SCHEMBL4566904

SCHEMBL4566904

NC(=O)c1ccc2c(c1C(N)=O)CCCCCC2

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HSD17B10 Q99714 5/20 0.41
MAPT P10636 5/20 0.41
KDM4E B2RXH2 5/20 0.41
ALDH1A1 P00352 5/20 0.41
ALOX15 P16050 4/20 0.41
MEN1 O00255 4/20 0.41
KMT2A Q03164 4/20 0.41
MAPK1 P28482 3/20 0.41
HPGD P15428 3/20 0.41
CASP1 P29466 2/20 0.39
CASP7 P55210 2/20 0.39
USP2 O75604 1/20 0.39
METAP2 P50579 3/20 0.38
NPC1 O15118 5/20 0.37
RAB9A P51151 5/20 0.37
LMNA P02545 3/20 0.37
SMN1; SMN2 Q16637 3/20 0.37
NFKB1 P19838 1/20 0.37
NFKB2 Q00653 1/20 0.37
RELA Q04206 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6436615 1.00 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL8864195 0.86 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL18489764 0.86 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL10942539 0.86 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL36051 0.86 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL918600 0.86 HSD17B10 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL6052857 0.84 HSD17B10 (0.40) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL472840 0.84 MAPT (0.40) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL368712 0.80 BCL2L1 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15
SCHEMBL5810242 0.80 FLT3 (0.41) HSD17B10MAPTKDM4EALDH1A1ALOX15

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-5230205-A None JP disclosed
JP-6271769-A None JP disclosed
WO-2015066138-A1 FLAME RETARDANT THERMOPLASTIC POLYMER COMPOSITIONS DOW CORNING CORPORATION (US) 2015-05-07 WO disclosed
EP-0973609-B1 POLYMER COMPOSITES AND METHODS FOR MAKING AND USING SAME INTEGUMENT TECHNOLOGIES INC (US) 2009-04-15 EP disclosed
US-20080131609-A1 Methods and materials for reducing damage from environmental electromagnetic effects VARGO TERRENCE G 2008-06-05 US disclosed
EP-1467395-B1 FUSE FOR AUTOMOBILE YAZAKI CORP (JP) 2008-05-21 EP disclosed
US-7223312-B2 Methods and materials for reducing damage from environmental electromagnetic effects INTEGUMENT TECHNOLOGIES, INC. (US) 2007-05-29 US disclosed
US-7217754-B2 For use as photo-/electromagnetic- radiation shields/filters, antistatic layers, antifouling coatings, electrodes, in flame/heat retardant materials, construction materials, electrolytic/fuel cells, and optoelectronic devices INTEGUMENT TECHNOLOGIES, INC. (US) 2007-05-15 US disclosed
US-20050150596-A1 Methods and materials for reducing damage from environmental electromagnetic effects VARGO TERRENCE G (US) 2005-07-14 US disclosed
US-20050059767-A1 Fuse for automobile TORAY INDUSTRIES, INC. (JP) 2005-03-17 US disclosed
EP-0719299-A1 ADHESIVE PASTE CONTAINING POLYMERIC RESIN DIEMAT, INC. (US) 1996-07-03 EP disclosed
US-5488082-A BONDING HIGH DENSITY, MICROCIRCUIT ELECTRONICS DIEMAT, INC. (US) 1996-01-30 US disclosed
EP-0662102-A1 PROCESS FOR MAKING POLYMERIC INORGANIC-ORGANIC COMPOSITIONS. DU PONT (US) 1995-07-12 EP disclosed
US-5412016-A Interpenetrating polymer networks E. I. DU PONT DE NEMOURS AND COMPANY (US) 1995-05-02 US disclosed
US-5391604-A A blends consisting of a metal filler, a volatile liquid as a carriers for dispensing through dies, small thermoplastic resins particle forming a void-free bonding; high bonding strength, thermoplastic resin can be reuseable DIEMAT, INC. (US) 1995-02-21 US disclosed
WO-1995004786-A2 ADHESIVE PASTE CONTAINING POLYMERIC RESIN DIEMAT, INC. (US) 1995-02-16 WO disclosed
JP-H06271769-A PRODUCTION OF POLYAMIDE RESIN COMPOSITION TORAY IND INC 1994-09-27 JP disclosed
WO-1994007947-A1 PROCESS FOR MAKING POLYMERIC INORGANIC-ORGANIC COMPOSITIONS E.I. DU PONT DE NEMOURS AND COMPANY (US) 1994-04-14 WO disclosed
JP-H05230205-A PRODUCTION OF POLYAMIDE RESIN TORAY IND INC 1993-09-07 JP disclosed
US-4486507-A FOOD PACKAGING FELDMUHLE AKTIENGESELLSCHAFT (DE) 1984-12-04 US disclosed