Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.57 |
| ▸ | MAPT | P10636 | 1/20 | 0.57 |
| ▸ | RPS6KA3 | P51812 | 1/20 | 0.56 |
| ▸ | EGLN3 | Q9H6Z9 | 1/20 | 0.55 |
| ▸ | RAB9A | P51151 | 6/20 | 0.55 |
| ▸ | NPC1 | O15118 | 4/20 | 0.55 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.55 |
| ▸ | MEN1 | O00255 | 1/20 | 0.55 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.55 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.55 |
| ▸ | GAA | P10253 | 7/20 | 0.54 |
| ▸ | MGAM | O43451 | 6/20 | 0.54 |
| ▸ | AMY1A | P0DUB6 | 6/20 | 0.54 |
| ▸ | SI | P14410 | 6/20 | 0.54 |
| ▸ | MGAM2 | Q2M2H8 | 6/20 | 0.54 |
| ▸ | SLC9A1 | P19634 | 2/20 | 0.51 |
| ▸ | APAF1 | O14727 | 1/20 | 0.51 |
| ▸ | POLB | P06746 | 1/20 | 0.51 |
| ▸ | CYP2C9 | P11712 | 2/20 | 0.49 |
| ▸ | CYP2C19 | P33261 | 2/20 | 0.49 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27414894 | 0.88 | KDM4E (0.56) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL579871 | 0.87 | RPS6KA3 (0.59) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL23066417 | 0.86 | EGLN3 (0.60) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL27537607 | 0.84 | RPS6KA3 (0.56) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL9139443 | 0.84 | RPS6KA3 (0.56) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL438390 | 0.82 | MGAM (0.62) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL9143600 | 0.81 | RPS6KA3 (0.59) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL13604214 | 0.81 | RPS6KA3 (0.52) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL27537609 | 0.79 | KDM4E (0.55) | KDM4EMAPTRPS6KA3EGLN3RAB9A | |
| SCHEMBL2070662 | 0.79 | GAA (0.67) | KDM4EMAPTEGLN3RAB9ANPC1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 81 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0960725-B1 | Resin-coated composite foil, production and use thereof | MITSUI MINING & SMELTING CO (JP) | 2008-03-12 | — | — | EP | claimed |
| US-6652962-B1 | Release layer containing a benzotriazole | MITSUI MINING & SMELTING CO. LTD. (JP) | 2003-11-25 | — | — | US | claimed |
| EP-0930811-B1 | Composite copper foil, process for preparing the same, and copper-clad laminate and printed wiring board using the same | MITSUI MINING & SMELTING CO (JP) | 2003-08-20 | — | — | EP | claimed |
| EP-0960725-A2 | Resin-coated composite foil, production and use thereof | Mitsui Mining & Smelting Co., Ltd. (JP) | 1999-12-01 | — | — | EP | claimed |
| CN-1118797-A | Embossing inhibitor | ARMSTRONG WORLD IND INC (US) | 1996-03-20 | — | — | CN | claimed |
| CN-118339932-A | Wiring substrate with support, method for manufacturing wiring substrate with support, and method for manufacturing electronic component mounting substrate | MGC电子科技有限公司 | 2024-07-12 | — | — | CN | disclosed |
| CN-118234116-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-21 | — | — | CN | disclosed |
| CN-118234118-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-21 | — | — | CN | disclosed |
| CN-118215209-A | Peelable metal foil, metal-clad laminate, wiring board, and semiconductor material | 广州方邦电子股份有限公司 | 2024-06-18 | — | — | CN | disclosed |
| CN-113825316-B | Method for producing laminate and resin layer-attached metal foil | 三井金属矿业株式会社 | 2024-06-11 | — | — | CN | disclosed |
| US-11999131-B2 | Roll-bonded laminate and method for producing the same | TOYO KOHAN CO., LTD. (JP) | 2024-06-04 | — | — | US | disclosed |
| CN-118043958-A | Method for manufacturing package substrate for mounting semiconductor element and laminate with support substrate | MGC电子科技有限公司 | 2024-05-14 | — | — | CN | disclosed |
| US-20040241487-A1 | Electrodeposited copper foil with carrier foil | MITSUI MINING & SMELTING CO., LTD. (JP) | 2004-12-02 | — | — | US | disclosed |
| US-20040188263-A1 | Copper foil with carrier foil, process for producing the same and copper clad laminate including the copper foil with carrier foil | MITSUI MINING & SMELTING CO., LTD. (JP) | 2004-09-30 | — | — | US | disclosed |
| CN-1533450-A | Method for producing electrolytic copper foil with carrier foil for high-temperature heat resistance and electrolytic copper foil produced by the method | ���������kҵ��ʽ���� | 2004-09-29 | — | — | CN | disclosed |
| CN-1335897-A | Electrodeposited copper foil with carrier and copper-clad laminate produced using the electrodeposited copper foil | MITSUI MINING & SMELTING CO (JP) | 2002-02-13 | — | — | CN | disclosed |
| CN-1335898-A | Electrodeposited copper foil with carrier and method for manufacturing the same | MITSUI MINING & SMELTING CO (JP) | 2002-02-13 | — | — | CN | disclosed |
| CN-1328271-A | Colour photographing base material of improved contrast and compatible with dry-and normal developing | EASTMAN KODAK CO (US) | 2001-12-26 | — | — | CN | disclosed |
| EP-0960725-A2 | Resin-coated composite foil, production and use thereof | Mitsui Mining & Smelting Co., Ltd. (JP) | 1999-12-01 | — | — | EP | disclosed |
| CN-1118797-A | Embossing inhibitor | ARMSTRONG WORLD IND INC (US) | 1996-03-20 | — | — | CN | disclosed |