SCHEMBL4595696

SCHEMBL4595696

O=CN(C=O)c1ccc(C(=O)c2ccccc2)cc1

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
RAB9A P51151 4/20 0.60
HPGD P15428 4/20 0.60
NPC1 O15118 2/20 0.60
ALDH1A1 P00352 6/20 0.56
SRD5A2 P31213 2/20 0.54
TDP1 Q9NUW8 2/20 0.48
L3MBTL1 Q9Y468 2/20 0.48
ATM Q13315 1/20 0.48
MEN1 O00255 3/20 0.47
KMT2A Q03164 3/20 0.47
MAPT P10636 2/20 0.47
LMNA P02545 2/20 0.47
MAPK13 O15264 1/20 0.47
MAPK12 P53778 1/20 0.47
MAPK11 Q15759 1/20 0.47
MAPK14 Q16539 1/20 0.47
ELANE P08246 2/20 0.44
MAPK1 P28482 1/20 0.43
CES2 O00748 1/20 0.43
CES1 P23141 1/20 0.43

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11729911 0.81 TSHR (0.55) NPC1ALDH1A1SRD5A2MEN1KMT2A
Methane SCHEMBL14551335 0.79 TSHR (0.52) NPC1ALDH1A1SRD5A2MEN1KMT2A
SCHEMBL13781106 0.79 HPGD (0.69) RAB9AHPGDNPC1ALDH1A1SRD5A2
SCHEMBL7978097 0.78 ALDH1A1 (0.42) RAB9AHPGDNPC1ALDH1A1TDP1
SCHEMBL314267 0.78 ALDH1A1 (0.93) RAB9AHPGDNPC1ALDH1A1SRD5A2
SCHEMBL9066312 0.78 ALDH1A1 (0.93) RAB9AHPGDNPC1ALDH1A1SRD5A2
SCHEMBL329499 0.77 RAB9A (0.67) RAB9AHPGDNPC1ALDH1A1SRD5A2
Benzophenone SCHEMBL9307786 0.77 ALDH1A1 (0.64) RAB9AHPGDNPC1ALDH1A1SRD5A2
SCHEMBL8684872 0.77 RAB9A (0.67) RAB9AHPGDNPC1ALDH1A1SRD5A2
SCHEMBL28038079 0.75 ALDH1A1 (0.40) RAB9AHPGDNPC1ALDH1A1TDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 37 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-114930211-B Method for manufacturing polarizing film 日东电工株式会社 2024-10-29 CN disclosed
CN-112444906-B Method for manufacturing polarizing film 日东电工株式会社 2024-07-26 CN disclosed
CN-112444904-B Method for manufacturing polarizing film 日东电工株式会社 2024-07-02 CN disclosed
CN-110753881-B Alkali-developable photosensitive resin composition, dry film, cured product, and printed wiring board 太阳控股株式会社 2024-06-21 CN disclosed
CN-114561172-B Adhesive composition for polarizing film, optical film, and image display device 日东电工株式会社 2024-02-06 CN disclosed
WO-2023132214-A1 CURABLE COMPOSITION AND CURED PRODUCT 株式会社カネカ 2023-07-13 WO disclosed
CN-113518671-B Method for manufacturing polarizing film 日东电工株式会社 2023-05-09 CN disclosed
CN-113543897-B Method for producing polarizing film 日东电工株式会社 2023-04-18 CN disclosed
CN-115867836-A Polarizing film, optical film and image display device 日东电工株式会社 2023-03-28 CN disclosed
CN-114930211-A Method for producing polarizing film 日东电工株式会社 2022-08-19 CN disclosed
CN-111149026-A Laminated optical film, method for producing same, and image display device 日东电工株式会社 2020-05-12 CN disclosed
US-20200095370-A1 CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION KANEKA CORPORATION (JP) 2020-03-26 US disclosed
US-20200056051-A1 CURABLE RESIN COMPOSITION FOR OPTICAL FILMS, OPTICAL FILM AND METHOD FOR PRODUCING SAME NITTO DENKO CORPORATION (JP) 2020-02-20 US disclosed
CN-110753881-A Alkali development type photosensitive resin composition, dry film, cured product and printed wiring board 太阳油墨制造株式会社 2020-02-04 CN disclosed
CN-110651336-A Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition 株式会社钟化 2020-01-03 CN disclosed
US-9298096-B2 Curable resin composition, cured product thereof, printed circuit board comprising the same, and method for producing the cured product TAIYO INK MFG. CO., LTD. (JP) 2016-03-29 US disclosed
US-9188871-B2 Pattern forming method, alkali-developable thermosetting resin composition, printed circuit board and manufacturing method thereof TAIYO INK MFG. CO., LTD. (JP) 2015-11-17 US disclosed
US-20150010735-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT THEREOF, PRINTED CIRCUIT BOARD COMPRISING THE SAME, AND METHOD FOR PRODUCING THE CURED PRODUCT TAIYO INK MFG. CO., LTD. (JP) 2015-01-08 US disclosed
US-20140034371-A1 PATTERN FORMING METHOD, ALKALI-DEVELOPABLE THERMOSETTING RESIN COMPOSITION, PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF TAIYO INK MFG. CO., LTD. (JP) 2014-02-06 US disclosed
EP-1597326-B1 RADIOHARDENABLE PRINTING MEDIA, TRANSFER PICTURES PRODUCED THEREWITH, AND METHOD FOR PRODUCING CERAMIC DECORATIONS FERRO GMBH (DE) 2008-01-02 EP disclosed