SCHEMBL4448002

SCHEMBL4448002

CCO[Si](C)(OCC)c1ccc(N)cc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TDP1 Q9NUW8 6/20 0.45
TSHR P16473 4/20 0.45
CYP3A4 P08684 6/20 0.38
LMNA P02545 2/20 0.38
CYP1A2 P05177 1/20 0.38
MAOA P21397 1/20 0.38
ALDH1A1 P00352 5/20 0.35
MAPK1 P28482 2/20 0.35
GFER P55789 2/20 0.35
PSMD14 O00487 1/20 0.35
RECQL P46063 1/20 0.35
L3MBTL1 Q9Y468 1/20 0.35
MAPT P10636 5/20 0.35
MEN1 O00255 1/20 0.35
KMT2A Q03164 1/20 0.35
GAA P10253 2/20 0.33
ACHE P22303 1/20 0.33
PKM P14618 1/20 0.33
KDM4E B2RXH2 2/20 0.32
NPC1 O15118 2/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL707974 0.89 NQO1 (0.33)
SCHEMBL9804106 0.83 MAPT (0.38) TDP1TSHRCYP3A4LMNACYP1A2
SCHEMBL2616663 0.83 TDP1 (0.45) TDP1TSHRCYP3A4LMNACYP1A2
SCHEMBL25168728 0.82 ESR1 (0.33) CYP3A4CYP1A2ALDH1A1MEN1KMT2A
SCHEMBL483106 0.80 TDP1 (0.46) TDP1TSHRCYP3A4LMNACYP1A2
SCHEMBL3482055 0.80 ACHE (0.36) TDP1TSHRLMNACYP1A2ALDH1A1
SCHEMBL12458732 0.80
SCHEMBL12458718 0.80
SCHEMBL8505226 0.80 TDP1 (0.46) TDP1TSHRCYP3A4LMNACYP1A2
SCHEMBL3482149 0.78 TP53 (0.37) TDP1TSHRALDH1A1MAPK1L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US claimed
CN-110857371-B Cured film and color filter 捷恩智株式会社 2023-05-30 CN disclosed
US-11485877-B2 Structure body, sensor, and method for producing structure body DENSO CORPORATION (JP) 2022-11-01 US disclosed
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US disclosed
US-20210017420-A1 STRUCTURE BODY, SENSOR, AND METHOD FOR PRODUCING STRUCTURE BODY DENSO CORPORATION (JP) 2021-01-21 US disclosed
WO-2019193943-A1 STRUCTURE BODY, SENSOR, AND STRUCTURE BODY PRODUCTION METHOD 株式会社デンソー 2019-10-10 WO disclosed
WO-2019193943-A1 STRUCTURE BODY, SENSOR, AND STRUCTURE BODY PRODUCTION METHOD 株式会社デンソー 2019-10-10 WO disclosed
CN-109423192-A Thermosetting composition, cured film and colored filter 捷恩智株式会社 2019-03-05 CN disclosed
CN-109401605-A Thermosetting composition, cured film and colored filter 捷恩智株式会社 2019-03-01 CN disclosed
CN-104098756-B Thermoset composition, cured film and the electronic component with this cured film 捷恩智株式会社 2018-10-19 CN disclosed
CN-107608178-A Photosensitive composite and cured film 捷恩智株式会社 2018-01-19 CN disclosed
CN-107589632-A Photosensitive composite and cured film 捷恩智株式会社 2018-01-16 CN disclosed
CN-106554618-A Thermosetting compositionss and application thereof 捷恩智株式会社 2017-04-05 CN disclosed
CN-105086316-A Thermosetting compositions, harden film, color filter, liquid crystal displaying element, solid camera shooting element and light emitting diode illuminant JNC CORP 2015-11-25 CN disclosed
CN-104098756-A Thermosetting Composition, Curing Film, And Electronic Part Possessing Curing Film JNC CORP 2014-10-15 CN disclosed
US-20090026425-A1 COMPOSITION COMPRISING POLYESTER AMIDE ACID AND THE LIKE AND INK-JET INK COMPOSITION USING THE SAME CHISSO CORPORATION (JP) 2009-01-29 US disclosed
US-20080152845-A1 excellent in flatness; heat resistance; solvent resistance, chemical resistance such as acid resistance, alkali resistance; water resistance, ability to adhere to glass substrate; transparency, scratch resistance, coatability and light resistance; polyester amide acid; epoxy resin; curing agent CHISSO CORPORATION 2008-06-26 US disclosed
CN-1173886-A Polyamic acid, polyimide film and liquid crystal aligning film and liquid crystal display element CHISSO CORP (JP) 1998-02-18 CN disclosed
EP-0190487-B1 SOLUBLE POLYIMIDE-SILOXANE PRECURSOR AND PROCESS FOR PRODUCING IT Chisso Corporation (JP) 1990-07-11 EP disclosed
EP-0190487-A2 Soluble polyimide-siloxane precursor and process for producing it Chisso Corporation (JP) 1986-08-13 EP disclosed