SCHEMBL4584939

SCHEMBL4584939

C=CCn1c(=O)n(CC=C)c(=O)n(Cc2ccccc2)c1=O

nearest known ligand 0.61

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 2/20 0.61
ADORA3 P0DMS8 3/20 0.56
ADORA2A P29274 1/20 0.56
ADORA1 P30542 1/20 0.56
GSK3A P49840 3/20 0.50
GSK3B P49841 3/20 0.50
KDM4E B2RXH2 2/20 0.50
MAPT P10636 1/20 0.50
L3MBTL1 Q9Y468 3/20 0.46
CYP1A2 P05177 1/20 0.46
CYP2D6 P10635 1/20 0.46
PKM P14618 1/20 0.46
CCNB2 O95067 1/20 0.46
CDK1 P06493 1/20 0.46
CCNB1 P14635 1/20 0.46
CCNB3 Q8WWL7 1/20 0.46
P2RX4 Q99571 1/20 0.46
SMN1; SMN2 Q16637 1/20 0.46
F2 P00734 1/20 0.45
PLG P00747 1/20 0.45

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2946378 1.00 CYP3A4 (0.61) CYP3A4ADORA3ADORA2AADORA1GSK3A
SCHEMBL11033311 0.90 CYP3A4 (0.70) CYP3A4ADORA3ADORA2AADORA1KDM4E
SCHEMBL1284803 0.85 CYP3A4 (0.61) CYP3A4ADORA3ADORA2AADORA1KDM4E
SCHEMBL8985073 0.83 GSK3B (0.67) CYP3A4GSK3AGSK3BKDM4EMAPT
SCHEMBL17154512 0.81 CYP3A4 (0.57) CYP3A4ADORA3ADORA2AADORA1GSK3A
SCHEMBL31122814 0.80 ADORA3 (0.46) CYP3A4ADORA3ADORA2AADORA1KDM4E
SCHEMBL5049130 0.79 CYP3A4 (0.59) CYP3A4GSK3AGSK3BKDM4EMAPT
SCHEMBL28662 0.78 CYP3A4 (1.00) CYP3A4ADORA3ADORA2AKDM4EMAPT
SCHEMBL29507760 0.78 CYP3A4 (0.62) CYP3A4KDM4EL3MBTL1SMN1; SMN2LMNA
SCHEMBL6695468 0.78 CYP3A4 (0.62) CYP3A4KDM4EL3MBTL1SMN1; SMN2LMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-111819254-B Curable organopolysiloxane composition, sealant, and semiconductor device 瓦克化学股份公司 2022-06-10 CN disclosed
US-20210253858-A1 CURABLE ORGANOPOLYSILOXANE COMPOSITION, ENCAPSULANT, AND SEMICONDUCTOR DEVICE WACKER CHEMIE AG (DE) 2021-08-19 US disclosed
CN-111819254-A Curable organopolysiloxane composition, sealant, and semiconductor device 瓦克化学股份公司 2020-10-23 CN disclosed
US-10800952-B2 Curable resin composition, fuel cell, and sealing method THREEBOND CO., LTD. (JP) 2020-10-13 US disclosed
US-20200172770-A1 CURABLE RESIN COMPOSITION, FUEL CELL, AND SEALING METHOD THREEBOND CO., LTD. (JP) 2020-06-04 US disclosed
EP-3428229-A1 CURABLE RESIN COMPOSITION, FUEL CELL, AND SEALING METHOD Threebond Co., Ltd. (JP) 2019-01-16 EP disclosed
EP-1803761-B1 Ring-opened copolymer, hydrogenated ring-opened copolymer, process for producing thereof, and compositions ZEON CORP (JP) 2016-04-27 EP disclosed
US-7785715-B2 Compound with at least two carbon-carbon double bonds such as triallyl isocyanurate; compound with SiH groups such as reaction product of 1,3,5,7 tetramethylcyclotetrasiloxane and triallyl isocyanurate; coupler; and not less than 5% by weight of rutile TiO2 KANEKA CORPORATION (JP) 2010-08-31 US disclosed
US-7785715-B2 Compound with at least two carbon-carbon double bonds such as triallyl isocyanurate; compound with SiH groups such as reaction product of 1,3,5,7 tetramethylcyclotetrasiloxane and triallyl isocyanurate; coupler; and not less than 5% by weight of rutile TiO2 KANEKA CORPORATION (JP) 2010-08-31 US disclosed
EP-1408064-B1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS ZEON CORP (JP) 2008-07-30 EP disclosed
US-20040152843-A1 Open-ring copolymer, hydrogenated open-ring copolymer, process for production of both, and compositions ZEON CORPORATION (JP) 2004-08-05 US disclosed
EP-1408064-A1 OPEN-RING COPOLYMER, HYDROGENATED OPEN-RING COPOLYMER, PROCESSES FOR PRODUCTION OF BOTH, AND COMPOSITIONS Zeon Corporation (JP) 2004-04-14 EP disclosed
US-20040029043-A1 Process for producing circuit substrates ZEON CORPORATION (JP) 2004-02-12 US disclosed
US-20040025743-A1 Curable composition, varnish, and layered product ZEON CORPORATION (JP) 2004-02-12 US disclosed
US-20030146421-A1 Curable composition and multilayered circuit substrate ZEON CORPORATION (JP) 2003-08-07 US disclosed
EP-1275695-A1 CURABLE COMPOSITION AND MULTILAYERED CIRCUIT SUBSTRATE Zeon Corporation (JP) 2003-01-15 EP disclosed
EP-0391163-B1 Adherent silicone coating GEN ELECTRIC (US) 1995-03-08 EP disclosed
EP-0391163-A2 Adherent silicone coating GENERAL ELECTRIC COMPANY (US) 1990-10-10 EP disclosed
US-4943601-A Coating with improved adhesion GENERAL ELECTRIC COMPANY (US) 1990-07-24 US disclosed
US-4340710-A ETHYLENICALLY UNSATURATED ISOCYANURATE AND DIALKYL ACETYLENEDICARBOXYLATE STABILIZERS TO INHIBIT PREMATURE GELATION GENERAL ELECTRIC COMPANY (US) 1982-07-20 US disclosed