Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.57 |
| ▸ | MEN1 | O00255 | 3/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.46 |
| ▸ | POLB | P06746 | 2/20 | 0.44 |
| ▸ | ADRA2C | P18825 | 1/20 | 0.37 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.36 |
| ▸ | LMNA | P02545 | 3/20 | 0.36 |
| ▸ | ESRRG | P62508 | 1/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.35 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.35 |
| ▸ | MAOA | P21397 | 1/20 | 0.35 |
| ▸ | RAB9A | P51151 | 1/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.34 |
| ▸ | MAPT | P10636 | 1/20 | 0.34 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.34 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.34 |
| ▸ | SLC22A8 | Q8TCC7 | 1/20 | 0.34 |
| ▸ | PHLPP2 | Q6ZVD8 | 1/20 | 0.34 |
| ▸ | MLYCD | O95822 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9509046 | 0.79 | TSHR (0.73) | TSHRMEN1KMT2APOLBADRA2C | |
| SCHEMBL28637636 | 0.78 | TSHR (0.70) | TSHRMEN1KMT2APOLBADRA2C | |
| SCHEMBL6909361 | 0.77 | MEN1 (0.47) | TSHRMEN1KMT2APOLBADRA2C | |
| SCHEMBL18455023 | 0.75 | EGFR (0.46) | TSHRADRA2CALDH1A1LMNACYP1A2 | |
| SCHEMBL9176209 | 0.72 | TSHR (0.46) | TSHRMEN1KMT2APOLBALDH1A1 | |
| SCHEMBL4921797 | 0.72 | ALDH1A1 (0.43) | TSHRMEN1KMT2APOLBSMN1; SMN2 | |
| SCHEMBL18147489 | 0.71 | CYP3A4 (0.46) | TSHRMEN1KMT2APOLBSMN1; SMN2 | |
| SCHEMBL15652475 | 0.71 | ADRA2C (0.57) | TSHRMEN1KMT2APOLBADRA2C | |
| SCHEMBL6255892 | 0.71 | ALDH1A1 (0.39) | TSHRMEN1KMT2APOLBALDH1A1 | |
| SCHEMBL127344 | 0.70 | ALDH1A1 (0.52) | TSHRMEN1KMT2AALDH1A1ESRRG |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7631768-B2 | Membrane and associated method | GENERAL ELECTRIC COMPANY (US) | 2009-12-15 | — | — | US | disclosed |
| WO-2008083258-A1 | POLYIMIDE/COPOLYIMIDE FILMS WITH LOW GLASS TRANSITION TEMPERATURE FOR USE AS HOT MELT ADHESIVES | ADAPTIVENERGY, LLC. (US) | 2008-07-10 | — | — | WO | disclosed |
| US-7291696-B2 | Composition and associated method | GENERAL ELECTRIC COMPANY (US) | 2007-11-06 | — | — | US | disclosed |
| US-20070106052-A1 | Composition and associated method | GENERAL ELECTRIC COMPANY (US) | 2007-05-10 | — | — | US | disclosed |
| US-20070102349-A1 | Membrane and associated method | GENERAL ELECTRIC COMPANY (US) | 2007-05-10 | — | — | US | disclosed |
| US-7147920-B2 | Backing, adhesive layer, and protective member, where the adhesive layer comprises a phenolic hydroxyl radical-bearing polyimide resin, an epoxy resin, and an epoxy resin curing agent; improved adhesion, heat resistance, low modulus of elasticity | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-12-12 | — | — | US | disclosed |
| US-7060786-B2 | Comprises epoxy resins and polyimides; for printed circuits and semiconductor packages | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2006-06-13 | — | — | US | disclosed |
| US-6949619-B2 | Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2005-09-27 | — | — | US | disclosed |
| US-6808819-B2 | POLYIMIDE RESIN, EPOXY RESIN-CURING CATALYST, AND AN EPOXY RESIN | SHIN ETSU CHEMICAL CO., LTD. (JP) | 2004-10-26 | — | — | US | disclosed |
| US-20040105990-A1 | Wafer dicing/die bonding sheet | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-06-03 | — | — | US | disclosed |
| US-20040019174-A1 | Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2004-01-29 | — | — | US | disclosed |
| US-20030220455-A1 | Comprises epoxy resins and polyimides; for printed circuits and semiconductor packages | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-11-27 | — | — | US | disclosed |
| US-20030158350-A1 | Heat resistant resin composition and adhesive film | SHIN-ETSU CHEMICAL CO., LTD. (JP) | 2003-08-21 | — | — | US | disclosed |