SCHEMBL4455970

SCHEMBL4455970

O=C1NCCNCCNC(=O)c2ccccc2C(=O)NCCNCCNC(=O)c2ccccc21

nearest known ligand 0.57

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PARP1 P09874 8/20 0.57
PARP11 Q9NR21 7/20 0.57
PARP10 Q53GL7 6/20 0.57
PDPK1 O15530 1/20 0.57
CA12 O43570 1/20 0.50
CA9 Q16790 1/20 0.50
GSK3B P49841 1/20 0.50
CASP3 P42574 1/20 0.43
CASP2 P42575 1/20 0.43
CASP7 P55210 1/20 0.43
CASP6 P55212 1/20 0.43
CASP8 Q14790 1/20 0.43
PIM1 P11309 1/20 0.39
CSNK1A1 P48729 1/20 0.39
CDK5 Q00535 1/20 0.39
ROCK1 Q13464 1/20 0.39
DYRK1A Q13627 1/20 0.39
LRRK2 Q5S007 1/20 0.39
CLK4 Q9HAZ1 1/20 0.39
DYRK1B Q9Y463 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Phthalimide SCHEMBL28810882 0.83 GSK3B (0.75) PARP1PARP11PARP10PDPK1CA12
SCHEMBL13947955 0.83 PARP1 (0.53) PARP1PARP11PARP10PDPK1CA12
SCHEMBL19057220 0.83 PARP1 (0.53) PARP1PARP11PARP10PDPK1CA12
Piperazine SCHEMBL28321362 0.81 PARP10 (0.89) PARP1PARP11PARP10PDPK1CA12
SCHEMBL14424710 0.81 PARP1 (0.41) PARP1PARP11PARP10PDPK1CASP3
SCHEMBL700485 0.79 PARP10 (0.55) PARP1PARP11PARP10PDPK1CA12
Phthalimide SCHEMBL14861040 0.77 GSK3B (0.65) PARP1PARP11PARP10PDPK1CA12
SCHEMBL3296103 0.77 PARP11 (0.64) PARP1PARP11PARP10PDPK1CA12
SCHEMBL20953726 0.77 ACHE (0.52) PARP1PARP11PARP10PDPK1CA12
Hydrochloric Acid SCHEMBL30124058 0.77 PARP10 (0.53) PARP1PARP11PARP10PDPK1CA12

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12555704-B2 Method for jacketing elongate articles, in particular lines TESA SE (DE) 2026-02-17 US disclosed
EP-4004951-B1 METHOD FOR JACKETING ELONGATE ARTICLES, IN PARTICULAR LINES TESA SE (DE) 2024-02-14 EP disclosed
CN-114174456-B Method for wrapping elongated objects, in particular wires 德莎欧洲股份公司 2023-08-15 CN disclosed
WO-2022253985-A1 ADHESIVE TAPE AND METHOD FOR COVERING ELONGATE ARTICLES, IN PARTICULAR LINES TESA SE (DE) 2022-12-08 WO disclosed
CN-112175546-B Heat curable adhesive and adhesive tape made therefrom 德莎欧洲股份公司 2022-11-22 CN disclosed
US-20220282127-A1 METHOD FOR JACKETING ELONGATE ARTICLES, IN PARTICULAR LINES TESA SE (DE) 2022-09-08 US disclosed
EP-3760686-B1 THERMOSETTING ADHESIVE AND ADHESIVE TAPE MADE FROM SAME TESA SE (DE) 2022-09-07 EP disclosed
EP-4004951-A1 METHOD FOR JACKETING ELONGATE ARTICLES, IN PARTICULAR LINES tesa SE (DE) 2022-06-01 EP disclosed
CN-114174456-A Method for sheathing an elongated object, in particular a wire 德莎欧洲股份公司 2022-03-11 CN disclosed
US-20210002521-A1 THERMALLY CURING ADHESIVE AND ADHESIVE TAPE PRODUCED THEREFROM TESA SE (DE) 2021-01-07 US disclosed
EP-3760686-A1 THERMOSETTING ADHESIVE AND ADHESIVE TAPE MADE FROM SAME tesa SE (DE) 2021-01-06 EP disclosed
CN-112175546-A Heat-curable adhesive and adhesive tape produced therefrom 德莎欧洲股份公司 2021-01-05 CN disclosed
US-20090324958-A1 Heat Setting Compounds Suitable for Sticking Together Coated Substrates SIKA TECHNOLOGY AG (CH) 2009-12-31 US disclosed
US-7410673-B2 BLEND CURABLE AT A LOW AND HIGH TEMPERATURE OF AN EPOXY RESIN-UNSATURATED ALIPHATIC ACID ADDUCT, A (METH)ACRYLATE, A FREE RADICAL INITIATOR, A CRYSTALLIZABLE EPOXY RESIN, AND LATENT CURING AGENT; SMOOTH UNDERCOATINGS FOR CIRCUIT BOARDS SAN-EI KAGAKU CO., LTD. (JP) 2008-08-12 US disclosed
US-7410673-B2 BLEND CURABLE AT A LOW AND HIGH TEMPERATURE OF AN EPOXY RESIN-UNSATURATED ALIPHATIC ACID ADDUCT, A (METH)ACRYLATE, A FREE RADICAL INITIATOR, A CRYSTALLIZABLE EPOXY RESIN, AND LATENT CURING AGENT; SMOOTH UNDERCOATINGS FOR CIRCUIT BOARDS SAN-EI KAGAKU CO., LTD. (JP) 2008-08-12 US disclosed
US-7396885-B2 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board SAN-EI KAGAKU CO., LTD. (JP) 2008-07-08 US disclosed
US-7396885-B2 Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board SAN-EI KAGAKU CO., LTD. (JP) 2008-07-08 US disclosed
EP-1876194-A1 Heat curing composition usable as an adhesive for coated substrates Sika Technology AG (CH) 2008-01-09 EP disclosed
US-4459398-A METAL SALT IMIDAZOLE COMPLEX, DICYANDIAMIDE, DIETHYLENETRIAMINE CYCLIC BISPHTHALAMIDE GENERAL MOTORS CORPORATION (US) 1984-07-10 US disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-12555704-B2 Method for jacketing elongate articles, in particular lines TPM4, CNTN1, ELL PARP1 1227/4885PARP11 2632/4885PARP10 2722/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.