Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.55 |
| ▸ | GAA | P10253 | 8/20 | 0.54 |
| ▸ | MGAM | O43451 | 7/20 | 0.54 |
| ▸ | AMY1A | P0DUB6 | 7/20 | 0.54 |
| ▸ | SI | P14410 | 7/20 | 0.54 |
| ▸ | MGAM2 | Q2M2H8 | 7/20 | 0.54 |
| ▸ | RAB9A | P51151 | 5/20 | 0.54 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.54 |
| ▸ | MAPT | P10636 | 1/20 | 0.54 |
| ▸ | SLC9A1 | P19634 | 5/20 | 0.51 |
| ▸ | APAF1 | O14727 | 1/20 | 0.51 |
| ▸ | POLB | P06746 | 1/20 | 0.51 |
| ▸ | NPC1 | O15118 | 3/20 | 0.49 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.49 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.49 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.49 |
| ▸ | GRM2 | Q14416 | 1/20 | 0.49 |
| ▸ | MEN1 | O00255 | 1/20 | 0.48 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.48 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2070662 | 0.79 | GAA (0.67) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL8631037 | 0.78 | SLC9A1 (0.59) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL3675871 | 0.78 | SLC9A1 (0.59) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL9140982 | 0.78 | SLC9A1 (0.56) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL31483490 | 0.78 | SLC9A1 (0.63) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL9138407 | 0.77 | EGLN3 (0.61) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL31483489 | 0.76 | SLC9A1 (0.61) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL20713929 | 0.76 | SLC9A1 (0.56) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL688425 | 0.75 | KDM4E (0.57) | EGLN3GAAMGAMAMY1ASI | |
| SCHEMBL6846939 | 0.75 | EGLN3 (0.68) | EGLN3GAAMGAMAMY1ASI |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 130 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0960725-B1 | Resin-coated composite foil, production and use thereof | MITSUI MINING & SMELTING CO (JP) | 2008-03-12 | — | — | EP | claimed |
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | claimed |
| US-20250227856-A1 | METHOD FOR PRODUCING PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR AND MULTILAYER PRINTED WIRING BOARD | MITSUI MINING & SMELTING CO., LTD. (JP) | 2025-07-10 | — | — | US | disclosed |
| WO-2025094612-A1 | PRINTED WIRING BOARD MANUFACTURING METHOD | 三井金属鉱業株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2025094611-A1 | METHOD FOR MANUFACTURING PRINTED WIRING BOARD | 三井金属鉱業株式会社 | 2025-05-08 | — | — | WO | disclosed |
| WO-2024219326-A1 | METAL LAMINATE, METHOD FOR MANUFACTURING SAME, AND PRINTED WIRING BOARD | 東洋鋼鈑株式会社 | 2024-10-24 | — | — | WO | disclosed |
| WO-2024181323-A1 | METHOD FOR PRODUCING PRINTED WIRING BOARD | ＭＧＣエレクトロテクノ株式会社 | 2024-09-06 | — | — | WO | disclosed |
| WO-2024043196-A1 | LAMINATE, AND METHOD FOR MANUFACTURING CORELESS SUBSTRATE | ＭＧＣエレクトロテクノ株式会社 | 2024-02-29 | — | — | WO | disclosed |
| WO-2023189300-A1 | METHOD FOR PRODUCING PRINTED WIRING BOARD WITH BUILT-IN CAPACITOR AND MULTILAYER PRINTED WIRING BOARD | 三井金属鉱業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023189565-A1 | CARRIER-ATTACHED METAL FOIL, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | 三井金属鉱業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| WO-2023189566-A1 | METAL FOIL WITH CARRIER, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD | 三井金属鉱業株式会社 | 2023-10-05 | — | — | WO | disclosed |
| EP-1184165-A1 | ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL | Mitsui Mining & Smelting Co., Ltd. (JP) | 2002-03-06 | — | — | EP | disclosed |
| US-20020005249-A1 | Method for producing copper-clad laminate | MITSUI MINING & SMELTING CO., LTD. (JP) | 2002-01-17 | — | — | US | disclosed |
| US-20020004124-A1 | Copper foil circuit with a carrier, method for manufacturing printed wiring board using the same, and printed wiring board | MITSUI MINING & SMELTING CO., LTD. (JP) | 2002-01-10 | — | — | US | disclosed |
| EP-1170400-A1 | ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME | Mitsui Mining & Smelting Co., Ltd. (JP) | 2002-01-09 | — | — | EP | disclosed |
| US-6319620-B1 | MULTILAYER FOIL WITH RELEASE LAYER BETWEEN METAL CARRIER LAYER AND ULTRATHIN COPPER FOIL | MITSUI MINING & SMELTING CO., LTD. (JP) | 2001-11-20 | — | — | US | disclosed |
| EP-1152069-A1 | ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL | Mitsui Mining & Smelting Co., Ltd. (JP) | 2001-11-07 | — | — | EP | disclosed |
| EP-1102524-A1 | DOUBLE-SIDED PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING MULTILAYER PRINTED WIRING BOARD HAVING THREE OR MORE LAYERS | Mitsui Mining & Smelting Co., Ltd. (JP) | 2001-05-23 | — | — | EP | disclosed |
| JP-2000309898-A | ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL, PRODUCTION OF THE ELECTROLYTIC COPPER FOIL AND COPPER LAMINATED SHEET USING THE ELECTROLYTIC COPPER FOIL | MITSUI MINING & SMELTING CO LTD | 2000-11-07 | — | — | JP | disclosed |
| EP-0960725-A2 | Resin-coated composite foil, production and use thereof | Mitsui Mining & Smelting Co., Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |