Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LPL | P06858 | 2/20 | 0.41 |
| ▸ | LIPG | Q9Y5X9 | 2/20 | 0.41 |
| ▸ | THRB | P10828 | 2/20 | 0.39 |
| ▸ | THRA | P10827 | 1/20 | 0.39 |
| ▸ | CA2 | P00918 | 1/20 | 0.38 |
| ▸ | MGLL | Q99685 | 1/20 | 0.36 |
| ▸ | PLK1 | P53350 | 1/20 | 0.36 |
| ▸ | NISCH | Q9Y2I1 | 1/20 | 0.36 |
| ▸ | HTR1D | P28221 | 1/20 | 0.36 |
| ▸ | SPHK2 | Q9NRA0 | 4/20 | 0.36 |
| ▸ | SPHK1 | Q9NYA1 | 3/20 | 0.36 |
| ▸ | SLC5A1 | P13866 | 1/20 | 0.35 |
| ▸ | SLC5A2 | P31639 | 1/20 | 0.35 |
| ▸ | CNR1 | P21554 | 1/20 | 0.35 |
| ▸ | CNR2 | P34972 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9843341 | 0.87 | MEN1 (0.39) | THRBTHRAMGLL | |
| SCHEMBL131333 | 0.84 | TDP1 (0.38) | MGLL | |
| SCHEMBL3065497 | 0.83 | TP53 (0.39) | LPLLIPGCA2 | |
| SCHEMBL9061429 | 0.83 | MEN1 (0.44) | THRBTHRAMGLLSPHK2SPHK1 | |
| Methylamine SCHEMBL27872059 | 0.82 | SLC6A2 (0.37) | MGLL | |
| SCHEMBL8781210 | 0.79 | MEN1 (0.39) | MGLL | |
| SCHEMBL19111959 | 0.78 | MEN1 (0.41) | — | |
| SCHEMBL1445116 | 0.78 | MEN1 (0.41) | — | |
| SCHEMBL13990310 | 0.78 | MGLL (0.42) | MGLL | |
| SCHEMBL708540 | 0.78 | MGLL (0.38) | MGLL |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 63 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-103987763-B | Heat-staple low-birefringence copolyimide film | 阿克伦聚合物体系有限公司 | 2017-12-29 | — | — | CN | claimed |
| CN-108449868-B | Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | ＪＸ金属株式会社 | 2022-08-16 | — | — | CN | disclosed |
| CN-108696987-B | Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | ＪＸ金属株式会社 | 2021-11-30 | — | — | CN | disclosed |
| CN-108697006-B | Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | ＪＸ金属株式会社 | 2021-07-16 | — | — | CN | disclosed |
| CN-108156769-B | Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | ＪＸ金属株式会社 | 2021-05-28 | — | — | CN | disclosed |
| CN-108696986-B | Surface-treated copper foil, copper foil with carrier, laminate, method for manufacturing printed wiring board, and method for manufacturing electronic device | ＪＸ金属株式会社 | 2021-01-01 | — | — | CN | disclosed |
| CN-105813378-B | Copper foil with carrier, laminate, printed wiring board, electronic device, and method for manufacturing printed wiring board | ＪＸ金属株式会社 | 2020-04-24 | — | — | CN | disclosed |
| CN-110863221-A | Copper foil with carrier | JX日矿日石金属株式会社 | 2020-03-06 | — | — | CN | disclosed |
| CN-108588766-B | Copper foil with carrier | JX日矿日石金属株式会社 | 2020-02-18 | — | — | CN | disclosed |
| CN-106413267-B | The manufacturing method of Copper foil with carrier, laminate, the manufacturing method of printing distributing board and electronic equipment | ＪＸ金属株式会社 | 2019-07-05 | — | — | CN | disclosed |
| CN-101103138-A | Metal film and method for forming metal film | FUJIFILM CORP (JP) | 2008-01-09 | — | — | CN | disclosed |
| EP-1871826-A1 | SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2008-01-02 | — | — | EP | disclosed |
| CN-1311719-C | Printed wiring board and method for manufacturing the same | HITACHI CHEMICAL CO LTD (JP) | 2007-04-18 | — | — | CN | disclosed |
| CN-1933702-A | Forming method for resin layer of metal layer, printed wiring board and its manufacturing method | HITACHI CHEMICAL CO LTD (JP) | 2007-03-21 | — | — | CN | disclosed |
| WO-2006104279-A1 | SURFACE GRAFT MATERIAL AND ITS MANUFACTURING METHOD, ELECTRICALLY CONDUCTIVE MATERIAL AND ITS MANUFACTURING METHOD, AND ELECTRICALLY CONDUCTIVE PATTERN MATERIAL | FUJIFILM CORPORATION (JP) | 2006-10-05 | — | — | WO | disclosed |
| EP-1698218-A1 | METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME | FUJI PHOTO FILM CO., LTD. (JP) | 2006-09-06 | — | — | EP | disclosed |
| CN-1662120-A | Adhesion-assisting agent-bearing metal foil, printed wiring board, and method for producing same | HITACHI CHEMICAL CO LTD (JP) | 2005-08-31 | — | — | CN | disclosed |
| WO-2005053368-A1 | METAL PATTERN FORMING METHOD, METAL PATTERN OBTAINED BY THE SAME, PRINTED WIRING BOARD, CONDUCTIVE FILM FORMING METHOD, AND CONDUCTIVE FILM OBTAINED BY THE SAME | FUJI PHOTO FILM CO., LTD. (JP) | 2005-06-09 | — | — | WO | disclosed |
| CN-1617651-A | Method for forming resin layer of metal layer, printed wiring board, and method for manufacturing printed wiring board | HITACHI CHEMICAL CO LTD (JP) | 2005-05-18 | — | — | CN | disclosed |
| US-3957873-A | PERACETIC ACID OXIDATION OF AMINES TO AMINE OXIDES | CELANESE CORPORATION (US) | 1976-05-18 | — | — | US | disclosed |