⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4456599 | 0.85 | — | — | |
| Sulfuric Acid SCHEMBL31019639 | 0.80 | CA5A (0.50) | — | |
| Trifluoromethanesulfonic Acid SCHEMBL27568072 | 0.76 | ALDH1A1 (0.39) | — | |
| SCHEMBL28624 | 0.75 | — | — | |
| SCHEMBL8936636 | 0.74 | — | — | |
| Methane SCHEMBL25338251 | 0.72 | — | — | |
| SCHEMBL3624969 | 0.72 | CA5A (0.39) | — | |
| SCHEMBL5182405 | 0.72 | — | — | |
| SCHEMBL23883899 | 0.72 | — | — | |
| Fluoride SCHEMBL4448568 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 102 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12559853-B2 | Differential contrast plating for advanced packaging applications | LAM RESEARCH CORPORATION (US) | 2026-02-24 | — | — | US | claimed |
| CN-114514340-B | Differential contrast plating for advanced packaging applications | 朗姆研究公司 | 2025-03-21 | — | — | CN | claimed |
| US-20220275531-A1 | DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS | LAM RESEARCH CORPORATION (US) | 2022-09-01 | — | — | US | claimed |
| US-11371154-B2 | Methods and systems for electrochemical additive manufacturing | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA (US) | 2022-06-28 | — | — | US | claimed |
| CN-114514340-A | Differential contrast plating for advanced packaging applications | 朗姆研究公司 | 2022-05-17 | — | — | CN | claimed |
| US-20210301413-A1 | METHODS AND SYSTEMS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA | 2021-09-30 | — | — | US | claimed |
| US-11008664-B2 | Methods and systems for electrochemical additive manufacturing | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA (US) | 2021-05-18 | — | — | US | claimed |
| US-20190055661-A1 | METHODS AND SYSTEMS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA | 2019-02-21 | — | — | US | claimed |
| US-20160355939-A1 | POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING | LAM RESEARCH CORPORATION | 2016-12-08 | — | — | US | claimed |
| US-8500985-B2 | Photoresist-free metal deposition | NOVELLUS SYSTEMS, INC. (US) | 2013-08-06 | — | — | US | claimed |
| WO-2013090295-A1 | MONITORING LEVELER CONCENTRATIONS IN ELECTROPLATING SOLUTIONS | NOVELLUS SYSTEMS, INC. (US) | 2013-06-20 | — | — | WO | claimed |
| US-8268154-B1 | Selective electrochemical accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2012-09-18 | — | — | US | claimed |
| US-8158532-B2 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2012-04-17 | — | — | US | claimed |
| US-7799200-B1 | Selective electrochemical accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2010-09-21 | — | — | US | claimed |
| US-20090277867-A1 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2009-11-12 | — | — | US | claimed |
| US-7560016-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2009-07-14 | — | — | US | claimed |
| US-7449098-B1 | Selective acceleration planarization: accelerator deposited on a plated surface and mechanically removed; wafer then plated in an electrolyte containing little or no accelerating additives; elimination of need to continually remove the additive from the exposed regions during plating | NOVELLUS SYSTEMS, INC. (US) | 2008-11-11 | — | — | US | claimed |
| US-7449099-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2008-11-11 | — | — | US | claimed |
| US-7405163-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2008-07-29 | — | — | US | claimed |
| US-12559853-B2 | Differential contrast plating for advanced packaging applications | LAM RESEARCH CORPORATION (US) | 2026-02-24 | — | — | US | disclosed |
| US-20250263862-A1 | TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING AND RAMPING | LAM RES CORP (US) | 2025-08-21 | — | — | US | disclosed |
| US-12305307-B2 | TSV process window and fill performance enhancement by long pulsing and ramping | LAM RESEARCH CORPORATION (US) | 2025-05-20 | — | — | US | disclosed |
| CN-114514340-B | Differential contrast plating for advanced packaging applications | 朗姆研究公司 | 2025-03-21 | — | — | CN | disclosed |
