SCHEMBL4570340

SCHEMBL4570340

C=CCOC1CCC(C(C)(C)CC2CCCC(C(C)(C)C3CCC(OCC=C)CC3)C2)CC1

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
EPHX2 P34913 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12311623 0.87 EPHX2 (0.35) EPHX2
SCHEMBL4570341 0.81 EPHX2 (0.37) EPHX2
SCHEMBL1981954 0.81 EPHX2 (0.37) EPHX2
SCHEMBL580205 0.72 MEN1 (0.41) EPHX2
SCHEMBL10871408 0.72 MEN1 (0.41) EPHX2
SCHEMBL16510824 0.69 ALDH1A1 (0.46) EPHX2
SCHEMBL13914720 0.68 THRA (0.33) EPHX2
SCHEMBL3945815 0.68
SCHEMBL472084 0.68 EPHX2 (0.44) EPHX2
SCHEMBL3933914 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20120123054-A1 CURABLE COMPOSITION, HEAT CONDUCTIVE RESIN MOLDED PRODUCT AND SEMICONDUCTOR PACKAGE KANEKA CORPORATION (JP) 2012-05-17 US disclosed
US-20120123054-A1 CURABLE COMPOSITION, HEAT CONDUCTIVE RESIN MOLDED PRODUCT AND SEMICONDUCTOR PACKAGE KANEKA CORPORATION (JP) 2012-05-17 US disclosed