SCHEMBL459189

SCHEMBL459189

CCCCCCCCOOC(C)(C)C

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 2/20 0.40
TSHR P16473 1/20 0.40
MEN1 O00255 1/20 0.38
HTT P42858 1/20 0.38
KMT2A Q03164 1/20 0.38
MAPT P10636 1/20 0.38
CA1 P00915 8/20 0.37
CA2 P00918 8/20 0.37
CA9 Q16790 7/20 0.37
LPAR3 Q9UBY5 6/20 0.37
LPAR2 Q9HBW0 5/20 0.37
CA12 O43570 3/20 0.37
CA7 P43166 3/20 0.37
CA14 Q9ULX7 3/20 0.37
LPAR1 Q92633 2/20 0.37
CA3 P07451 2/20 0.37
CA4 P22748 2/20 0.37
CA6 P23280 2/20 0.37
CA5A P35218 2/20 0.37
CA5B Q9Y2D0 2/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL729055 1.00 THRB (0.40) THRBTSHRMEN1HTTKMT2A
SCHEMBL11685264 1.00 THRB (0.40) THRBTSHRMEN1HTTKMT2A
SCHEMBL15134959 1.00 THRB (0.40) THRBTSHRMEN1HTTKMT2A
SCHEMBL30283066 0.98 THRB (0.38) THRBTSHRMEN1HTTKMT2A
Methane SCHEMBL28202449 0.98 THRB (0.38) THRBTSHRMEN1HTTKMT2A
SCHEMBL2049836 0.97 TSHR (0.35) THRBTSHRMEN1HTTKMT2A
Isobutane SCHEMBL29114821 0.93 DNM1 (0.36) THRBTSHRMEN1HTTKMT2A
Tert-Butyl Hydroperoxide SCHEMBL27315936 0.91 TSHR (0.38) THRBTSHRMEN1HTTKMT2A
SCHEMBL28108189 0.90 TSHR (0.40) THRBTSHRMEN1HTTKMT2A
SCHEMBL297927 0.90 ADRB2 (0.39) THRBTSHRCA1CA2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 378 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119798573-A Phosphorus-containing polyphenyl ether resin composition, prepreg and laminated board containing same 广东生益科技股份有限公司 2025-04-11 CN claimed
CN-111372372-B Circuit material and circuit board comprising same 广东生益科技股份有限公司 2023-12-22 CN claimed
CN-111253702-B Resin composition, prepreg and circuit material using same 广东生益科技股份有限公司 2023-06-06 CN claimed
CN-112724640-B Thermosetting resin composition, prepreg using same and copper-clad laminate 广东生益科技股份有限公司 2022-09-16 CN claimed
CN-111116814-B Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2022-08-30 CN claimed
CN-114058127-A Clean and moist membrane adhesive tape and preparation method and application thereof 苏州赛伍应用技术股份有限公司 2022-02-18 CN claimed
CN-112625180-B Uvioresistant microsphere, preparation method and application 江南大学 2021-12-03 CN claimed
CN-113383030-A Cationically curable composition 3M创新有限公司 2021-09-10 CN claimed
CN-112724640-A Thermosetting resin composition, prepreg using same and copper-clad laminate 广东生益科技股份有限公司 2021-04-30 CN claimed
CN-112625180-A Uvioresistant microsphere, preparation method and application 江南大学 2021-04-09 CN claimed
CN-106660953-B High heat resistant monomers and methods of use thereof 沙特基础工业全球技术有限公司 2020-07-28 CN claimed
CN-211083289-U Prefabricated direct-burried insulating tube with outer pillar of winding type 山东东宏管业股份有限公司 2020-07-24 CN claimed
CN-111393724-A Resin composition, and prepreg and circuit material using same 广东生益科技股份有限公司 2020-07-10 CN claimed
CN-111372372-A Circuit material and circuit board comprising same 广东生益科技股份有限公司 2020-07-03 CN claimed
CN-111253888-A Circuit material and circuit board comprising same 广东生益科技股份有限公司 2020-06-09 CN claimed
CN-111253702-A Resin composition, and prepreg and circuit material using same 广东生益科技股份有限公司 2020-06-09 CN claimed
CN-111116814-A Prepolymer, method of making, resin composition, and articles thereof 台光电子材料(昆山)有限公司 2020-05-08 CN claimed
CN-110922536-A Pre-polymerized resin and application thereof 台光电子材料(昆山)有限公司 2020-03-27 CN claimed
CN-101772540-A Polyethylene film with improved bubble stability FINA TECHNOLOGY 2010-07-07 CN claimed
US-7638053-B2 crosslinked addition-condensation copolymer contains a polyester endcapped with a vinyl polymerized compound such as acrylic acid, methacrylic acid; use in petroleum industry pervaporation technology to reduce energy costs; stability; for separation of aromatic hydrocarbon from aliphatic hydrocarbon GENERAL ELECTRIC COMPANY (US) 2009-12-29 US claimed