| CN-112135930-B | Copper electrical fill on non-copper liner layer | 朗姆研究公司 | 2024-10-29 | — | — | CN | disclosed |
| US-12012667-B2 | Copper electrofill on non-copper liner layers | LAM RESEARCH CORPORATION (US) | 2024-06-18 | — | — | US | disclosed |
| US-20230340686-A1 | ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES | LAM RESEARCH CORPORATION | 2023-10-26 | — | — | US | disclosed |
| US-20230212773-A1 | SURFACE PRETREATMENT FOR ELECTROPLATING NANOTWINNED COPPER | LAM RESEARCH CORPORATION | 2023-07-06 | — | — | US | disclosed |
| CN-116134182-A | Electroplated nano-bicrystal and non-nano-bicrystal copper features | 朗姆研究公司 | 2023-05-16 | — | — | CN | disclosed |
| CN-115874250-A | System for be used for two-sided electroplating | 华天科技（昆山）电子有限公司 | 2023-03-31 | — | — | CN | disclosed |
| US-20230026818-A1 | TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING AND RAMPING | LAM RESEARCH CORPORATION | 2023-01-26 | — | — | US | disclosed |
| CN-115053326-A | Photoresist free electrohydrodynamic jet printing and plating for metal features | 朗姆研究公司 | 2022-09-13 | — | — | CN | disclosed |
| US-20220275531-A1 | DIFFERENTIAL CONTRAST PLATING FOR ADVANCED PACKAGING APPLICATIONS | LAM RESEARCH CORPORATION (US) | 2022-09-01 | — | — | US | disclosed |
| CN-114930502-A | Improving TSV processing window and fill performance through long pulsing and ramping | 朗姆研究公司 | 2022-08-19 | — | — | CN | disclosed |
| US-11371154-B2 | Methods and systems for electrochemical additive manufacturing | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA (US) | 2022-06-28 | — | — | US | disclosed |
| CN-114514340-A | Differential contrast plating for advanced packaging applications | 朗姆研究公司 | 2022-05-17 | — | — | CN | disclosed |
| US-20220010446-A1 | ELECTRODEPOSITION OF NANOTWINNED COPPER STRUCTURES | LAM RESEARCH CORPORATION | 2022-01-13 | — | — | US | disclosed |
| WO-2021236398-A1 | ELECTROPLATING NANOTWINNED AND NON-NANOTWINNED COPPER FEATURES | LAM RESEARCH CORPORATION (US) | 2021-11-25 | — | — | WO | disclosed |
| US-20210301413-A1 | METHODS AND SYSTEMS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA | 2021-09-30 | — | — | US | disclosed |
| CN-113260739-A | Electrodeposition of nano-twin copper structures | 朗姆研究公司 | 2021-08-13 | — | — | CN | disclosed |
| WO-2021158402-A1 | ELECTROHYDRODYNAMIC EJECTION PRINTING AND ELECTROPLATING FOR PHOTORESIST-FREE FORMATION OF METAL FEATURES | LAM RESEARCH CORPORATION (US) | 2021-08-12 | — | — | WO | disclosed |
| US-11078591-B2 | Process for optimizing cobalt electrofill using sacrificial oxidants | LAM RESEARCH CORPORATION (US) | 2021-08-03 | — | — | US | disclosed |
| WO-2021142357-A1 | TSV PROCESS WINDOW AND FILL PERFORMANCE ENHANCEMENT BY LONG PULSING AND RAMPING | LAM RESEARCH CORPORATION (US) | 2021-07-15 | — | — | WO | disclosed |
| US-20210156045-A1 | COPPER ELECTROFILL ON NON-COPPER LINER LAYERS | LAM RESEARCH CORPORATION | 2021-05-27 | — | — | US | disclosed |
| US-11008664-B2 | Methods and systems for electrochemical additive manufacturing | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA (US) | 2021-05-18 | — | — | US | disclosed |
| CN-112135930-A | Copper electro-fill on non-copper liner layer | 朗姆研究公司 | 2020-12-25 | — | — | CN | disclosed |
| US-10774438-B2 | Monitoring electrolytes during electroplating | LAM RESEARCH CORPORATION (US) | 2020-09-15 | — | — | US | disclosed |
| US-10745817-B2 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | NOVELLUS SYSTEMS, INC. (US) | 2020-08-18 | — | — | US | disclosed |
| CN-107858742-B | TSV bath evaluation using field to feature comparisons | 朗姆研究公司 | 2020-06-23 | — | — | CN | disclosed |
| CN-111247633-A | Multiple bath plating of single metals | 朗姆研究公司 | 2020-06-05 | — | — | CN | disclosed |
| US-20190271094-A1 | PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS | LAM RES CORP (US) | 2019-09-05 | — | — | US | disclosed |
| US-10329683-B2 | Process for optimizing cobalt electrofill using sacrificial oxidants | LAM RESEARCH CORPORATION (US) | 2019-06-25 | — | — | US | disclosed |
