLE ADHESIVE SHEET AND BRITTLE ADHESIVE SHEET PRODUCTION METHOD LINTEC CORP (JP) 2025-11-27 US disclosed
US-4401499-A LAMINATION SUMITOMO BAKELITE COMPANY LIMITED (JP) 1983-08-30 US disclosed
US-4107098-A HALOMETHYOXIRANE IS REACTED WITH AN IMIDAZOLE COMPOUND-PRODUCT REACTED WITH POLYFUNCTIONAL EPOXY COMPOUND MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1978-08-15 US disclosed