⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2273757 | 0.65 | — | — | |
| SCHEMBL31722613 | 0.65 | — | — | |
| SCHEMBL8599018 | 0.62 | — | — | |
| SCHEMBL9247209 | 0.60 | — | — | |
| SCHEMBL5150467 | 0.60 | — | — | |
| SCHEMBL1150332 | 0.60 | — | — | |
| SCHEMBL1472264 | 0.60 | — | — | |
| SCHEMBL31722300 | 0.60 | — | — | |
| SCHEMBL10560645 | 0.58 | — | — | |
| SCHEMBL8632646 | 0.58 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180311622-A1 | PURIFICATION METHOD FOR PURIFYING LIQUID, PURIFICATION METHOD FOR PURIFYING SILICON COMPOUND-CONTAINING LIQUID, METHOD FOR PRODUCING SILYLATING AGENT LIQUID, FILM FORMING MATERIAL OR DIFFUSING AGENT COMPOSITION, FILTER MEDIUM AND FILTER DEVICE | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-11-01 | — | — | US | disclosed |
| US-20180254182-A1 | SURFACE TREATMENT METHOD AND SURFACE TREATMENT LIQUID | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-09-06 | — | — | US | disclosed |
| US-9868090-B2 | Process for preparing chemical liquid of silylating agent and surface treatment method | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-01-16 | — | — | US | disclosed |
| US-9796879-B2 | Film-forming material | TOKYO OHKA KOGYO CO., LTD. (JP) | 2017-10-24 | — | — | US | disclosed |
| US-20160279578-A1 | PROCESS FOR PREPARING CHEMICAL LIQUID OF SILYLATING AGENT AND SURFACE TREATMENT METHOD | TOKYO OHKA KOGYO CO., LTD. (JP) | 2016-09-29 | — | — | US | disclosed |
| US-20150044858-A1 | FILM-FORMING MATERIAL | TOKYO OHKA KOGYO CO., LTD. (JP) | 2015-02-12 | — | — | US | disclosed |
| US-8263430-B2 | Capping layer formation onto a dual damescene interconnect | NXP B.V. (NL) | 2012-09-11 | — | — | US | disclosed |
| US-20080242110-A1 | Capping Layer Formation Onto a Dual Damescene Interconnect | NXP B.V. (NL) | 2008-10-02 | — | — | US | disclosed |