| US-20190145017-A1 | LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL | NOVELLUS SYSTEMS INC (US) | 2019-05-16 | — | — | US | disclosed |
| US-20190122890-A1 | MULTIBATH PLATING OF A SINGLE METAL | LAM RESEARCH CORPORATION | 2019-04-25 | — | — | US | disclosed |
| US-20190055661-A1 | METHODS AND SYSTEMS FOR ELECTROCHEMICAL ADDITIVE MANUFACTURING | THE BOARD OF TRUSTEES OF THE UNIVERSITY OF ALABAMA | 2019-02-21 | — | — | US | disclosed |
| US-20190010626-A1 | MONITORING ELECTROLYTES DURING ELECTROPLATING | LAM RES CORP (US) | 2019-01-10 | — | — | US | disclosed |
| US-10094038-B2 | Monitoring electrolytes during electroplating | LAM RESEARCH CORPORATION (US) | 2018-10-09 | — | — | US | disclosed |
| US-20180119305-A1 | PROCESS FOR OPTIMIZING COBALT ELECTROFILL USING SACRIFICIAL OXIDANTS | LAM RESEARCH CORPORATION | 2018-05-03 | — | — | US | disclosed |
| CN-107858742-A | Bathed and assessed using the TSV of field and Characteristic Contrast | 朗姆研究公司 | 2018-03-30 | — | — | CN | disclosed |
| US-20180038007-A1 | CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTEM FOR IMPROVED PROCESS STABILITY AND PERFORMANCE | NOVELLUS SYSTEMS INC (US) | 2018-02-08 | — | — | US | disclosed |
| US-20180030611-A1 | METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CONTROLLING CATIONS IN ELECTROLYTE | NOVELLUS SYSTEMS INC (US) | 2018-02-01 | — | — | US | disclosed |
| US-9856574-B2 | Monitoring leveler concentrations in electroplating solutions | NOVELLUS SYSTEMS, INC. (US) | 2018-01-02 | — | — | US | disclosed |
| CN-104233451-B | TSV bath evaluation using field to feature comparisons | 朗姆研究公司 | 2017-11-24 | — | — | CN | disclosed |
| US-9816193-B2 | Configuration and method of operation of an electrodeposition system for improved process stability and performance | NOVELLUS SYSTEMS, INC. (US) | 2017-11-14 | — | — | US | disclosed |
| US-9816196-B2 | Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyte | NOVELLUS SYSTEMS, INC. (US) | 2017-11-14 | — | — | US | disclosed |
| US-20170241041-A1 | TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST | LAM RES CORP (US) | 2017-08-24 | — | — | US | disclosed |
| US-9689083-B2 | TSV bath evaluation using field versus feature contrast | LAM RESEARCH CORPORATION (US) | 2017-06-27 | — | — | US | disclosed |
| US-9677190-B2 | Membrane design for reducing defects in electroplating systems | LAM RESEARCH CORPORATION (US) | 2017-06-13 | — | — | US | disclosed |
| US-20160355939-A1 | POLARIZATION STABILIZER ADDITIVE FOR ELECTROPLATING | LAM RESEARCH CORPORATION | 2016-12-08 | — | — | US | disclosed |
| US-20160298256-A1 | MONITORING ELECTROLYTES DURING ELECTROPLATING | LAM RESEARCH CORPORATION | 2016-10-13 | — | — | US | disclosed |
| US-9412713-B2 | Treatment method of electrodeposited copper for wafer-level-packaging process flow | NOVELLUS SYSTEMS, INC. (US) | 2016-08-09 | — | — | US | disclosed |
| US-20160186356-A1 | MONITORING LEVELER CONCENTRATIONS IN ELECTROPLATING SOLUTIONS | NOVELLUS SYSTEMS INC (US) | 2016-06-30 | — | — | US | disclosed |
| US-20160102416-A1 | LOW COPPER/HIGH HALIDE ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL | NOVELLUS SYSTEMS, INC. | 2016-04-14 | — | — | US | disclosed |
| US-9309605-B2 | Monitoring leveler concentrations in electroplating solutions | NOVELLUS SYSTEMS, INC. (US) | 2016-04-12 | — | — | US | disclosed |
| US-20150345039-A1 | COMPOSITION HAVING ALKALINE PH AND PROCESS FOR FORMING SUPERCONFORMATION THEREWITH | GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, THE NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY | 2015-12-03 | — | — | US | disclosed |
| US-20150122658-A1 | MEMBRANE DESIGN FOR REDUCING DEFECTS IN ELECTROPLATING SYSTEMS | LAM RESEARCH CORPORATION (US) | 2015-05-07 | — | — | US | disclosed |
| US-20150053565-A1 | BOTTOM-UP FILL IN DAMASCENE FEATURES | LAM RESEARCH CORPORATION (US) | 2015-02-26 | — | — | US | disclosed |
| CN-104233451-A | TSV bath evaluation using field to feature comparisons | LAM RES CORP | 2014-12-24 | — | — | CN | disclosed |
