SCHEMBL453146

SCHEMBL453146

CC(C)(C)c1ccc([I+]c2ccc(C(C)(C)C)cc2)cc1.O=S(=O)([O-])c1ccccc1C(F)(F)F

nearest known ligand 0.47

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
HSD11B1 P28845 10/20 0.47
MEN1 O00255 1/20 0.41
KMT2A Q03164 1/20 0.41
SLC22A12 Q96S37 6/20 0.40
FFAR1 O14842 1/20 0.40
FFAR4 Q5NUL3 1/20 0.40
CYP2C9 P11712 2/20 0.39
SLC22A6 Q4U2R8 2/20 0.39
SLC22A8 Q8TCC7 2/20 0.39
SLC22A11 Q9NSA0 2/20 0.39
CA1 P00915 1/20 0.39
CA2 P00918 1/20 0.39
CYP3A4 P08684 1/20 0.39
ALDH1A1 P00352 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL31210331 1.00 HSD11B1 (0.47) HSD11B1MEN1KMT2ASLC22A12FFAR1
SCHEMBL2898439 0.91 HSD11B1 (0.46) HSD11B1MEN1KMT2ASLC22A12CYP2C9
Toliodium SCHEMBL2901082 0.87 SLC22A12 (0.47) HSD11B1MEN1KMT2ASLC22A12FFAR4
SCHEMBL5405451 0.87 HSD11B1 (0.43) HSD11B1MEN1KMT2ASLC22A12CYP2C9
SCHEMBL455243 0.86 MEN1 (0.46) HSD11B1MEN1KMT2ASLC22A12CYP2C9
SCHEMBL4419124 0.84 KDM1A (0.44) HSD11B1MEN1KMT2ASLC22A12CYP2C9
SCHEMBL5416321 0.83 HSD11B1 (0.39) HSD11B1MEN1KMT2ASLC22A12CYP2C9
SCHEMBL5422186 0.83 FFAR4 (0.41) HSD11B1MEN1KMT2ASLC22A12FFAR4
SCHEMBL5445938 0.83 HSD11B1 (0.47) HSD11B1MEN1KMT2ASLC22A12FFAR1
SCHEMBL2966140 0.82 HSD11B1 (0.43) HSD11B1CA1CA2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 317 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3010943-B1 CURABLE COMPOSITION, FILM, AND METHOD OF PRODUCING FILM CANON KK (JP) 2024-04-03 EP disclosed
WO-2024014330-A1 RESIST AUXILIARY FILM COMPOSITION, AND PATTERN FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
WO-2024014329-A1 RESIST COMPOSITION AND RESIST FILM FORMING METHOD USING SAME 三菱瓦斯化学株式会社 2024-01-18 WO disclosed
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-12-26 US disclosed
US-11681227-B2 Enhanced EUV photoresist materials, formulations and processes IRRESISTIBLE MATERIALS LTD (GB) 2023-06-20 US disclosed
US-20230096312-A1 RESIST COMPOSITION AND METHOD FOR USING RESIST COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-03-30 US disclosed
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2023-02-07 US disclosed
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-22 US disclosed
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2022-02-08 US disclosed
EP-3279727-B1 COMPOUND, RESIST COMPOSITION, AND METHOD FOR FORMING RESIST PATTERN USING IT MITSUBISHI GAS CHEMICAL CO (JP) 2021-06-09 EP disclosed
US-6203965-B1 USEFUL AS DEEP ULTRAVIOLET RADIATION PHOTORESISTS SHIPLEY COMPANY, L.L.C. 2001-03-20 US disclosed
US-6200728-B1 Photoresist compositions comprising blends of photoacid generators SHIPLEY COMPANY, L.L.C. 2001-03-13 US disclosed
US-6143460-A PHOTOACID GENERATOR PROVIDING IMPROVED PHOTORESIST RESOLUTION JSR CORPORATION (JP) 2000-11-07 US disclosed
US-6136500-A CONTAINS A PHOTOACID GENERATOR COMPRISING A COMBINATION OF A COMPOUND THAT GENERATES A CARBOXYLIC ACID UPON EXPOSURE TO RADIATION AND ANOTHER COMPOUND THAT GENERATES ANOTHER ACID UPON EXPOSURE TO RADIATION JSR CORPORATION (JP) 2000-10-24 US disclosed
EP-1035436-A1 Resist pattern formation method JSR Corporation (JP) 2000-09-13 EP disclosed
EP-1030221-A1 Photoresist compositions comprising blends of photoacid generators Shipley Company LLC (US) 2000-08-23 EP disclosed
EP-1011029-A2 Radiation-sensitive resin composition JSR Corporation (JP) 2000-06-21 EP disclosed
US-6037107-A EXPOSING TO ACTIVATION RADIATION A POSITIVE WORKING PHOTORESIST COMPRISING AN ALKALI SOLUBLE RESIN SUBSTITUTED WITH AN ACID LABILE BLOCKING GROUP TO GENERATE HALOGENATED SULFONIC ACID BY PHOTOLYSIS SHIPLEY COMPANY, L.L.C. (US) 2000-03-14 US disclosed
EP-0959389-A1 Diazodisulfone compound and radiation-sensitive resin composition JSR Corporation (JP) 1999-11-24 EP disclosed
EP-0898201-A1 Radiation sensitive resin composition JSR Corporation (JP) 1999-02-24 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (4 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-11852970-B2 Material for lithography, production method therefor, composition for lithography, pattern formation method, compound, resin, and method for purifying the compound or the resin SLC39A11, CROCC, TERB1 HSD11B1 2144/4885MEN1 1260/4885KMT2A 2526/4885
US-11256170-B2 Compound, resist composition, and method for forming resist pattern using it RDX, SLC11A2, FBL HSD11B1 2093/4885MEN1 3286/4885KMT2A 1321/4885
US-11572430-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R HSD11B1 2424/4885MEN1 1512/4885KMT2A 633/4885
US-11243467-B2 Compound, resin, resist composition or radiation-sensitive composition, resist pattern formation method, method for producing amorphous film, underlayer film forming material for lithography, composition for underlayer film formation for lithography, method for forming circuit pattern, and purification method C9, C5, C1R HSD11B1 2424/4885MEN1 1512/4885KMT2A 633/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.