SCHEMBL4456112

SCHEMBL4456112

NC(=O)c1cc2ccccc2cc1OS(=O)(=O)C(F)(F)F

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
IRAK4 Q9NWZ3 1/20 0.52
KDM4E B2RXH2 3/20 0.43
ALDH1A1 P00352 3/20 0.43
HPGD P15428 2/20 0.43
HSD11B1 P28845 1/20 0.42
GAA P10253 1/20 0.41
CTNNB1 P35222 1/20 0.41
EPAS1 Q99814 1/20 0.39
IDO1 P14902 1/20 0.39
IKBKB O14920 1/20 0.39
ADORA2A P29274 1/20 0.37
ADORA1 P30542 1/20 0.37
CA1 P00915 1/20 0.36
CA2 P00918 1/20 0.36
CASP1 P29466 1/20 0.36
KMT2A Q03164 3/20 0.36
MEN1 O00255 2/20 0.36
MAPT P10636 1/20 0.36
TSHR P16473 1/20 0.36
HSD17B10 Q99714 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL852699 0.83 KDM4E (0.48) KDM4EALDH1A1HPGDHSD11B1EPAS1
SCHEMBL31150577 0.83 KDM4E (0.48) KDM4EALDH1A1HPGDHSD11B1EPAS1
SCHEMBL3653595 0.81 CTNNB1 (0.53) IRAK4KDM4EALDH1A1HPGDCTNNB1
SCHEMBL11955735 0.80 KDM4E (0.47) KDM4EALDH1A1HPGDHSD11B1GAA
SCHEMBL31442188 0.78 CA1 (0.40) KDM4EALDH1A1HPGDHSD11B1ADORA2A
SCHEMBL4453527 0.78 MEN1 (0.41) IRAK4KDM4EALDH1A1HPGDGAA
SCHEMBL16332676 0.78 GPR84 (0.39) KDM4EALDH1A1HPGDHSD11B1ADORA2A
SCHEMBL7658363 0.78 KDM4E (0.43) IRAK4KDM4EALDH1A1HPGDHSD11B1
SCHEMBL20017913 0.76 ADORA2A (0.38) KDM4EALDH1A1HPGDHSD11B1ADORA2A
SCHEMBL6852343 0.74 NQO1 (0.46) HSD11B1ADORA2AADORA1CA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2469337-A1 Positive photosensitive resin composition, method for forming pattern, and electronic component Hitachi Chemical DuPont MicroSystems Ltd. (JP) 2012-06-27 EP disclosed
US-7638254-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD (JP) 2009-12-29 US disclosed
US-20090011364-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC PART HATTORI TAKASHI 2009-01-08 US disclosed
US-7435525-B2 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2008-10-14 US disclosed
US-20070122733-A1 Positive photosensitive resin composition, method for forming pattern, and electronic part HITACHI CHEMICAL DUPONT MICROSYSTEMS LTD. (JP) 2007-05-31 US disclosed
EP-1744213-A1 POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, AND ELECTRONIC COMPONENT Hitachi Chemical DuPont Microsystems Ltd. (JP) 2007-01-17 EP disclosed