| US-20140367279-A1 | TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST | LAM RESEARCH CORPORATION (US) | 2014-12-18 | — | — | US | disclosed |
| US-8795482-B1 | Selective electrochemical accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2014-08-05 | — | — | US | disclosed |
| US-20140209476-A1 | LOW COPPER ELECTROPLATING SOLUTIONS FOR FILL AND DEFECT CONTROL | NOVELLUS SYSTEMS, INC. | 2014-07-31 | — | — | US | disclosed |
| US-20140014522-A1 | PHOTORESIST-FREE METAL DEPOSITION | NOVELLUS SYSTEMS, INC. (US) | 2014-01-16 | — | — | US | disclosed |
| US-20130284604-A1 | METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CONTROLLING CATIONS IN ELECTROLYTE | NOVELLUS SYSTEMS, INC. | 2013-10-31 | — | — | US | disclosed |
| US-8500985-B2 | Photoresist-free metal deposition | NOVELLUS SYSTEMS, INC. (US) | 2013-08-06 | — | — | US | disclosed |
| US-20130161203-A1 | MONITORING LEVELER CONCENTRATIONS IN ELECTROPLATING SOLUTIONS | NOVELLUS SYSTEMS, INC. | 2013-06-27 | — | — | US | disclosed |
| US-8470191-B2 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2013-06-25 | — | — | US | disclosed |
| WO-2013090295-A1 | MONITORING LEVELER CONCENTRATIONS IN ELECTROPLATING SOLUTIONS | NOVELLUS SYSTEMS, INC. (US) | 2013-06-20 | — | — | WO | disclosed |
| CN-102677139-A | Configuration and method of operation of an electrodeposition system for improved process stability and performance | NOVELLUS SYSTEMS INC | 2012-09-19 | — | — | CN | disclosed |
| US-8268154-B1 | Selective electrochemical accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2012-09-18 | — | — | US | disclosed |
| US-20120175263-A1 | CONFIGURATION AND METHOD OF OPERATION OF AN ELECTRODEPOSITION SYSTEM FOR IMPROVED PROCESS STABILITY AND PERFORMANCE | NOVELLUS SYSTEMS, INC. | 2012-07-12 | — | — | US | disclosed |
| US-8158532-B2 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2012-04-17 | — | — | US | disclosed |
| US-20120064462-A1 | BY-PRODUCT MITIGATION IN THROUGH-SILICON-VIA PLATING | NOVELLUS SYSTEMS, INC. | 2012-03-15 | — | — | US | disclosed |
| US-7947163-B2 | Photoresist-free metal deposition | NOVELLUS SYSTEMS, INC. (US) | 2011-05-24 | — | — | US | disclosed |
| US-7799200-B1 | Selective electrochemical accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2010-09-21 | — | — | US | disclosed |
| US-20090280649-A1 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2009-11-12 | — | — | US | disclosed |
| US-20090277867-A1 | Topography reduction and control by selective accelerator removal | NOVELLUS SYSTEMS, INC. (US) | 2009-11-12 | — | — | US | disclosed |
| US-20090277801-A1 | Photoresist-free metal deposition | NOVELLUS SYSTEMS, INC. (US) | 2009-11-12 | — | — | US | disclosed |
| US-20090280243-A1 | Photoresist-free metal deposition | NOVELLUS SYSTEMS, INC. (US) | 2009-11-12 | — | — | US | disclosed |
| US-7560016-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2009-07-14 | — | — | US | disclosed |
| US-7449098-B1 | Selective acceleration planarization: accelerator deposited on a plated surface and mechanically removed; wafer then plated in an electrolyte containing little or no accelerating additives; elimination of need to continually remove the additive from the exposed regions during plating | NOVELLUS SYSTEMS, INC. (US) | 2008-11-11 | — | — | US | disclosed |
| US-7449099-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2008-11-11 | — | — | US | disclosed |
| US-7405163-B1 | Selectively accelerated plating of metal features | NOVELLUS SYSTEMS, INC. (US) | 2008-07-29 | — | — | US | disclosed |
| CN-1165483-A | Composition of cisplatin and 2,2' -dithio-bis (ethanesulfonate) (dimercaptoethanesulfonic acid sodium salt) | BIONUMEIK PHARMACEUTICALS INC (US) | 1997-11-19 | — | — | CN | disclosed |
| CN-1165483-A | Composition of cisplatin and 2,2' -dithio-bis (ethanesulfonate) (dimercaptoethanesulfonic acid sodium salt) | BIONUMEIK PHARMACEUTICALS INC (US) | 1997-11-19 | — | — | CN | disclosed |